ATA964874A - Verfahren zum dichten verschliessen eines elektronischen bauteiles - Google Patents

Verfahren zum dichten verschliessen eines elektronischen bauteiles

Info

Publication number
ATA964874A
ATA964874A AT964874A AT964874A ATA964874A AT A964874 A ATA964874 A AT A964874A AT 964874 A AT964874 A AT 964874A AT 964874 A AT964874 A AT 964874A AT A964874 A ATA964874 A AT A964874A
Authority
AT
Austria
Prior art keywords
sealing
electronic component
electronic
component
Prior art date
Application number
AT964874A
Other languages
English (en)
Original Assignee
Raychem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/465,561 external-priority patent/US4126758A/en
Application filed by Raychem Corp filed Critical Raychem Corp
Publication of ATA964874A publication Critical patent/ATA964874A/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701Low temperature co-fired ceramic [LTCC]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cable Accessories (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
AT964874A 1973-12-03 1974-12-03 Verfahren zum dichten verschliessen eines elektronischen bauteiles ATA964874A (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US42142973A 1973-12-03 1973-12-03
US05/465,561 US4126758A (en) 1973-12-03 1974-04-30 Method for sealing integrated circuit components with heat recoverable cap and resulting package

Publications (1)

Publication Number Publication Date
ATA964874A true ATA964874A (de) 1980-04-15

Family

ID=27025234

Family Applications (1)

Application Number Title Priority Date Filing Date
AT964874A ATA964874A (de) 1973-12-03 1974-12-03 Verfahren zum dichten verschliessen eines elektronischen bauteiles

Country Status (15)

Country Link
JP (1) JPS5842622B2 (de)
AT (1) ATA964874A (de)
AU (1) AU502556B2 (de)
BE (1) BE822904A (de)
CA (1) CA1042116A (de)
CH (1) CH580379A5 (de)
DE (1) DE2457116A1 (de)
ES (1) ES432527A1 (de)
FR (1) FR2253283B1 (de)
GB (1) GB1484177A (de)
HK (1) HK18478A (de)
IL (1) IL46173A (de)
IT (1) IT1033109B (de)
NL (1) NL7415764A (de)
SE (1) SE7415124L (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5427884Y2 (de) * 1974-06-27 1979-09-08
JPS57175442U (de) * 1981-04-30 1982-11-05
JPS58100446A (ja) * 1981-12-10 1983-06-15 Mitsubishi Electric Corp 真空封止方法
JPS60133741A (ja) * 1983-12-21 1985-07-16 Fujitsu Ltd 半導体装置及びその製造方法
US4701573A (en) * 1985-09-26 1987-10-20 Itt Gallium Arsenide Technology Center Semiconductor chip housing
JPH0793393B2 (ja) * 1988-02-22 1995-10-09 株式会社東芝 半導体装置の金属製シェル
FR2710810B1 (fr) * 1993-09-29 1995-12-01 Sagem Boîtier étanche de micro-composant et procédé d'encapsulation dans un tel boîtier.

Also Published As

Publication number Publication date
JPS5842622B2 (ja) 1983-09-21
NL7415764A (nl) 1975-06-05
BE822904A (fr) 1975-06-03
FR2253283B1 (de) 1979-08-10
ES432527A1 (es) 1977-03-01
CA1042116A (en) 1978-11-07
DE2457116A1 (de) 1975-08-21
HK18478A (en) 1978-04-14
GB1484177A (en) 1977-09-01
IL46173A (en) 1977-08-31
JPS5087586A (de) 1975-07-14
IT1033109B (it) 1979-07-10
SE7415124L (de) 1975-06-04
IL46173A0 (en) 1975-03-13
CH580379A5 (de) 1976-09-30
FR2253283A1 (de) 1975-06-27
AU502556B2 (en) 1979-08-02
AU7601974A (en) 1976-06-03

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Legal Events

Date Code Title Description
A1Z Withdrawn