KR830009182A - 영구 용제와 소울더 쓰루에 의한 코팅물 - Google Patents
영구 용제와 소울더 쓰루에 의한 코팅물 Download PDFInfo
- Publication number
- KR830009182A KR830009182A KR1019820001094A KR820001094A KR830009182A KR 830009182 A KR830009182 A KR 830009182A KR 1019820001094 A KR1019820001094 A KR 1019820001094A KR 820001094 A KR820001094 A KR 820001094A KR 830009182 A KR830009182 A KR 830009182A
- Authority
- KR
- South Korea
- Prior art keywords
- solvent
- copolymer
- ethylene
- soul
- coating
- Prior art date
Links
- 239000002904 solvent Substances 0.000 title claims 9
- 238000000034 method Methods 0.000 claims 9
- 229920001577 copolymer Polymers 0.000 claims 5
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims 4
- 239000005977 Ethylene Substances 0.000 claims 4
- 238000000576 coating method Methods 0.000 claims 4
- 239000002253 acid Substances 0.000 claims 3
- 239000011248 coating agent Substances 0.000 claims 3
- 239000000203 mixture Substances 0.000 claims 3
- 150000001338 aliphatic hydrocarbons Chemical group 0.000 claims 2
- 238000001816 cooling Methods 0.000 claims 2
- 150000007524 organic acids Chemical class 0.000 claims 2
- 150000003505 terpenes Chemical class 0.000 claims 2
- 235000007586 terpenes Nutrition 0.000 claims 2
- 230000007547 defect Effects 0.000 claims 1
- 238000001035 drying Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 239000012768 molten material Substances 0.000 claims 1
- 235000005985 organic acids Nutrition 0.000 claims 1
- 238000003303 reheating Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 238000003756 stirring Methods 0.000 claims 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D123/00—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers
- C09D123/02—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
- C09D123/04—Homopolymers or copolymers of ethene
- C09D123/08—Copolymers of ethene
- C09D123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09D123/0869—Acids or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/447—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from acrylic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/294—Coated or with bond, impregnation or core including metal or compound thereof [excluding glass, ceramic and asbestos]
- Y10T428/2951—Metal with weld modifying or stabilizing coating [e.g., flux, slag, producer, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31692—Next to addition polymer from unsaturated monomers
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Paints Or Removers (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (10)
- 에틸렌과 유기산의 공중합체(여기서 공중합체는 분자량이 2000 내지 3000이고 밀도가 0.93 내지 0.95이며 산에 대한 에틸렌의 비가 40/975 내지 160/825임)를 용융시키고 이어서 납땜시킴을 특징으로 하여 전자부품 또는 조립품에 사용되는 용제 및 소울더-쓰루 코팅물을 제조하는 방법.
- 제1항에 있어서, 용매를, 공중합체 1부당 30부를 초과하지 않는 비율로 용융물질에 첨가하는 단계를 포함하는 방법.
- 제2항에 있어서, 용매가 지방족 탄화수소인 방법.
- 제2항에 있어서, 혼합물을 "운점"까지 냉각시키고 맑아질때까지 가열한 후 다시 냉각시키고 교반하는 단계를 포함하는 방법.
- 제4항에 있어서, 미리 정해진 점도로 조절하기 위해 실온에서 용매를 추가하는 단게를 포함하는 방법.
- 제5항에 있어서, 중합된 테르펜을 용액내 고체의 20중량%를 초과하지 않는 양으로 혼합물에 첨가하는 단계를 포함하는 방법.
- 제1항에 있어서, 혼합물을 땜납에 가하는 단계를 포함하는 방법.
- 제5항에 있어서, 용매를 제거하기 위해 용매/코팅물을 건조시키는 단계를 포함하는 방법.
- 제8항에 있어서, 표면 균열을 융합시키고 부품 또는 조립품의 표면상에 산의 추가 결함을 촉진시키기 위해 건조된 용제/코팅물을 재가열하는 단계를 포함하는 방법.
- 에틸렌 및 유기산의 공중합체(여기서 공중합체는 분자량이 2000 내지 3000이고 밀도가 0.93 내지 0.95이며 산에 대한 에틸렌의 비는 40/975 내지 160/825임), 지방족 탄화수소 및 테르펜으로 구성되며 전자부품 및 조립품에 사용되는 용제 및 소울더-쓰루 코팅물.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US243980 | 1981-03-16 | ||
US06/243,980 US4369287A (en) | 1981-03-16 | 1981-03-16 | Permanent fluxing agent and solder-through conformal coating |
US243,980 | 1981-03-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR830009182A true KR830009182A (ko) | 1983-12-17 |
KR860000304B1 KR860000304B1 (ko) | 1986-03-31 |
Family
ID=22920896
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR8201094A KR860000304B1 (ko) | 1981-03-16 | 1982-03-15 | 용제 및 소울더 쓰루에 적합한 영구적인 피복물 |
Country Status (8)
Country | Link |
---|---|
US (1) | US4369287A (ko) |
EP (1) | EP0073811A4 (ko) |
JP (1) | JPS58500317A (ko) |
KR (1) | KR860000304B1 (ko) |
AU (1) | AU552570B2 (ko) |
BR (1) | BR8206878A (ko) |
CA (1) | CA1242295A (ko) |
WO (1) | WO1982003221A1 (ko) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4640719A (en) * | 1985-07-01 | 1987-02-03 | Petroleum Fermentations N.V. | Method for printed circuit board and/or printed wiring board cleaning |
NZ228160A (en) * | 1988-03-18 | 1990-11-27 | Grace W R & Co | Hot melt gasket comprising an ethylene/olefinic carboxylic acid copolymer |
JP2000013006A (ja) * | 1998-06-19 | 2000-01-14 | Fujitsu Ten Ltd | プリント配線板の防湿方法およびフラックス残渣を残りやすくしたプリント配線板 |
MXPA01010501A (es) * | 1999-04-22 | 2002-08-20 | Corus Aluminium Walzprod Gmbh | Material de lamina compuesta para soldar. |
US7041385B2 (en) | 1999-04-22 | 2006-05-09 | Corus Aluminium Walzprodukte Gmbh | Composite sheet material for brazing |
CA2568454C (en) * | 2006-11-17 | 2014-01-28 | Nova Chemicals Corporation | Barrier film for food packaging |
GB0703172D0 (en) | 2007-02-19 | 2007-03-28 | Pa Knowledge Ltd | Printed circuit boards |
MY155804A (en) | 2008-08-18 | 2015-11-30 | Semblant Ltd | Halo-hydrocarbon polymer coating |
US8995146B2 (en) | 2010-02-23 | 2015-03-31 | Semblant Limited | Electrical assembly and method |
GB201621177D0 (en) | 2016-12-13 | 2017-01-25 | Semblant Ltd | Protective coating |
US10881007B2 (en) * | 2017-10-04 | 2020-12-29 | International Business Machines Corporation | Recondition process for BGA using flux |
JP6932112B2 (ja) * | 2018-09-11 | 2021-09-08 | 株式会社タムラ製作所 | フラックス及びソルダペースト |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US628541A (en) * | 1898-11-04 | 1899-07-11 | Jesse F Kester | Self-fluxing solder. |
US1615094A (en) * | 1923-01-23 | 1927-01-18 | Western Electric Co | Cored article and method of producing such articles |
US2079710A (en) * | 1934-01-23 | 1937-05-11 | Jaeobson Eugene | Self-fluxing solder and process and apparatus for producing same |
DE1508333A1 (de) * | 1951-01-28 | 1969-10-30 | Kueppers Metallwerk Gmbh | Flussmittel fuer Weichlote |
US2715616A (en) * | 1951-12-20 | 1955-08-16 | Robert M Macintosh | Organic coating for wire |
GB858483A (en) * | 1958-04-23 | 1961-01-11 | Fulham Electrical Components L | Improvements in electrical components such as capacitors having protective surface finishes |
GB1089907A (en) * | 1963-09-27 | 1967-11-08 | Union Carbide Corp | Plasticized ethylene-acrylic acid copolymers |
US3389109A (en) * | 1965-07-26 | 1968-06-18 | Dow Chemical Co | Method for preparing aqueous dispersions of ethylene copolymers |
US3578630A (en) * | 1966-03-03 | 1971-05-11 | Dow Chemical Co | Glass filled random copolymers of an olefin and an unsaturated acid |
US3557037A (en) * | 1966-12-23 | 1971-01-19 | George W Collins | Rheological property-modified particle suspensions in organic liquids |
US3485783A (en) * | 1967-10-16 | 1969-12-23 | Continental Can Co | Hot melt adhesive composition |
US3554957A (en) * | 1968-01-11 | 1971-01-12 | Dow Chemical Co | Solvent systems for copclymers of ethylene and acrylic acid |
US3541033A (en) * | 1968-03-25 | 1970-11-17 | Union Carbide Corp | Crystalline ethylene, alpha-beta olefinically unsaturated carboxylic acid copolymer latex paper coating compositions |
US3520861A (en) * | 1968-12-26 | 1970-07-21 | Dow Chemical Co | Copolymers of ethylene |
US3607813A (en) * | 1969-09-05 | 1971-09-21 | Union Carbide Corp | Printing ink compositions |
US3793288A (en) * | 1969-10-09 | 1974-02-19 | Union Carbide Corp | Bonding of thermoplastic polymers to inorganic oxides particles |
US3814737A (en) * | 1970-09-30 | 1974-06-04 | Gulf Research Development Co | Ethylene-acrylic acid polymers having improved optical characteristics |
US3853606A (en) * | 1971-01-19 | 1974-12-10 | Steel Corp | Coated metal fasteners |
US3791027A (en) * | 1971-06-30 | 1974-02-12 | Ibm | Soldering method |
US4239812A (en) * | 1978-01-30 | 1980-12-16 | Cooper Industries, Inc. | Soldering flux |
US4192788A (en) * | 1978-07-26 | 1980-03-11 | Eastman Kodak Company | Modified polyethylene containing hot-melt adhesives useful for carpet tape |
US4190565A (en) * | 1978-08-30 | 1980-02-26 | Eastman Kodak Company | Filled hot-melt adhesives containing modified polyethylene |
US4296019A (en) * | 1979-11-29 | 1981-10-20 | The Dow Chemical Co. | Solvent blends for ethylene copolymers |
US4289669A (en) * | 1980-07-28 | 1981-09-15 | Gulf Oil Corporation | Alkali-soluble hot melt adhesive compositions |
US4283317A (en) * | 1980-09-15 | 1981-08-11 | E. I. Du Pont De Nemours And Company | Wax-free, hot melt adhesive compositions |
-
1981
- 1981-03-16 US US06/243,980 patent/US4369287A/en not_active Expired - Lifetime
-
1982
- 1982-02-23 AU AU82740/82A patent/AU552570B2/en not_active Ceased
- 1982-02-23 EP EP19820901079 patent/EP0073811A4/en not_active Withdrawn
- 1982-02-23 JP JP57501104A patent/JPS58500317A/ja active Granted
- 1982-02-23 BR BR8206878A patent/BR8206878A/pt unknown
- 1982-02-23 WO PCT/US1982/000223 patent/WO1982003221A1/en not_active Application Discontinuation
- 1982-02-24 CA CA000396915A patent/CA1242295A/en not_active Expired
- 1982-03-15 KR KR8201094A patent/KR860000304B1/ko active
Also Published As
Publication number | Publication date |
---|---|
US4369287A (en) | 1983-01-18 |
BR8206878A (pt) | 1983-03-01 |
WO1982003221A1 (en) | 1982-09-30 |
JPH0372394B2 (ko) | 1991-11-18 |
EP0073811A4 (en) | 1984-09-13 |
CA1242295A (en) | 1988-09-20 |
KR860000304B1 (ko) | 1986-03-31 |
EP0073811A1 (en) | 1983-03-16 |
AU552570B2 (en) | 1986-06-05 |
JPS58500317A (ja) | 1983-03-03 |
AU8274082A (en) | 1982-10-06 |
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