JPS58500317A - フラックス作用とハンダ通過性を備えた永久保護皮膜 - Google Patents

フラックス作用とハンダ通過性を備えた永久保護皮膜

Info

Publication number
JPS58500317A
JPS58500317A JP57501104A JP50110482A JPS58500317A JP S58500317 A JPS58500317 A JP S58500317A JP 57501104 A JP57501104 A JP 57501104A JP 50110482 A JP50110482 A JP 50110482A JP S58500317 A JPS58500317 A JP S58500317A
Authority
JP
Japan
Prior art keywords
solder
copolymer
solvent
permeable film
flux
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57501104A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0372394B2 (https=
Inventor
ハツチンソン・ウエルデル・ロバ−ト
シヤ−ボツフ・ジヨン・デビツド
Original Assignee
モトロ−ラ・インコ−ポレ−テッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by モトロ−ラ・インコ−ポレ−テッド filed Critical モトロ−ラ・インコ−ポレ−テッド
Publication of JPS58500317A publication Critical patent/JPS58500317A/ja
Publication of JPH0372394B2 publication Critical patent/JPH0372394B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D123/00—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers
    • C09D123/02—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
    • C09D123/04—Homopolymers or copolymers of ethene
    • C09D123/08—Copolymers of ethene
    • C09D123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C09D123/0869—Acids or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/447—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from acrylic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913—Rod, strand, filament or fiber
    • Y10T428/2933—Coated or with bond, impregnation or core
    • Y10T428/294—Coated or with bond, impregnation or core including metal or compound thereof [excluding glass, ceramic and asbestos]
    • Y10T428/2951—Metal with weld modifying or stabilizing coating [e.g., flux, slag, producer, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP57501104A 1981-03-16 1982-02-23 フラックス作用とハンダ通過性を備えた永久保護皮膜 Granted JPS58500317A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US2439807BEJP 1981-03-16
US06/243,980 US4369287A (en) 1981-03-16 1981-03-16 Permanent fluxing agent and solder-through conformal coating

Publications (2)

Publication Number Publication Date
JPS58500317A true JPS58500317A (ja) 1983-03-03
JPH0372394B2 JPH0372394B2 (https=) 1991-11-18

Family

ID=22920896

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57501104A Granted JPS58500317A (ja) 1981-03-16 1982-02-23 フラックス作用とハンダ通過性を備えた永久保護皮膜

Country Status (8)

Country Link
US (1) US4369287A (https=)
EP (1) EP0073811A4 (https=)
JP (1) JPS58500317A (https=)
KR (1) KR860000304B1 (https=)
AU (1) AU552570B2 (https=)
BR (1) BR8206878A (https=)
CA (1) CA1242295A (https=)
WO (1) WO1982003221A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000013006A (ja) * 1998-06-19 2000-01-14 Fujitsu Ten Ltd プリント配線板の防湿方法およびフラックス残渣を残りやすくしたプリント配線板
JP2020040095A (ja) * 2018-09-11 2020-03-19 株式会社タムラ製作所 フラックス及びソルダペースト

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4640719A (en) * 1985-07-01 1987-02-03 Petroleum Fermentations N.V. Method for printed circuit board and/or printed wiring board cleaning
NZ228160A (en) * 1988-03-18 1990-11-27 Grace W R & Co Hot melt gasket comprising an ethylene/olefinic carboxylic acid copolymer
US7041385B2 (en) 1999-04-22 2006-05-09 Corus Aluminium Walzprodukte Gmbh Composite sheet material for brazing
BR0009945B1 (pt) 1999-04-22 2012-02-22 material laminado compósito bobinado para brasagem e método de fabricação de material laminado.
CA2568454C (en) * 2006-11-17 2014-01-28 Nova Chemicals Corporation Barrier film for food packaging
GB0703172D0 (en) 2007-02-19 2007-03-28 Pa Knowledge Ltd Printed circuit boards
JP5645821B2 (ja) 2008-08-18 2014-12-24 センブラント リミテッド ハロ炭化水素ポリマーコーティング
US8995146B2 (en) 2010-02-23 2015-03-31 Semblant Limited Electrical assembly and method
GB201621177D0 (en) 2016-12-13 2017-01-25 Semblant Ltd Protective coating
US10881007B2 (en) * 2017-10-04 2020-12-29 International Business Machines Corporation Recondition process for BGA using flux

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US628541A (en) * 1898-11-04 1899-07-11 Jesse F Kester Self-fluxing solder.
US1615094A (en) * 1923-01-23 1927-01-18 Western Electric Co Cored article and method of producing such articles
US2079710A (en) * 1934-01-23 1937-05-11 Jaeobson Eugene Self-fluxing solder and process and apparatus for producing same
DE1508333A1 (de) * 1951-01-28 1969-10-30 Kueppers Metallwerk Gmbh Flussmittel fuer Weichlote
US2715616A (en) * 1951-12-20 1955-08-16 Robert M Macintosh Organic coating for wire
GB858483A (en) * 1958-04-23 1961-01-11 Fulham Electrical Components L Improvements in electrical components such as capacitors having protective surface finishes
GB1089906A (en) * 1963-09-27 1967-11-08 Union Carbide Corp Plasticized ethylene-acrylic acid copolymers
US3389109A (en) * 1965-07-26 1968-06-18 Dow Chemical Co Method for preparing aqueous dispersions of ethylene copolymers
US3578630A (en) * 1966-03-03 1971-05-11 Dow Chemical Co Glass filled random copolymers of an olefin and an unsaturated acid
US3557037A (en) * 1966-12-23 1971-01-19 George W Collins Rheological property-modified particle suspensions in organic liquids
US3485783A (en) * 1967-10-16 1969-12-23 Continental Can Co Hot melt adhesive composition
US3554957A (en) * 1968-01-11 1971-01-12 Dow Chemical Co Solvent systems for copclymers of ethylene and acrylic acid
US3541033A (en) * 1968-03-25 1970-11-17 Union Carbide Corp Crystalline ethylene, alpha-beta olefinically unsaturated carboxylic acid copolymer latex paper coating compositions
US3520861A (en) * 1968-12-26 1970-07-21 Dow Chemical Co Copolymers of ethylene
US3607813A (en) * 1969-09-05 1971-09-21 Union Carbide Corp Printing ink compositions
US3793288A (en) * 1969-10-09 1974-02-19 Union Carbide Corp Bonding of thermoplastic polymers to inorganic oxides particles
US3814737A (en) * 1970-09-30 1974-06-04 Gulf Research Development Co Ethylene-acrylic acid polymers having improved optical characteristics
US3853606A (en) * 1971-01-19 1974-12-10 Steel Corp Coated metal fasteners
US3791027A (en) * 1971-06-30 1974-02-12 Ibm Soldering method
US4239812A (en) * 1978-01-30 1980-12-16 Cooper Industries, Inc. Soldering flux
US4192788A (en) * 1978-07-26 1980-03-11 Eastman Kodak Company Modified polyethylene containing hot-melt adhesives useful for carpet tape
US4190565A (en) * 1978-08-30 1980-02-26 Eastman Kodak Company Filled hot-melt adhesives containing modified polyethylene
US4296019A (en) * 1979-11-29 1981-10-20 The Dow Chemical Co. Solvent blends for ethylene copolymers
US4289669A (en) * 1980-07-28 1981-09-15 Gulf Oil Corporation Alkali-soluble hot melt adhesive compositions
US4283317A (en) * 1980-09-15 1981-08-11 E. I. Du Pont De Nemours And Company Wax-free, hot melt adhesive compositions

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000013006A (ja) * 1998-06-19 2000-01-14 Fujitsu Ten Ltd プリント配線板の防湿方法およびフラックス残渣を残りやすくしたプリント配線板
JP2020040095A (ja) * 2018-09-11 2020-03-19 株式会社タムラ製作所 フラックス及びソルダペースト

Also Published As

Publication number Publication date
US4369287A (en) 1983-01-18
EP0073811A1 (en) 1983-03-16
JPH0372394B2 (https=) 1991-11-18
BR8206878A (pt) 1983-03-01
WO1982003221A1 (en) 1982-09-30
AU552570B2 (en) 1986-06-05
KR830009182A (ko) 1983-12-17
AU8274082A (en) 1982-10-06
EP0073811A4 (en) 1984-09-13
KR860000304B1 (ko) 1986-03-31
CA1242295A (en) 1988-09-20

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