JPS58501372A - 半導体デバイス及び半導体ダイをセラミックベースに接着させる方法 - Google Patents

半導体デバイス及び半導体ダイをセラミックベースに接着させる方法

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Publication number
JPS58501372A
JPS58501372A JP57502545A JP50254582A JPS58501372A JP S58501372 A JPS58501372 A JP S58501372A JP 57502545 A JP57502545 A JP 57502545A JP 50254582 A JP50254582 A JP 50254582A JP S58501372 A JPS58501372 A JP S58501372A
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JP
Japan
Prior art keywords
glass
foil
die
base
yield strength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57502545A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0340939B2 (enrdf_load_stackoverflow
Inventor
デービス，アール　ケー
ドライ，ジエイムズ　イー
リード，デピツド　エル
Original Assignee
モトロ−ラ・インコ−ポレ−テツド
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Application filed by モトロ−ラ・インコ−ポレ−テツド filed Critical モトロ−ラ・インコ−ポレ−テツド
Publication of JPS58501372A publication Critical patent/JPS58501372A/ja
Publication of JPH0340939B2 publication Critical patent/JPH0340939B2/ja
Granted legal-status Critical Current

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    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
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    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • C03C8/245—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders containing more than 50% lead oxide, by weight
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structural Engineering (AREA)
  • Glass Compositions (AREA)
  • Die Bonding (AREA)
  • Ceramic Products (AREA)
JP57502545A 1981-09-01 1982-07-26 半導体デバイス及び半導体ダイをセラミックベースに接着させる方法 Granted JPS58501372A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29843581A 1981-09-01 1981-09-01
US298435 1981-09-01

Publications (2)

Publication Number Publication Date
JPS58501372A true JPS58501372A (ja) 1983-08-18
JPH0340939B2 JPH0340939B2 (enrdf_load_stackoverflow) 1991-06-20

Family

ID=23150501

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57502545A Granted JPS58501372A (ja) 1981-09-01 1982-07-26 半導体デバイス及び半導体ダイをセラミックベースに接着させる方法

Country Status (3)

Country Link
EP (1) EP0086812A4 (enrdf_load_stackoverflow)
JP (1) JPS58501372A (enrdf_load_stackoverflow)
WO (1) WO1983000949A1 (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5224001A (en) * 1989-11-29 1993-06-29 Matsushita Electric Industrial Co., Ltd. Magnetic head
JP2015038507A (ja) * 2008-12-05 2015-02-26 アレグロ・マイクロシステムズ・エルエルシー 磁場センサおよび磁場センサを製造する方法
US9411025B2 (en) 2013-04-26 2016-08-09 Allegro Microsystems, Llc Integrated circuit package having a split lead frame and a magnet
US9494660B2 (en) 2012-03-20 2016-11-15 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US9666788B2 (en) 2012-03-20 2017-05-30 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US10230006B2 (en) 2012-03-20 2019-03-12 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with an electromagnetic suppressor
US11828819B2 (en) 2012-03-20 2023-11-28 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with integral ferromagnetic material

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4929516A (en) * 1985-03-14 1990-05-29 Olin Corporation Semiconductor die attach system
GB8818957D0 (en) * 1988-08-10 1988-09-14 Marconi Electronic Devices Semiconductor devices
DE4132947C2 (de) * 1991-10-04 1998-11-26 Export Contor Ausenhandelsgese Elektronische Schaltungsanordnung
JP7394642B2 (ja) 2020-01-31 2023-12-08 哲生 畑中 心電解析システム
IT202100021056A1 (it) * 2021-08-04 2023-02-04 B Max S R L Materiale accoppiato anti taglio e prodotti cosi' ottenuti
IT202300010029A1 (it) * 2021-08-04 2023-02-04 B-Max Srl Parete anti taglio

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL66619C (enrdf_load_stackoverflow) * 1943-04-06
US3489845A (en) * 1965-12-22 1970-01-13 Texas Instruments Inc Ceramic-glass header for a semiconductor device
US3413187A (en) * 1966-03-31 1968-11-26 Bell Telephone Labor Inc Glass bonding medium for ultrasonic devices
US3405224A (en) * 1966-04-20 1968-10-08 Nippon Electric Co Sealed enclosure for electronic device
US3586522A (en) * 1967-06-01 1971-06-22 Du Pont Glass-ceramics containing baal2si208 crystalline phase
US3568012A (en) * 1968-11-05 1971-03-02 Westinghouse Electric Corp A microminiature circuit device employing a low thermal expansion binder
US3900330A (en) * 1973-03-22 1975-08-19 Nippon Electric Glass Co Zno-b' 2'o' 3'-sio' 2 'glass coating compositions containing ta' 2'o' 5 'and a semiconductor device coated with the same
US3964920A (en) * 1973-10-26 1976-06-22 Motorola, Inc. Solder glass composition and method of using same for encapsulating devices
US4073657A (en) * 1976-07-16 1978-02-14 Motorola, Inc. Glass for semiconductors
US4142203A (en) * 1976-12-20 1979-02-27 Avx Corporation Method of assembling a hermetically sealed semiconductor unit
CA1165336A (en) * 1980-07-31 1984-04-10 Robert A. Rita Non-crystallizing sealing glass composition

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5224001A (en) * 1989-11-29 1993-06-29 Matsushita Electric Industrial Co., Ltd. Magnetic head
JP2015038507A (ja) * 2008-12-05 2015-02-26 アレグロ・マイクロシステムズ・エルエルシー 磁場センサおよび磁場センサを製造する方法
US9494660B2 (en) 2012-03-20 2016-11-15 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US9666788B2 (en) 2012-03-20 2017-05-30 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US10230006B2 (en) 2012-03-20 2019-03-12 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with an electromagnetic suppressor
US10916665B2 (en) 2012-03-20 2021-02-09 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with an integrated coil
US11444209B2 (en) 2012-03-20 2022-09-13 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with an integrated coil enclosed with a semiconductor die by a mold material
US11677032B2 (en) 2012-03-20 2023-06-13 Allegro Microsystems, Llc Sensor integrated circuit with integrated coil and element in central region of mold material
US11828819B2 (en) 2012-03-20 2023-11-28 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with integral ferromagnetic material
US11961920B2 (en) 2012-03-20 2024-04-16 Allegro Microsystems, Llc Integrated circuit package with magnet having a channel
US9411025B2 (en) 2013-04-26 2016-08-09 Allegro Microsystems, Llc Integrated circuit package having a split lead frame and a magnet

Also Published As

Publication number Publication date
WO1983000949A1 (en) 1983-03-17
EP0086812A1 (en) 1983-08-31
EP0086812A4 (en) 1985-06-10
JPH0340939B2 (enrdf_load_stackoverflow) 1991-06-20

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