GB1484177A - Heat-recoverable cap - Google Patents

Heat-recoverable cap

Info

Publication number
GB1484177A
GB1484177A GB52318/74A GB5231874A GB1484177A GB 1484177 A GB1484177 A GB 1484177A GB 52318/74 A GB52318/74 A GB 52318/74A GB 5231874 A GB5231874 A GB 5231874A GB 1484177 A GB1484177 A GB 1484177A
Authority
GB
United Kingdom
Prior art keywords
substrate
sealing member
wall
component
configuration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB52318/74A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raychem Corp
Original Assignee
Raychem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/465,561 external-priority patent/US4126758A/en
Application filed by Raychem Corp filed Critical Raychem Corp
Publication of GB1484177A publication Critical patent/GB1484177A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cable Accessories (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

1484177 Mounting semi-conductor devices RAYCHEM CORP 3 Dec 1974 [3 Dec 1973 30 April 1974] 52318/74 Heading H1K An electrical component 6, e.g. a semi-conductor chip, is sealed on a substrate 2 having a wall or walls 12 surrounding the component, by inserting into the area defined by the wall(s) 12 and over the component 6 a heat-recoverable sealing member 14 which initially is of such a size and configuration as to fit loosely within the wall(s) 12, but which is subsequently warmed or allowed to warm so that it recovers to a second, stable state having an increased size and configuration which forms a seal with the walls. The heat-recoverable sealing member 14 may be made from a so-called "memory alloy", e.g. a nickel titanium alloy containing 47À1% Ni, 49À4% Ti and 3À5% Fe, a beta-brass alloy or a 304 stainless steel. A planar disc of such material is immersed in liquid nitrogen, at - 196‹ C., and deformed into a concave configuration of dimensions just smaller than the correspondingly shaped wall(s) 12 of the substrate and is placed over the component to rest on a lip formed in the wall(s). Upon warming, e.g. to a transition temperature in the range - 196‹ to +135‹ C., the sealing member will attempt to recover its original configuration and in so doing exert a force on the substrate walls sufficient to seal the component. Alternatively the sealing member 14 may be made of a heat-recoverable plastics, e.g. a polyarylene, which may recover to an original configuration upon heating up to or below 300‹ F. One of the members forming the seal, i.e. the sealing member 14, the substrate wall(s) 12 or an interposed ring 18, Fig. 3, is preferably formed of softer material than the other members to enhance the sealing. The ring 18 which may be bonded to the substrate, is preferably of V configuration. The sealing member may have a projection 16 to assist in locating it in the substrate or in removing it therefrom to enable access to be had to the semi-conductor component.
GB52318/74A 1973-12-03 1974-12-03 Heat-recoverable cap Expired GB1484177A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US42142973A 1973-12-03 1973-12-03
US05/465,561 US4126758A (en) 1973-12-03 1974-04-30 Method for sealing integrated circuit components with heat recoverable cap and resulting package

Publications (1)

Publication Number Publication Date
GB1484177A true GB1484177A (en) 1977-09-01

Family

ID=27025234

Family Applications (1)

Application Number Title Priority Date Filing Date
GB52318/74A Expired GB1484177A (en) 1973-12-03 1974-12-03 Heat-recoverable cap

Country Status (15)

Country Link
JP (1) JPS5842622B2 (en)
AT (1) ATA964874A (en)
AU (1) AU502556B2 (en)
BE (1) BE822904A (en)
CA (1) CA1042116A (en)
CH (1) CH580379A5 (en)
DE (1) DE2457116A1 (en)
ES (1) ES432527A1 (en)
FR (1) FR2253283B1 (en)
GB (1) GB1484177A (en)
HK (1) HK18478A (en)
IL (1) IL46173A (en)
IT (1) IT1033109B (en)
NL (1) NL7415764A (en)
SE (1) SE7415124L (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0154757A1 (en) * 1983-12-21 1985-09-18 Fujitsu Limited Cap for semiconductor device
GB2181300A (en) * 1985-09-26 1987-04-15 Int Standard Electric Corp Semiconductor chip housing and method of manufacture
EP0330176A2 (en) * 1988-02-22 1989-08-30 Kabushiki Kaisha Toshiba Cover plate for semiconductor devices

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5427884Y2 (en) * 1974-06-27 1979-09-08
JPS57175442U (en) * 1981-04-30 1982-11-05
JPS58100446A (en) * 1981-12-10 1983-06-15 Mitsubishi Electric Corp Vacuum sealing method
FR2710810B1 (en) * 1993-09-29 1995-12-01 Sagem Waterproof micro-component housing and method of encapsulation in such a housing.

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0154757A1 (en) * 1983-12-21 1985-09-18 Fujitsu Limited Cap for semiconductor device
US4604495A (en) * 1983-12-21 1986-08-05 Fujitsu Limited Semiconductor device and process for producing same
GB2181300A (en) * 1985-09-26 1987-04-15 Int Standard Electric Corp Semiconductor chip housing and method of manufacture
US4701573A (en) * 1985-09-26 1987-10-20 Itt Gallium Arsenide Technology Center Semiconductor chip housing
EP0330176A2 (en) * 1988-02-22 1989-08-30 Kabushiki Kaisha Toshiba Cover plate for semiconductor devices
EP0330176A3 (en) * 1988-02-22 1990-10-31 Kabushiki Kaisha Toshiba Cover plate for semiconductor devices
US5096081A (en) * 1988-02-22 1992-03-17 Kabushiki Kaisha Toshiba Cover plate for semiconductor devices

Also Published As

Publication number Publication date
BE822904A (en) 1975-06-03
CA1042116A (en) 1978-11-07
JPS5087586A (en) 1975-07-14
CH580379A5 (en) 1976-09-30
ES432527A1 (en) 1977-03-01
IT1033109B (en) 1979-07-10
JPS5842622B2 (en) 1983-09-21
FR2253283A1 (en) 1975-06-27
HK18478A (en) 1978-04-14
ATA964874A (en) 1980-04-15
FR2253283B1 (en) 1979-08-10
SE7415124L (en) 1975-06-04
IL46173A0 (en) 1975-03-13
AU502556B2 (en) 1979-08-02
DE2457116A1 (en) 1975-08-21
AU7601974A (en) 1976-06-03
NL7415764A (en) 1975-06-05
IL46173A (en) 1977-08-31

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19921203