JPS62176003A - 導電性接着ペ−スト - Google Patents
導電性接着ペ−ストInfo
- Publication number
- JPS62176003A JPS62176003A JP1627186A JP1627186A JPS62176003A JP S62176003 A JPS62176003 A JP S62176003A JP 1627186 A JP1627186 A JP 1627186A JP 1627186 A JP1627186 A JP 1627186A JP S62176003 A JPS62176003 A JP S62176003A
- Authority
- JP
- Japan
- Prior art keywords
- paste
- conductive adhesive
- silver
- melting point
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001070 adhesive effect Effects 0.000 title claims description 21
- 239000000853 adhesive Substances 0.000 title claims description 20
- 239000011521 glass Substances 0.000 claims description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 12
- 238000002844 melting Methods 0.000 claims description 11
- 230000008018 melting Effects 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 6
- 239000003960 organic solvent Substances 0.000 claims description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- NPAAPVNPKGDSFN-UHFFFAOYSA-N acetic acid;2-(2-hydroxyethoxy)ethanol Chemical compound CC(O)=O.OCCOCCO NPAAPVNPKGDSFN-UHFFFAOYSA-N 0.000 claims description 2
- 239000000470 constituent Substances 0.000 claims 1
- 239000011812 mixed powder Substances 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 9
- 229910052709 silver Inorganic materials 0.000 description 9
- 239000004332 silver Substances 0.000 description 9
- 229910052737 gold Inorganic materials 0.000 description 8
- 239000010931 gold Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 238000007639 printing Methods 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- OFLYIWITHZJFLS-UHFFFAOYSA-N [Si].[Au] Chemical compound [Si].[Au] OFLYIWITHZJFLS-UHFFFAOYSA-N 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- XXXFZKQPYACQLD-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethyl acetate Chemical compound CC(=O)OCCOCCO XXXFZKQPYACQLD-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010946 fine silver Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000005499 meniscus Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 229940023462 paste product Drugs 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1627186A JPS62176003A (ja) | 1986-01-27 | 1986-01-27 | 導電性接着ペ−スト |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1627186A JPS62176003A (ja) | 1986-01-27 | 1986-01-27 | 導電性接着ペ−スト |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62176003A true JPS62176003A (ja) | 1987-08-01 |
| JPH0568801B2 JPH0568801B2 (enrdf_load_stackoverflow) | 1993-09-29 |
Family
ID=11911879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1627186A Granted JPS62176003A (ja) | 1986-01-27 | 1986-01-27 | 導電性接着ペ−スト |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62176003A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04269403A (ja) * | 1991-02-25 | 1992-09-25 | Nec Kagoshima Ltd | 導電性ペースト |
| WO2006062208A1 (ja) * | 2004-12-09 | 2006-06-15 | Asahi Co., Ltd | 成型金型の補修方法、耐熱性無機接着剤、成型金型及び成型製品 |
| JP4726803B2 (ja) * | 2004-12-09 | 2011-07-20 | 株式会社 旭 | 成型金型の補修方法、成型金型及び成型製品 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57143203A (en) * | 1981-02-27 | 1982-09-04 | Taiyo Yuden Kk | Conductive paste for forming conductive layer by baking on porcelain |
-
1986
- 1986-01-27 JP JP1627186A patent/JPS62176003A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57143203A (en) * | 1981-02-27 | 1982-09-04 | Taiyo Yuden Kk | Conductive paste for forming conductive layer by baking on porcelain |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04269403A (ja) * | 1991-02-25 | 1992-09-25 | Nec Kagoshima Ltd | 導電性ペースト |
| WO2006062208A1 (ja) * | 2004-12-09 | 2006-06-15 | Asahi Co., Ltd | 成型金型の補修方法、耐熱性無機接着剤、成型金型及び成型製品 |
| JP4726803B2 (ja) * | 2004-12-09 | 2011-07-20 | 株式会社 旭 | 成型金型の補修方法、成型金型及び成型製品 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0568801B2 (enrdf_load_stackoverflow) | 1993-09-29 |
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