DE9415696U1 - Dense housing for micro components - Google Patents
Dense housing for micro componentsInfo
- Publication number
- DE9415696U1 DE9415696U1 DE9415696U DE9415696U DE9415696U1 DE 9415696 U1 DE9415696 U1 DE 9415696U1 DE 9415696 U DE9415696 U DE 9415696U DE 9415696 U DE9415696 U DE 9415696U DE 9415696 U1 DE9415696 U1 DE 9415696U1
- Authority
- DE
- Germany
- Prior art keywords
- dipl
- microcomponent
- cover
- housing
- container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 15
- 238000005476 soldering Methods 0.000 claims description 10
- 239000012530 fluid Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 229920001169 thermoplastic Polymers 0.000 claims description 5
- 239000004416 thermosoftening plastic Substances 0.000 claims description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 2
- 238000003466 welding Methods 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000004026 adhesive bonding Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000013016 damping Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/023—Housings for acceleration measuring devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
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- H01L2224/05552—Shape in top view
- H01L2224/05553—Shape in top view being rectangular
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/01014—Silicon [Si]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Glass Compositions (AREA)
- Micromachines (AREA)
- Infusion, Injection, And Reservoir Apparatuses (AREA)
Description
SOCIETE D'APPLICATIONS GENERALES
D'ELECTRICITE ET DE MECANIQUE - SAGEM
6, avenue d'Iena
75783 Paris Cedex 16
FrankreichSOCIETE D'APPLICATIONS GENERALE
ELECTRICITY AND MECHANICS - SAGEM 6, avenue d'Iena
75783 Paris Cedex 16
France
S.A.S.A.
28. Sep. 199428 Sep 1994
Dichtes Gehäuse für MikrobauelementeSealed housing for microcomponents
Die Erfindung betrifft dichte Gehäuse, welche zur Aufnahme eines oder mehrerer in einer elektrischen oder elektronischen Schaltung einsetzbarer Mikrobauelemente, sowie zur Sicherstellung einer oder mehrerer Funktionen bestimmt sind, beispielsweise Schutz des Mikrobauelements gegen Angriffe von außen, Einschließen eines Schutz- und/oder Dämpfungsmediums, Befestigung auf einem äußeren Element, In-Position-Halten bezüglich eines Trägers.The invention relates to sealed housings which are intended to accommodate one or more microcomponents which can be used in an electrical or electronic circuit and to ensure one or more functions, for example protecting the microcomponent against external attacks, enclosing a protective and/or damping medium, fastening to an external element, holding in position with respect to a carrier.
Die zu erfüllende Funktion hängt insbesondere von der Art des eingekapselten Mikrobauelements ab. Dieses Mikrobauelement kann aktiv oder passiv sein. Als aktive Bauelemente können Halbleiterprodukte, Wandler (transducteurs), MikroStellglieder (micro-actuateurs), integrierte Schaltungen genannt werden. Als passive Bauelemente können resistive oder kapazitive Aufnehmer genannt werden.The function to be fulfilled depends in particular on the type of encapsulated microcomponent. This microcomponent can be active or passive. Active components can be semiconductor products, transducers, micro-actuators, integrated circuits. Passive components can be resistive or capacitive sensors.
Das in dem Gehäuse enthaltene Medium kann ebenfalls in einem weiten Bereich variieren. Es kann sich um Schutzgas, ein inertes Gas oder eine Isolationsflüssigkeit zum Schutz oder zur Dämpfung handeln, beispielsweise ein Silikonöl.The medium contained in the housing can also vary widely. It can be a protective gas, an inert gas or an insulating liquid for protection or damping, for example a silicone oil.
Die Erfindung zielt insbesondere darauf auf, ein dichtes Gehäuse bereitzustellen, das den Anforderungen der Praxis besser entspricht als die im Stand der Technik bekannten, insbesondere dahingehend, daß es gleichzeitig wirtschaftlich und hinsichtlich der Dichtheit zuverlässig ist.The invention aims in particular to provide a sealed housing which meets practical requirements better than those known in the prior art, in particular in that it is both economical and reliable in terms of sealing.
Hierzu schlägt die Erfindung insbesondere ein dichtes Gehäuse für Mikrobauelemente vor, welches einen Behälter umfaßt aus thermoplastischem oder duroplastischem Material, das auf elektrische Ausgangskontakte des Mikrobauelements aufgeformt ist, sowie einen Deckel umfaßt, der den Behälter verschließt und mit diesem einen ein Fluid enthaltenden Aufnahmehohlraum für das Mikrobauelement festlegt, wobei bei dem Gehäuse das Material des Behälters ferner auf einen metallischen Kranz aufgeformt ist, und wobei der Deckel metallisch ist und auf dem Kranz dichtend befestigt ist.To this end, the invention proposes in particular a sealed housing for microcomponents, which comprises a container made of thermoplastic or thermosetting material, which is molded onto electrical output contacts of the microcomponent, and a lid which closes the container and defines with it a receiving cavity containing a fluid for the microcomponent, wherein in the housing the material of the container is further molded onto a metallic ring, and wherein the lid is metallic and is attached to the ring in a sealing manner.
In einer vorteilhaften Ausführungsform, welche das Befüllen des Hohlraums mit einem geeigneten Fluid unter Ausschluß des Vorhandenseins von Luft erleichtert, weist der Deckel einen Evakuierungskanal auf, der durch Quetschen, was die Fertigung dieses Deckels aus einem kaltverformbaren Material impliziert, und gegebenenfalls durch Löten verschlossen ist.In an advantageous embodiment, which facilitates the filling of the cavity with a suitable fluid, excluding the presence of air, the cover has an evacuation channel which is closed by squeezing, which implies the manufacture of this cover from a cold-formable material, and optionally by soldering.
Der Kranz wird allgemein von einem dünnen Ring gekrümmten Querschnitts gebildet sein, wobei er Füße aufweisen kann, die an ein Schweißwerkzeug angeschlossen werden können. Der Deckel könnte dann einen Flansch gekrümmten Schnitts aufweisen, der zur Anlage auf dem Kranz längs eines von dessen Umfang beabstandeten Kreises bestimmt ist.The crown will generally be formed by a thin ring of curved cross-section, and may have feet that can be connected to a welding tool. The cover could then have a flange of curved section intended to bear on the crown along a circle spaced from its circumference.
Die Kontakte können je nach Art des enthaltenen Mikrobauelements unterschiedliche Formen aufweisen. Einer oder mehrere dieser Kontakte können zur direkten Aufnahme des Mikrobauelements vorgesehen sein und sich am Boden des Hohlraums befinden. Das Mikrobauelement wird dann mittels Schweißen oder Kleben direkt auf ihnen befestigt. EbensoThe contacts can have different shapes depending on the type of microcomponent contained. One or more of these contacts can be designed to directly accommodate the microcomponent and can be located at the bottom of the cavity. The microcomponent is then attached directly to them by welding or gluing.
können bestimmte der Kontakte oder alle Kontakte über angeschweißte biegsame Drähte mit dem Mikrobauelement verbunden sein, wobei die Drähte in das in dem Hohlraum enthaltene Fluid eingetaucht sind.Some or all of the contacts may be connected to the microcomponent via welded flexible wires, the wires being immersed in the fluid contained in the cavity.
Wie bereits vorstehend angedeutet, kann der Durchgang insbesondere von einem Kanal gebildet sein, der mittels Quetschen und gegebenenfalls mittels Löten verschlossen ist.As already indicated above, the passage can in particular be formed by a channel which is closed by means of squeezing and, if necessary, by soldering.
Der Deckel könnte je nach dem ihn bildenden Metall mittels Elektroschweißen, mittels Löten unter Vorsehen eines Lötlegierungs-Formlings auf dem Kranz oder auf dem Deckel oder mittels Kleben befestigt sein.Depending on the metal used to make it, the cover could be fixed by electric welding, by soldering using a solder alloy blank on the collar or on the cover, or by gluing.
Wenn er dünn ist oder ein Profil aufweist, das ihm eine elastische Formänderung ermöglicht (beispielsweise wenn er gewellt ist oder alternierende Biegungen aufweist), kann sich der Deckel unter der Wirkung einer Druckdifferenz verformen, die beispielsweise von einer Ausdehnungsdifferenz oder einer Außendruckanderung herrührt. Wenn der Deckel ausreichend dünn ist, kann das Gehäuse zur Aufnahme eines Druckaufnehmers und zu dessen Schutz gegen Umgebungseinflüsse eingesetzt werden.If it is thin or has a profile that allows it to change shape elastically (for example if it is corrugated or has alternating bends), the cover can deform under the effect of a pressure difference, resulting for example from an expansion difference or a change in external pressure. If the cover is sufficiently thin, the housing can be used to house a pressure sensor and protect it against environmental influences.
Sofern der Deckel aus einem Metall mit einem hohen Wärmeleitkoeffizienten gefertigt ist, kann das Gehäuse gleichermaßen einen Temperaturaufnehmer aufnehmen.If the cover is made of a metal with a high thermal conductivity coefficient, the housing can also accommodate a temperature sensor.
Die Erfindung wird beim Lesen der folgenden Beschreibung einer bestimmten Ausführungsform besser verständlich, welche als nicht beschränkendes Beispiel angegeben ist. Die Beschreibung bezieht sich auf die beigefügten Zeichnungen, in welchen:The invention will be better understood by reading the following description of a specific embodiment, given as a non-limiting example. The description refers to the accompanying drawings in which:
Figur 1 schematisch ein erfindungsgemäßes, ein Mikrobauelement enthaltendes Gehäuse im Schnitt längs einer durch die Gehäuseachse verlaufenden Ebene zeigt;Figure 1 shows schematically a housing according to the invention containing a microcomponent in section along a plane passing through the housing axis;
Figur 2 einen Schnitt längs der Linie II-II in Figur 1 zeigt, jedoch vor Montage des Deckels; undFigure 2 shows a section along the line II-II in Figure 1 but before assembly of the cover; and
Figur 3 eine Draufsicht einer Hälfte des Behälters bei abgenommenem Deckel zeigt.Figure 3 shows a plan view of one half of the container with the lid removed.
Das in Figur 1 dargestellte Gehäuse umfaßt in seinem Einsatzzustand einen Behälter 10 aus thermoplastischem oder duroplastischem Material, das auf vorgestanzte metallische Verbindungskontakte und einen Trägerkranz 12 für den Deckel aufgeformt ist. Die Kontakte weisen einen nach außen vorspringenden Abschnitt auf, der es ermöglicht, sie mit einer Schaltung elektrisch zu verbinden, und gleichermaßen zur Befestigung des Gehäuses eingesetzt werden kann. In dem dargestellten Fall umfassen die Verbindungskontakte einerseits einen den Boden eines Hohlraums 16 zur Aufnahme eines Mikrobauelements 18 bildenden Kontakt 14, wobei das Mikrobauelement beispielsweise eine Zunge eines Beschleunigungsmessers ist, und andererseits Kontakte 20, die zum Anschluß an das Mikrobauelement über biegsame Verbindungen bestimmt sind, welche Verbindungen weiter unten beschrieben werden.The housing shown in Figure 1 comprises, in its operational state, a container 10 made of thermoplastic or thermosetting material, which is molded onto pre-punched metal connecting contacts and a support ring 12 for the cover. The contacts have an outwardly projecting portion which enables them to be electrically connected to a circuit and can also be used to fix the housing. In the case shown, the connecting contacts comprise, on the one hand, a contact 14 forming the bottom of a cavity 16 for receiving a microcomponent 18, the microcomponent being, for example, a tongue of an accelerometer, and, on the other hand, contacts 20 intended to be connected to the microcomponent via flexible connections, which connections are described below.
Das Gehäuse umfaßt ferner einen Deckel 22, der dazu bestimmt ist, dichtend auf dem Trägerkranz 12 befestigt zu werden. Der Kranz weist einen Querschnitt in Form eines Winkelstücks mit abgerundetem Winkel auf, dessen einer Schenkel auf einem Teil seiner Länge in das den Behälter 10 bildende Material eingebettet ist, und dessen anderer Schenkel die obere Fläche des Behälters bildet. Der Kranz kann insbesondere von einem gestanzten und gebogen, dünnen Ring aus Kupfer oder Nickel von einigen zehntel Millimetern Dicke gebildet sein. Er kann mittels Füßen 24 verlängert sein, die zur Befestigung des Gehäuses dienen und/oder als Schweißelektroden des Deckel 22 verwendet werden können. Diese Füße können in diesem Fall auf dem Hauptteil ihrer Länge eingebettet sein und im unteren Abschnitt des Behäl-The housing further comprises a cover 22 intended to be fixed in a sealing manner to the support ring 12. The ring has a cross-section in the form of a rounded-angle elbow, one of whose legs is embedded over part of its length in the material forming the container 10 and the other leg forms the upper surface of the container. The ring can in particular be formed by a stamped and bent thin ring of copper or nickel a few tenths of a millimetre thick. It can be extended by means of feet 24 which serve to fix the housing and/or can be used as welding electrodes for the cover 22. These feet can in this case be embedded over the majority of their length and can be located in the lower part of the container.
ters vorspringen, wie dies schematisch in Figur 2 angedeutet ist.ters, as shown schematically in Figure 2.
Der Deckel ist ebenfalls aus dünnem Metall gebildet, beispielsweise aus Nickel, aus Kupfer oder aus einen beliebigen anderen Material, das mit jenem des Kranzes verträglich ist. Er weist einen unteren Flansch gekrümmten Querschnitts auf, der es ermöglicht, ihn auf dem Kranz 12 längs eines von dessen Umfang beabstandeten Kreises anzubringen und eine gute Verbindung sicherzustellen.The cover is also made of thin metal, for example nickel, copper or any other material compatible with that of the crown. It has a lower flange with a curved cross-section which allows it to be mounted on the crown 12 along a circle spaced from its circumference and ensures a good connection.
Der dargestellte Deckel 22 umfaßt einen rohrförmigen Durchgang, der von einem Kanal 26 gebildet ist, der bei Vollendung des Gehäuses mittels Quetschen und gegebenenfalls mittels einer Lötstelle 28 verschlossen wird, um ihn abzudichten. The cover 22 shown comprises a tubular passage formed by a channel 26 which is closed upon completion of the housing by means of crimping and, if necessary, by means of a soldering point 28 in order to seal it.
Im folgenden wird ein Verfahren zum Einkapseln eines Mikrobauelements in einem Gehäuse der vorstehend beschriebenen Art erläutert.In the following, a method for encapsulating a microcomponent in a housing of the type described above is explained.
Man beginnt mit der Bildung des Behälters durch klassisches Gießformen aus thermoplastischem oder duroplastischem Material auf den elektrischen Kontakten, die in der Form angeordnet sind und aus dieser herausstehen können. Der Behälter wird gleichermaßen auf den Kranz 12 aufgeformt. Der Deckel wird separat gebildet, beispielsweise durch Stanzen und Pressen eines Bandmaterials aus Kupfer oder Nickel. Das Baueelement wird eingesetzt. Wenn es sich beispielsweise um eine mit Anschlußbahnen versehene Zunge aus piezoelektrischem oder Halbleiter-Material handelt, wird der Sockel der Zunge auf dem am Boden vorgesehenen Kontakt mittels Löten oder mittels Kleben befestigt. Die zusätzlichen vorgesehenen elektrischen Verbindungen können von biegsamen Drahtabschnitten aus Aluminium oder Gold gebildet sein, welche mittels Ultraschallschweißen oder Thermoschallschweißen (soudage thermo-sonique) befestigt sind, wobei die gewählte Technik von der Art des das Gehäuse bildenden Materials ab-The container is formed by conventional molding from thermoplastic or thermosetting material on the electrical contacts arranged in the mold and capable of protruding from it. The container is molded in the same way on the crown 12. The cover is formed separately, for example by stamping and pressing a strip of copper or nickel. The component is inserted. For example, if it is a tongue made of piezoelectric or semiconductor material provided with connection tracks, the base of the tongue is fixed to the contact provided on the base by soldering or by gluing. The additional electrical connections provided can be formed by flexible wire sections made of aluminum or gold, fixed by ultrasonic welding or thermo-sonic welding (soudage thermo-sonique), the technique chosen depending on the type of material forming the housing.
hängen kann. Die das Gehäuse durchsetzenden Kontakte, an welchen angeschlossen wird, können in bekannter Technologie gefertigt sein, welche unter dem englischsprachigen Begriff "lead frame" bekannt ist.The contacts that pass through the housing and are connected to can be manufactured using a well-known technology known as a "lead frame".
Wenn sich das Mikrobauelement einmal an Ort und Stelle befindet, wird der Deckel befestigt. Hierzu wird er auf den Kranz aufgelegt, dann mittels Kleben, mittels Löten oder mittels Elektroschweißen versiegelt. Im Fall des Elektroschweißens wird eine der Elektroden des Schweißgeräts am Deckel 22 angebracht. Die andere Elektrode kann an einem überstehenden Fuß 24 des Kranzes angeschlossen werden. Das Löten kann unter gesondertem Vorsehen eines Formlings aus einer geeigneten Legierung auf dem Kranz oder auf dem Flansch des Deckels selbst vorgenommen werden.Once the microcomponent is in place, the cover is secured. To do this, it is placed on the crown and then sealed by gluing, soldering or electrowelding. In the case of electrowelding, one of the electrodes of the welding machine is attached to the cover 22. The other electrode can be connected to a protruding foot 24 of the crown. The soldering can be carried out by separately providing a blank made of a suitable alloy on the crown or on the flange of the cover itself.
Wenn der Deckel einmal dichtend befestigt ist, füllt man den Hohlraum über den Kanal mit einem geeigneten Fluid. Wenn das Fluid beispielsweise eine zur Dämpfung von Resonanzschwingungen einer Beschleunigungsmeßzunge bestimmte Flüssigkeit ist, kann der Hohlraum gefüllt werden, indem man ihn evakuiert und in die Flüssigkeit eintaucht, die dann ins Innere des Hohlraums gesaugt wird, wenn man das Vakuum "bricht".Once the lid is sealed in place, the cavity is filled with a suitable fluid via the channel. For example, if the fluid is a liquid designed to dampen resonant vibrations of an accelerometer tongue, the cavity can be filled by evacuating it and immersing it in the liquid, which is then sucked into the cavity when the vacuum is "broken".
Wenn der Hohlraum einmal befüllt ist, quetscht man das Ende des Kanals 26 zusammen, um den Einschluß von Gas im Inneren des Hohlraums zu verhindern.Once the cavity is filled, the end of the channel 26 is squeezed to prevent the entrapment of gas inside the cavity.
Nach Reinigen und/oder Entfetten der Außenseite des zusammengequetschten Kanals vollendet man schließlich die Dichtheit mit Hilfe einer Lötstelle am Ende des Kanals, wobei man ein mit dem Material des Deckels verträgliches Material verwendet.After cleaning and/or degreasing the outside of the crimped duct, the seal is finally completed by soldering the end of the duct using a material compatible with the material of the cover.
Das so gebildete dichte Gehäuse kann in unterschiedlicher Art und Weise auf einem Träger befestigt werden. Man kann hierzu insbesondere die mit dem Kranz verbundenen FüßeThe sealed housing thus formed can be attached to a support in various ways. In particular, the feet connected to the crown can be
verwenden. Eine andere Lösung besteht darin, daß man beim Gießformen den Zapfen 30 stehenläßt und diesen zur Montage nach Verformen bzw. Vernieten (bouterollage) seines Endes verwendet.Another solution is to leave the pin 30 in place during the moulding process and to use it for assembly after deforming or riveting (bouterollage) its end.
Die Erfindung ist zahlreichen Ausführungsvarianten zugänglich. Das Gehäuse kann eine andere Form aufweisen als die zylindrische. Der Deckel kann Wellungen aufweisen, die zur Erhöhung seiner Flexibilität bestimmt sind. Es können andere als die vorstehend beschriebenen Befestigungsarten eingesetzt werden.The invention is amenable to numerous variants. The housing can have a shape other than cylindrical. The cover can have corrugations designed to increase its flexibility. Fastening methods other than those described above can be used.
Das dichte Gehäuse, das aktive oder passive Mikrobauelernente aufnehmen kann, umfaßt einen Behälter 10 aus thermoplastischem oder thermoaushärtbarem (thermo-durcissable) Material, der auf elektrische Ausgangskontakte 14, 2 0 des Mikrobauelements 18 aufgegossen ist, sowie einen Deckel, der den Behälter verschließt und mit ihm einen ein Fluid enthaltenden Aufnahmehohlraum für das Mikrobauelement bildet. Das Material des Behälters ist ferner auf einen metallischen Kranz 12 aufgegossen und der Deckel 22 ist aus Metall gefertigt. Er ist mittels Schweißen, Löten oder gar Kleben dichtend auf dem Kranz befestigt.The sealed housing, which can accommodate active or passive microcomponents, comprises a container 10 made of thermoplastic or thermo-curable material, which is cast onto electrical output contacts 14, 20 of the microcomponent 18, and a lid which closes the container and forms with it a receiving cavity for the microcomponent containing a fluid. The material of the container is also cast onto a metallic ring 12 and the lid 22 is made of metal. It is attached to the ring in a sealing manner by welding, soldering or even gluing.
Claims (5)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9311587A FR2710810B1 (en) | 1993-09-29 | 1993-09-29 | Waterproof micro-component housing and method of encapsulation in such a housing. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE9415696U1 true DE9415696U1 (en) | 1994-12-15 |
Family
ID=9451361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE9415696U Expired - Lifetime DE9415696U1 (en) | 1993-09-29 | 1994-09-28 | Dense housing for micro components |
Country Status (4)
| Country | Link |
|---|---|
| DE (1) | DE9415696U1 (en) |
| FI (1) | FI944465A (en) |
| FR (1) | FR2710810B1 (en) |
| NO (1) | NO943603L (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996017383A1 (en) * | 1994-11-25 | 1996-06-06 | Doduco Gmbh + Co. Dr. Eugen Dürrwächter | Plastic housing designed to accommodate electronic and/or micromechanical components and into which conductor tracks pass |
| FR2729253A1 (en) * | 1995-01-11 | 1996-07-12 | Sagem | Sensor module in conducting enclosure for motor car parts e.g. accelerometer |
| EP0777124A1 (en) * | 1995-11-30 | 1997-06-04 | Matsushita Electric Works, Ltd. | Acceleration sensor |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102007019096B4 (en) * | 2007-04-23 | 2015-03-12 | Continental Automotive Gmbh | electronics housing |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL261398A (en) * | 1960-03-18 | 1900-01-01 | ||
| JPS5842622B2 (en) * | 1973-12-03 | 1983-09-21 | レイチエム コ−ポレ−シヨン | sealed container |
| FR2518812A1 (en) * | 1981-12-23 | 1983-06-24 | Cit Alcatel | Package for hybrid electronic circuits - is filled with fluorocarbon liq. to withstand high pressures, esp. when immersed at great depth in sea-water |
| US4675472A (en) * | 1986-08-04 | 1987-06-23 | Beta Phase, Inc. | Integrated circuit package and seal therefor |
| NO911774D0 (en) * | 1991-05-06 | 1991-05-06 | Sensonor As | DEVICE FOR ENCAPLING A FUNCTIONAL ORGANIZATION AND PROCEDURE FOR PRODUCING THE SAME. |
-
1993
- 1993-09-29 FR FR9311587A patent/FR2710810B1/en not_active Expired - Fee Related
-
1994
- 1994-09-27 FI FI944465A patent/FI944465A/en not_active Application Discontinuation
- 1994-09-28 DE DE9415696U patent/DE9415696U1/en not_active Expired - Lifetime
- 1994-09-28 NO NO943603A patent/NO943603L/en unknown
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996017383A1 (en) * | 1994-11-25 | 1996-06-06 | Doduco Gmbh + Co. Dr. Eugen Dürrwächter | Plastic housing designed to accommodate electronic and/or micromechanical components and into which conductor tracks pass |
| FR2729253A1 (en) * | 1995-01-11 | 1996-07-12 | Sagem | Sensor module in conducting enclosure for motor car parts e.g. accelerometer |
| EP0777124A1 (en) * | 1995-11-30 | 1997-06-04 | Matsushita Electric Works, Ltd. | Acceleration sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2710810A1 (en) | 1995-04-07 |
| NO943603D0 (en) | 1994-09-28 |
| NO943603L (en) | 1995-03-30 |
| FI944465A0 (en) | 1994-09-27 |
| FI944465A (en) | 1995-03-30 |
| FR2710810B1 (en) | 1995-12-01 |
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