FR2710810B1 - Waterproof micro-component housing and method of encapsulation in such a housing. - Google Patents
Waterproof micro-component housing and method of encapsulation in such a housing.Info
- Publication number
- FR2710810B1 FR2710810B1 FR9311587A FR9311587A FR2710810B1 FR 2710810 B1 FR2710810 B1 FR 2710810B1 FR 9311587 A FR9311587 A FR 9311587A FR 9311587 A FR9311587 A FR 9311587A FR 2710810 B1 FR2710810 B1 FR 2710810B1
- Authority
- FR
- France
- Prior art keywords
- housing
- encapsulation
- waterproof micro
- component
- component housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/023—Housings for acceleration measuring devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05553—Shape in top view being rectangular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9311587A FR2710810B1 (en) | 1993-09-29 | 1993-09-29 | Waterproof micro-component housing and method of encapsulation in such a housing. |
FI944465A FI944465A (en) | 1993-09-29 | 1994-09-27 | A sealed shell of a microcomponent and a method of encapsulating such a shell |
NO943603A NO943603L (en) | 1993-09-29 | 1994-09-28 | Sealed box for microcomponents and method of encapsulation in such a box |
DE9415696U DE9415696U1 (en) | 1993-09-29 | 1994-09-28 | Dense housing for micro components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9311587A FR2710810B1 (en) | 1993-09-29 | 1993-09-29 | Waterproof micro-component housing and method of encapsulation in such a housing. |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2710810A1 FR2710810A1 (en) | 1995-04-07 |
FR2710810B1 true FR2710810B1 (en) | 1995-12-01 |
Family
ID=9451361
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9311587A Expired - Fee Related FR2710810B1 (en) | 1993-09-29 | 1993-09-29 | Waterproof micro-component housing and method of encapsulation in such a housing. |
Country Status (4)
Country | Link |
---|---|
DE (1) | DE9415696U1 (en) |
FI (1) | FI944465A (en) |
FR (1) | FR2710810B1 (en) |
NO (1) | NO943603L (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2183888T3 (en) * | 1994-11-25 | 2003-04-01 | Ami Doduco Gmbh | HOUSING INTENDED TO RECEIVE ELECTRONIC AND / OR MICROMECHANICAL COMPONENTS, MADE OF A SYNTHETIC MATERIAL, IN WHICH DRIVING TRACKS PENETRATE. |
FR2729253A1 (en) * | 1995-01-11 | 1996-07-12 | Sagem | Sensor module in conducting enclosure for motor car parts e.g. accelerometer |
US5866818A (en) * | 1995-11-30 | 1999-02-02 | Matsushita Electric Works, Ltd. | Acceleration sensor device |
DE102007019096B4 (en) * | 2007-04-23 | 2015-03-12 | Continental Automotive Gmbh | electronics housing |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL261398A (en) * | 1960-03-18 | 1900-01-01 | ||
CA1042116A (en) * | 1973-12-03 | 1978-11-07 | John F. Krumme | Heat recoverable cap |
FR2518812A1 (en) * | 1981-12-23 | 1983-06-24 | Cit Alcatel | Package for hybrid electronic circuits - is filled with fluorocarbon liq. to withstand high pressures, esp. when immersed at great depth in sea-water |
US4675472A (en) * | 1986-08-04 | 1987-06-23 | Beta Phase, Inc. | Integrated circuit package and seal therefor |
NO911774D0 (en) * | 1991-05-06 | 1991-05-06 | Sensonor As | DEVICE FOR ENCAPLING A FUNCTIONAL ORGANIZATION AND PROCEDURE FOR PRODUCING THE SAME. |
-
1993
- 1993-09-29 FR FR9311587A patent/FR2710810B1/en not_active Expired - Fee Related
-
1994
- 1994-09-27 FI FI944465A patent/FI944465A/en not_active Application Discontinuation
- 1994-09-28 NO NO943603A patent/NO943603L/en unknown
- 1994-09-28 DE DE9415696U patent/DE9415696U1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE9415696U1 (en) | 1994-12-15 |
FI944465A0 (en) | 1994-09-27 |
FI944465A (en) | 1995-03-30 |
FR2710810A1 (en) | 1995-04-07 |
NO943603D0 (en) | 1994-09-28 |
NO943603L (en) | 1995-03-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR2739028B1 (en) | IMPROVED CELL ENCAPSULATION DEVICE | |
GB2230647B (en) | Electro-optical transducer module and a method of fabricating such a module | |
FR2719943B1 (en) | Method of manufacturing a display device. | |
FR2719926B1 (en) | Electronic circuit and method of using a coprocessor. | |
GB9305565D0 (en) | Novel compounds and processes | |
FR2710810B1 (en) | Waterproof micro-component housing and method of encapsulation in such a housing. | |
DE69311546T2 (en) | "Bridge module" | |
DE19580246D2 (en) | Diode and a component containing such | |
FR2721161B1 (en) | Electronic module in SMI technology and method of manufacturing such a module. | |
GB9601835D0 (en) | Analysis of liquid solutions | |
FR2709842B1 (en) | Optical switching device and method of manufacturing such a device. | |
PT84521A (en) | Method for the detection of fungi and algae using an optical stilbene whitening agent | |
FR2751614B1 (en) | ANTI-THEFT PACKAGE AND METHODS OF MAKING SUCH A PACKAGE | |
OA09350A (en) | "Method of construction of anti-seismic and anti-cyclonic individual housing". | |
IT1272189B (en) | PROCEDURE AND DEVICE FOR THE REDUCTION OF THE INSERTION OF OXYGEN INTO A SILICON MONOCRYSTAL. | |
FR2730946B1 (en) | DEVICE FOR HANDLING A WORKPIECE IN A HOUSING OF A RECEIVING WORKPIECE | |
EP0625804A3 (en) | Semiconductor optical sensor and method of manufacturing it. | |
KR950012487U (en) | V-Cal's Case Structure | |
FR2640019B1 (en) | SEALING DEVICE | |
FR2736144B1 (en) | INSERTION COMPOUND AND METHOD OF USING SUCH A COMPOUND | |
GB9307236D0 (en) | Chemical compound and process | |
KR940024458U (en) | Sumi's sealing structure | |
FR2732839B1 (en) | OSCILLATOR SELF-CALIBRATOR | |
ES1023649Y (en) | "WATCH" | |
GB9323917D0 (en) | Peoples phone refered phone 100 and system 2000 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse | ||
ST | Notification of lapse |