JPH0568801B2 - - Google Patents
Info
- Publication number
- JPH0568801B2 JPH0568801B2 JP61016271A JP1627186A JPH0568801B2 JP H0568801 B2 JPH0568801 B2 JP H0568801B2 JP 61016271 A JP61016271 A JP 61016271A JP 1627186 A JP1627186 A JP 1627186A JP H0568801 B2 JPH0568801 B2 JP H0568801B2
- Authority
- JP
- Japan
- Prior art keywords
- paste
- conductive adhesive
- silver
- powder
- low melting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1627186A JPS62176003A (ja) | 1986-01-27 | 1986-01-27 | 導電性接着ペ−スト |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1627186A JPS62176003A (ja) | 1986-01-27 | 1986-01-27 | 導電性接着ペ−スト |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62176003A JPS62176003A (ja) | 1987-08-01 |
| JPH0568801B2 true JPH0568801B2 (enrdf_load_stackoverflow) | 1993-09-29 |
Family
ID=11911879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1627186A Granted JPS62176003A (ja) | 1986-01-27 | 1986-01-27 | 導電性接着ペ−スト |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62176003A (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04269403A (ja) * | 1991-02-25 | 1992-09-25 | Nec Kagoshima Ltd | 導電性ペースト |
| WO2006061907A1 (ja) * | 2004-12-09 | 2006-06-15 | Asahi Co., Ltd | 成型金型の補修方法並びに成型金型及び成型製品 |
| JP4726803B2 (ja) * | 2004-12-09 | 2011-07-20 | 株式会社 旭 | 成型金型の補修方法、成型金型及び成型製品 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57143203A (en) * | 1981-02-27 | 1982-09-04 | Taiyo Yuden Kk | Conductive paste for forming conductive layer by baking on porcelain |
-
1986
- 1986-01-27 JP JP1627186A patent/JPS62176003A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62176003A (ja) | 1987-08-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4459166A (en) | Method of bonding an electronic device to a ceramic substrate | |
| US4401767A (en) | Silver-filled glass | |
| US4436785A (en) | Silver-filled glass | |
| US5165986A (en) | Copper conductive composition for use on aluminum nitride substrate | |
| US3440182A (en) | Copper/vanadium oxide compositions,noble metal metalizing compositions containing vanadium oxide additives,and electrical conductor elements made therewith | |
| JPS6254206B2 (enrdf_load_stackoverflow) | ||
| JPH11150135A (ja) | 熱伝導性が良好な導電性ペースト及び電子部品 | |
| JPH04152642A (ja) | 接着用ペースト | |
| GB2229388A (en) | A soldering paste for fixing semiconductors to ceramic supports. | |
| US4592794A (en) | Glass bonding method | |
| JPS5873904A (ja) | 銀充填ガラス | |
| JPH0340939B2 (enrdf_load_stackoverflow) | ||
| US4997718A (en) | Silver phosphate glass die-attach composition | |
| JP5863323B2 (ja) | 半導体装置、及び半導体装置の製造方法 | |
| US4963187A (en) | Metallizing paste for circuit board having low thermal expansion coefficient | |
| JPH0719964B2 (ja) | 銀系配線セラミック基板 | |
| JPH0568801B2 (enrdf_load_stackoverflow) | ||
| JPS61248302A (ja) | 炭化ケイ素焼結体用メタライズペ−スト | |
| US4515898A (en) | Glass bonding means and method | |
| GB2103250A (en) | Silver-filled glass | |
| US4800421A (en) | Glass bonding means and method | |
| JP2560865B2 (ja) | 半導体装置用金合金はんだペースト | |
| JPS6280907A (ja) | 導電ペ−スト | |
| JPH01317183A (ja) | 低熱膨張基板用メタライズ組成物 | |
| KR970004545B1 (ko) | 금 전도체 조성물 |