JPS5839099A - 多層印刷回路基板の製造方法 - Google Patents

多層印刷回路基板の製造方法

Info

Publication number
JPS5839099A
JPS5839099A JP13793181A JP13793181A JPS5839099A JP S5839099 A JPS5839099 A JP S5839099A JP 13793181 A JP13793181 A JP 13793181A JP 13793181 A JP13793181 A JP 13793181A JP S5839099 A JPS5839099 A JP S5839099A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
multilayer printed
layer
copper foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13793181A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6347158B2 (enrdf_load_stackoverflow
Inventor
明渡　晃弘
馬場　一精
斉藤　秀男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP13793181A priority Critical patent/JPS5839099A/ja
Publication of JPS5839099A publication Critical patent/JPS5839099A/ja
Publication of JPS6347158B2 publication Critical patent/JPS6347158B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP13793181A 1981-08-31 1981-08-31 多層印刷回路基板の製造方法 Granted JPS5839099A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13793181A JPS5839099A (ja) 1981-08-31 1981-08-31 多層印刷回路基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13793181A JPS5839099A (ja) 1981-08-31 1981-08-31 多層印刷回路基板の製造方法

Publications (2)

Publication Number Publication Date
JPS5839099A true JPS5839099A (ja) 1983-03-07
JPS6347158B2 JPS6347158B2 (enrdf_load_stackoverflow) 1988-09-20

Family

ID=15210029

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13793181A Granted JPS5839099A (ja) 1981-08-31 1981-08-31 多層印刷回路基板の製造方法

Country Status (1)

Country Link
JP (1) JPS5839099A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6247197A (ja) * 1985-08-26 1987-02-28 日立コンデンサ株式会社 多層配線板の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5110329A (ja) * 1974-07-05 1976-01-27 Hitachi Ltd Teidenatsuhenatsuki
JPS5241868A (en) * 1975-09-29 1977-03-31 Tokyo Purinto Kougiyou Kk Method of producing multiilayer printed circuit board
JPS5426472A (en) * 1977-07-30 1979-02-28 Matsushita Electric Works Ltd Method of manufacturing multiilayer printed wiring board
JPS5638038A (en) * 1979-08-01 1981-04-13 Toray Ind Inc Photosensitive polyimide precursor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5110329A (ja) * 1974-07-05 1976-01-27 Hitachi Ltd Teidenatsuhenatsuki
JPS5241868A (en) * 1975-09-29 1977-03-31 Tokyo Purinto Kougiyou Kk Method of producing multiilayer printed circuit board
JPS5426472A (en) * 1977-07-30 1979-02-28 Matsushita Electric Works Ltd Method of manufacturing multiilayer printed wiring board
JPS5638038A (en) * 1979-08-01 1981-04-13 Toray Ind Inc Photosensitive polyimide precursor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6247197A (ja) * 1985-08-26 1987-02-28 日立コンデンサ株式会社 多層配線板の製造方法

Also Published As

Publication number Publication date
JPS6347158B2 (enrdf_load_stackoverflow) 1988-09-20

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