JPS5842622B2 - 密封容器 - Google Patents

密封容器

Info

Publication number
JPS5842622B2
JPS5842622B2 JP49138271A JP13827174A JPS5842622B2 JP S5842622 B2 JPS5842622 B2 JP S5842622B2 JP 49138271 A JP49138271 A JP 49138271A JP 13827174 A JP13827174 A JP 13827174A JP S5842622 B2 JPS5842622 B2 JP S5842622B2
Authority
JP
Japan
Prior art keywords
sealing
wall
electrical components
substrate
seal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP49138271A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5087586A (enExample
Inventor
フレデリツク クラム ジヨン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raychem Corp
Original Assignee
Raychem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/465,561 external-priority patent/US4126758A/en
Application filed by Raychem Corp filed Critical Raychem Corp
Publication of JPS5087586A publication Critical patent/JPS5087586A/ja
Publication of JPS5842622B2 publication Critical patent/JPS5842622B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W76/157—
    • H10W76/12—
    • H10W95/00—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Cable Accessories (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
JP49138271A 1973-12-03 1974-12-02 密封容器 Expired JPS5842622B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US42142973A 1973-12-03 1973-12-03
US05/465,561 US4126758A (en) 1973-12-03 1974-04-30 Method for sealing integrated circuit components with heat recoverable cap and resulting package

Publications (2)

Publication Number Publication Date
JPS5087586A JPS5087586A (enExample) 1975-07-14
JPS5842622B2 true JPS5842622B2 (ja) 1983-09-21

Family

ID=27025234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49138271A Expired JPS5842622B2 (ja) 1973-12-03 1974-12-02 密封容器

Country Status (15)

Country Link
JP (1) JPS5842622B2 (enExample)
AT (1) ATA964874A (enExample)
AU (1) AU502556B2 (enExample)
BE (1) BE822904A (enExample)
CA (1) CA1042116A (enExample)
CH (1) CH580379A5 (enExample)
DE (1) DE2457116A1 (enExample)
ES (1) ES432527A1 (enExample)
FR (1) FR2253283B1 (enExample)
GB (1) GB1484177A (enExample)
HK (1) HK18478A (enExample)
IL (1) IL46173A (enExample)
IT (1) IT1033109B (enExample)
NL (1) NL7415764A (enExample)
SE (1) SE7415124L (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5427884Y2 (enExample) * 1974-06-27 1979-09-08
JPS57175442U (enExample) * 1981-04-30 1982-11-05
JPS58100446A (ja) * 1981-12-10 1983-06-15 Mitsubishi Electric Corp 真空封止方法
JPS60133741A (ja) * 1983-12-21 1985-07-16 Fujitsu Ltd 半導体装置及びその製造方法
US4701573A (en) * 1985-09-26 1987-10-20 Itt Gallium Arsenide Technology Center Semiconductor chip housing
JPH0793393B2 (ja) * 1988-02-22 1995-10-09 株式会社東芝 半導体装置の金属製シェル
FR2710810B1 (fr) * 1993-09-29 1995-12-01 Sagem Boîtier étanche de micro-composant et procédé d'encapsulation dans un tel boîtier.

Also Published As

Publication number Publication date
AU7601974A (en) 1976-06-03
CH580379A5 (enExample) 1976-09-30
BE822904A (fr) 1975-06-03
HK18478A (en) 1978-04-14
IL46173A0 (en) 1975-03-13
NL7415764A (nl) 1975-06-05
IL46173A (en) 1977-08-31
ATA964874A (de) 1980-04-15
AU502556B2 (en) 1979-08-02
ES432527A1 (es) 1977-03-01
JPS5087586A (enExample) 1975-07-14
CA1042116A (en) 1978-11-07
SE7415124L (enExample) 1975-06-04
IT1033109B (it) 1979-07-10
GB1484177A (en) 1977-09-01
FR2253283A1 (enExample) 1975-06-27
FR2253283B1 (enExample) 1979-08-10
DE2457116A1 (de) 1975-08-21

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