JPS5843453A - ポリイミド材料の食刻方法 - Google Patents

ポリイミド材料の食刻方法

Info

Publication number
JPS5843453A
JPS5843453A JP57101480A JP10148082A JPS5843453A JP S5843453 A JPS5843453 A JP S5843453A JP 57101480 A JP57101480 A JP 57101480A JP 10148082 A JP10148082 A JP 10148082A JP S5843453 A JPS5843453 A JP S5843453A
Authority
JP
Japan
Prior art keywords
etching
layer
polyimide
mide
poly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57101480A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0145904B2 (enExample
Inventor
ジヨナサン・ピ−タ−・フアインマン
レオナ−ド・アルバ−ト・キ−ニイ・ジユニア
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS5843453A publication Critical patent/JPS5843453A/ja
Publication of JPH0145904B2 publication Critical patent/JPH0145904B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31127—Etching organic layers
    • H01L21/31133—Etching organic layers by chemical means
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Weting (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Drying Of Semiconductors (AREA)
  • Formation Of Insulating Films (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
JP57101480A 1981-09-04 1982-06-15 ポリイミド材料の食刻方法 Granted JPS5843453A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/299,370 US4353778A (en) 1981-09-04 1981-09-04 Method of etching polyimide
US299370 1994-09-01

Publications (2)

Publication Number Publication Date
JPS5843453A true JPS5843453A (ja) 1983-03-14
JPH0145904B2 JPH0145904B2 (enExample) 1989-10-05

Family

ID=23154488

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57101480A Granted JPS5843453A (ja) 1981-09-04 1982-06-15 ポリイミド材料の食刻方法

Country Status (5)

Country Link
US (1) US4353778A (enExample)
EP (1) EP0073910B1 (enExample)
JP (1) JPS5843453A (enExample)
CA (1) CA1155736A (enExample)
DE (1) DE3279207D1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59182531A (ja) * 1983-04-01 1984-10-17 Hitachi Micro Comput Eng Ltd 半導体装置における絶縁膜加工法
JPS6276723A (ja) * 1985-09-30 1987-04-08 Matsushita Electronics Corp 基板上へのレジストパタ−ン形成方法
JPH05279752A (ja) * 1992-03-31 1993-10-26 Kawasaki Steel Corp 薄帯の連続焼鈍方法及び装置

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4656050A (en) * 1983-11-30 1987-04-07 International Business Machines Corporation Method of producing electronic components utilizing cured vinyl and/or acetylene terminated copolymers
US4699803A (en) * 1983-11-30 1987-10-13 International Business Machines Corporation Method for forming electrical components comprising cured vinyl and/or acetylene terminated copolymers
US4606998A (en) * 1985-04-30 1986-08-19 International Business Machines Corporation Barrierless high-temperature lift-off process
GB8523373D0 (en) * 1985-09-21 1985-10-23 Stc Plc Via profiling in integrated circuits
US4830706A (en) * 1986-10-06 1989-05-16 International Business Machines Corporation Method of making sloped vias
JPH0626201B2 (ja) * 1987-10-15 1994-04-06 富士通株式会社 半導体装置の製造方法
US4883744A (en) * 1988-05-17 1989-11-28 International Business Machines Corporation Forming a polymide pattern on a substrate
US4908096A (en) * 1988-06-24 1990-03-13 Allied-Signal Inc. Photodefinable interlevel dielectrics
US4846929A (en) * 1988-07-13 1989-07-11 Ibm Corporation Wet etching of thermally or chemically cured polyimide
US4857143A (en) * 1988-12-16 1989-08-15 International Business Machines Corp. Wet etching of cured polyimide
US5242713A (en) * 1988-12-23 1993-09-07 International Business Machines Corporation Method for conditioning an organic polymeric material
GB2226991A (en) * 1989-01-13 1990-07-18 Ibm Etching organic polymeric materials
US5217849A (en) * 1989-08-28 1993-06-08 Sumitomo Metal Mining Company Limited Process for making a two-layer film carrier
US5470693A (en) * 1992-02-18 1995-11-28 International Business Machines Corporation Method of forming patterned polyimide films
US6221567B1 (en) * 1998-01-14 2001-04-24 Fujitsu Limited Method of patterning polyamic acid layers
US6557253B1 (en) * 1998-02-09 2003-05-06 Tessera, Inc. Method of making components with releasable leads
TWI270965B (en) * 2004-10-14 2007-01-11 Advanced Semiconductor Eng Manufacturing method of passivation layer on wafer and manufacturing method of bumps on wafer
US20100071765A1 (en) * 2008-09-19 2010-03-25 Peter Cousins Method for fabricating a solar cell using a direct-pattern pin-hole-free masking layer
TW201026513A (en) * 2009-01-08 2010-07-16 Univ Nat Cheng Kung Imprinting process of polyimide

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3767493A (en) * 1971-06-17 1973-10-23 Ibm Two-step photo-etching method for semiconductors
US4113550A (en) * 1974-08-23 1978-09-12 Hitachi, Ltd. Method for fabricating semiconductor device and etchant for polymer resin
DE2638799C3 (de) * 1976-08-27 1981-12-03 Ibm Deutschland Gmbh, 7000 Stuttgart Verfahren zur Verbesserung der Haftung von metallischen Leiterzügen auf Polyimidschichten in integrierten Schaltungen

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59182531A (ja) * 1983-04-01 1984-10-17 Hitachi Micro Comput Eng Ltd 半導体装置における絶縁膜加工法
JPS6276723A (ja) * 1985-09-30 1987-04-08 Matsushita Electronics Corp 基板上へのレジストパタ−ン形成方法
JPH05279752A (ja) * 1992-03-31 1993-10-26 Kawasaki Steel Corp 薄帯の連続焼鈍方法及び装置

Also Published As

Publication number Publication date
EP0073910A3 (en) 1986-03-19
CA1155736A (en) 1983-10-25
DE3279207D1 (en) 1988-12-15
EP0073910A2 (en) 1983-03-16
JPH0145904B2 (enExample) 1989-10-05
EP0073910B1 (en) 1988-11-09
US4353778A (en) 1982-10-12

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