JPS5848947A - 半導体装置の製法 - Google Patents

半導体装置の製法

Info

Publication number
JPS5848947A
JPS5848947A JP56149098A JP14909881A JPS5848947A JP S5848947 A JPS5848947 A JP S5848947A JP 56149098 A JP56149098 A JP 56149098A JP 14909881 A JP14909881 A JP 14909881A JP S5848947 A JPS5848947 A JP S5848947A
Authority
JP
Japan
Prior art keywords
resin
bumps
substrate
semiconductor device
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56149098A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6244851B2 (2
Inventor
Yoshio Okajima
良男 岡嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP56149098A priority Critical patent/JPS5848947A/ja
Publication of JPS5848947A publication Critical patent/JPS5848947A/ja
Publication of JPS6244851B2 publication Critical patent/JPS6244851B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP56149098A 1981-09-18 1981-09-18 半導体装置の製法 Granted JPS5848947A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56149098A JPS5848947A (ja) 1981-09-18 1981-09-18 半導体装置の製法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56149098A JPS5848947A (ja) 1981-09-18 1981-09-18 半導体装置の製法

Publications (2)

Publication Number Publication Date
JPS5848947A true JPS5848947A (ja) 1983-03-23
JPS6244851B2 JPS6244851B2 (2) 1987-09-22

Family

ID=15467647

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56149098A Granted JPS5848947A (ja) 1981-09-18 1981-09-18 半導体装置の製法

Country Status (1)

Country Link
JP (1) JPS5848947A (2)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02189926A (ja) * 1989-01-18 1990-07-25 Nec Corp 半導体集積回路装置
US5139969A (en) * 1990-05-30 1992-08-18 Mitsubishi Denki Kabushiki Kaisha Method of making resin molded semiconductor device
US5373190A (en) * 1991-08-12 1994-12-13 Mitsubishi Denki Kabushiki Kaisha Resin-sealed semiconductor device
US6168972B1 (en) 1998-12-22 2001-01-02 Fujitsu Limited Flip chip pre-assembly underfill process

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5361277A (en) * 1976-11-15 1978-06-01 Hitachi Ltd Semiconductor element

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5361277A (en) * 1976-11-15 1978-06-01 Hitachi Ltd Semiconductor element

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02189926A (ja) * 1989-01-18 1990-07-25 Nec Corp 半導体集積回路装置
US5139969A (en) * 1990-05-30 1992-08-18 Mitsubishi Denki Kabushiki Kaisha Method of making resin molded semiconductor device
US5373190A (en) * 1991-08-12 1994-12-13 Mitsubishi Denki Kabushiki Kaisha Resin-sealed semiconductor device
US6168972B1 (en) 1998-12-22 2001-01-02 Fujitsu Limited Flip chip pre-assembly underfill process

Also Published As

Publication number Publication date
JPS6244851B2 (2) 1987-09-22

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