JPS5844755A - 強制空冷用ヒ−トシンク - Google Patents

強制空冷用ヒ−トシンク

Info

Publication number
JPS5844755A
JPS5844755A JP56144122A JP14412281A JPS5844755A JP S5844755 A JPS5844755 A JP S5844755A JP 56144122 A JP56144122 A JP 56144122A JP 14412281 A JP14412281 A JP 14412281A JP S5844755 A JPS5844755 A JP S5844755A
Authority
JP
Japan
Prior art keywords
heat sink
fins
heat
surrounding fluid
cooling heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56144122A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6219073B2 (enExample
Inventor
Tsuneaki Tajima
田島　恒明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56144122A priority Critical patent/JPS5844755A/ja
Publication of JPS5844755A publication Critical patent/JPS5844755A/ja
Publication of JPS6219073B2 publication Critical patent/JPS6219073B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP56144122A 1981-09-11 1981-09-11 強制空冷用ヒ−トシンク Granted JPS5844755A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56144122A JPS5844755A (ja) 1981-09-11 1981-09-11 強制空冷用ヒ−トシンク

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56144122A JPS5844755A (ja) 1981-09-11 1981-09-11 強制空冷用ヒ−トシンク

Publications (2)

Publication Number Publication Date
JPS5844755A true JPS5844755A (ja) 1983-03-15
JPS6219073B2 JPS6219073B2 (enExample) 1987-04-25

Family

ID=15354700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56144122A Granted JPS5844755A (ja) 1981-09-11 1981-09-11 強制空冷用ヒ−トシンク

Country Status (1)

Country Link
JP (1) JPS5844755A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994023449A1 (en) * 1993-03-31 1994-10-13 Yong Nak Lee Heat sink apparatus
US20110296826A1 (en) * 2010-06-02 2011-12-08 GM Global Technology Operations LLC Controlling heat in a system using smart materials
JP2013002735A (ja) * 2011-06-16 2013-01-07 Fujitsu Ltd 熱交換器及び熱交換器を用いた情報処理システム
JP2013242740A (ja) * 2012-05-22 2013-12-05 Hitachi Ltd マルチプロセッササーバの冷却方法
EP3644697A1 (de) * 2018-10-22 2020-04-29 ZF Friedrichshafen AG Kühlmodul für ein fahrzeug-steuergerät, fahrzeug-steuergerät mit einem kühlmodul und verfahren zur wasserkühlung eines fahrzeug-steuergeräts

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012209765A1 (de) * 2011-06-16 2012-12-20 GM Global Technology Operations LLC (n.d. Ges. d. Staates Delaware) Steuerung von Wärme in einem System mithilfe intelligenter Materialien

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994023449A1 (en) * 1993-03-31 1994-10-13 Yong Nak Lee Heat sink apparatus
US20110296826A1 (en) * 2010-06-02 2011-12-08 GM Global Technology Operations LLC Controlling heat in a system using smart materials
US8640455B2 (en) * 2010-06-02 2014-02-04 GM Global Technology Operations LLC Controlling heat in a system using smart materials
JP2013002735A (ja) * 2011-06-16 2013-01-07 Fujitsu Ltd 熱交換器及び熱交換器を用いた情報処理システム
JP2013242740A (ja) * 2012-05-22 2013-12-05 Hitachi Ltd マルチプロセッササーバの冷却方法
EP3644697A1 (de) * 2018-10-22 2020-04-29 ZF Friedrichshafen AG Kühlmodul für ein fahrzeug-steuergerät, fahrzeug-steuergerät mit einem kühlmodul und verfahren zur wasserkühlung eines fahrzeug-steuergeräts

Also Published As

Publication number Publication date
JPS6219073B2 (enExample) 1987-04-25

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