ES432527A1 - Heat-recoverable cap - Google Patents
Heat-recoverable capInfo
- Publication number
- ES432527A1 ES432527A1 ES432527A ES432527A ES432527A1 ES 432527 A1 ES432527 A1 ES 432527A1 ES 432527 A ES432527 A ES 432527A ES 432527 A ES432527 A ES 432527A ES 432527 A1 ES432527 A1 ES 432527A1
- Authority
- ES
- Spain
- Prior art keywords
- component
- wall
- thermo
- walls
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007789 sealing Methods 0.000 abstract 3
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Casings For Electric Apparatus (AREA)
- Cable Accessories (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
"Procedure for sealing electrical components", characterized in that it comprises the steps of placing the component on a substrate with means for electrically connecting the component that has at least one wall surrounding the component, introducing in a zone determined by the wall or walls and on the component, a thermo-recoverable sealing member having transverse dimensions less than the area defined by the wall or walls, and heating the sealing member, until its thermo-stable state, so that its transverse dimensions increase and a sealed. (Machine-translation by Google Translate, not legally binding)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US42142973A | 1973-12-03 | 1973-12-03 | |
US05/465,561 US4126758A (en) | 1973-12-03 | 1974-04-30 | Method for sealing integrated circuit components with heat recoverable cap and resulting package |
Publications (1)
Publication Number | Publication Date |
---|---|
ES432527A1 true ES432527A1 (en) | 1977-03-01 |
Family
ID=27025234
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES432527A Expired ES432527A1 (en) | 1973-12-03 | 1974-12-03 | Heat-recoverable cap |
Country Status (15)
Country | Link |
---|---|
JP (1) | JPS5842622B2 (en) |
AT (1) | ATA964874A (en) |
AU (1) | AU502556B2 (en) |
BE (1) | BE822904A (en) |
CA (1) | CA1042116A (en) |
CH (1) | CH580379A5 (en) |
DE (1) | DE2457116A1 (en) |
ES (1) | ES432527A1 (en) |
FR (1) | FR2253283B1 (en) |
GB (1) | GB1484177A (en) |
HK (1) | HK18478A (en) |
IL (1) | IL46173A (en) |
IT (1) | IT1033109B (en) |
NL (1) | NL7415764A (en) |
SE (1) | SE7415124L (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5427884Y2 (en) * | 1974-06-27 | 1979-09-08 | ||
JPS57175442U (en) * | 1981-04-30 | 1982-11-05 | ||
JPS58100446A (en) * | 1981-12-10 | 1983-06-15 | Mitsubishi Electric Corp | Vacuum sealing method |
JPS60133741A (en) * | 1983-12-21 | 1985-07-16 | Fujitsu Ltd | Semiconductor device and manufacture thereof |
US4701573A (en) * | 1985-09-26 | 1987-10-20 | Itt Gallium Arsenide Technology Center | Semiconductor chip housing |
JPH0793393B2 (en) * | 1988-02-22 | 1995-10-09 | 株式会社東芝 | Semiconductor device metal shell |
FR2710810B1 (en) * | 1993-09-29 | 1995-12-01 | Sagem | Waterproof micro-component housing and method of encapsulation in such a housing. |
-
1974
- 1974-12-02 JP JP49138271A patent/JPS5842622B2/en not_active Expired
- 1974-12-02 CA CA215,092A patent/CA1042116A/en not_active Expired
- 1974-12-03 IT IT30149/74A patent/IT1033109B/en active
- 1974-12-03 AU AU76019/74A patent/AU502556B2/en not_active Expired
- 1974-12-03 NL NL7415764A patent/NL7415764A/en not_active Application Discontinuation
- 1974-12-03 SE SE7415124A patent/SE7415124L/xx unknown
- 1974-12-03 ES ES432527A patent/ES432527A1/en not_active Expired
- 1974-12-03 GB GB52318/74A patent/GB1484177A/en not_active Expired
- 1974-12-03 CH CH1602274A patent/CH580379A5/xx not_active IP Right Cessation
- 1974-12-03 BE BE151117A patent/BE822904A/en unknown
- 1974-12-03 IL IL46173A patent/IL46173A/en unknown
- 1974-12-03 FR FR7439474A patent/FR2253283B1/fr not_active Expired
- 1974-12-03 DE DE19742457116 patent/DE2457116A1/en not_active Ceased
- 1974-12-03 AT AT964874A patent/ATA964874A/en not_active Application Discontinuation
-
1978
- 1978-04-04 HK HK184/78A patent/HK18478A/en unknown
Also Published As
Publication number | Publication date |
---|---|
CA1042116A (en) | 1978-11-07 |
SE7415124L (en) | 1975-06-04 |
FR2253283B1 (en) | 1979-08-10 |
JPS5087586A (en) | 1975-07-14 |
GB1484177A (en) | 1977-09-01 |
AU7601974A (en) | 1976-06-03 |
IL46173A0 (en) | 1975-03-13 |
FR2253283A1 (en) | 1975-06-27 |
JPS5842622B2 (en) | 1983-09-21 |
IL46173A (en) | 1977-08-31 |
AU502556B2 (en) | 1979-08-02 |
DE2457116A1 (en) | 1975-08-21 |
CH580379A5 (en) | 1976-09-30 |
IT1033109B (en) | 1979-07-10 |
NL7415764A (en) | 1975-06-05 |
BE822904A (en) | 1975-06-03 |
ATA964874A (en) | 1980-04-15 |
HK18478A (en) | 1978-04-14 |
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