JPS5846604A - 電子部品の端子固着方法 - Google Patents
電子部品の端子固着方法Info
- Publication number
- JPS5846604A JPS5846604A JP14449881A JP14449881A JPS5846604A JP S5846604 A JPS5846604 A JP S5846604A JP 14449881 A JP14449881 A JP 14449881A JP 14449881 A JP14449881 A JP 14449881A JP S5846604 A JPS5846604 A JP S5846604A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- rivet
- mounting hole
- conductor
- resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 28
- 239000004020 conductor Substances 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 13
- 230000000694 effects Effects 0.000 description 5
- 230000035939 shock Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14449881A JPS5846604A (ja) | 1981-09-11 | 1981-09-11 | 電子部品の端子固着方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14449881A JPS5846604A (ja) | 1981-09-11 | 1981-09-11 | 電子部品の端子固着方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5846604A true JPS5846604A (ja) | 1983-03-18 |
| JPS6123641B2 JPS6123641B2 (enrdf_load_stackoverflow) | 1986-06-06 |
Family
ID=15363746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14449881A Granted JPS5846604A (ja) | 1981-09-11 | 1981-09-11 | 電子部品の端子固着方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5846604A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6112276U (ja) * | 1984-06-27 | 1986-01-24 | 株式会社 指月電機製作所 | 複合回路部品 |
| JPS62162305A (ja) * | 1986-01-13 | 1987-07-18 | 松下電器産業株式会社 | 電子部品の端子固着方法 |
-
1981
- 1981-09-11 JP JP14449881A patent/JPS5846604A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6112276U (ja) * | 1984-06-27 | 1986-01-24 | 株式会社 指月電機製作所 | 複合回路部品 |
| JPS62162305A (ja) * | 1986-01-13 | 1987-07-18 | 松下電器産業株式会社 | 電子部品の端子固着方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6123641B2 (enrdf_load_stackoverflow) | 1986-06-06 |
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