JPS5839042U - ボンデイングツ−ルの構造 - Google Patents

ボンデイングツ−ルの構造

Info

Publication number
JPS5839042U
JPS5839042U JP1981133393U JP13339381U JPS5839042U JP S5839042 U JPS5839042 U JP S5839042U JP 1981133393 U JP1981133393 U JP 1981133393U JP 13339381 U JP13339381 U JP 13339381U JP S5839042 U JPS5839042 U JP S5839042U
Authority
JP
Japan
Prior art keywords
discharge port
shaft portion
bonding
bonding tool
support shaft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1981133393U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0356054Y2 (enrdf_load_stackoverflow
Inventor
英一 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP1981133393U priority Critical patent/JPS5839042U/ja
Publication of JPS5839042U publication Critical patent/JPS5839042U/ja
Application granted granted Critical
Publication of JPH0356054Y2 publication Critical patent/JPH0356054Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP1981133393U 1981-09-08 1981-09-08 ボンデイングツ−ルの構造 Granted JPS5839042U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981133393U JPS5839042U (ja) 1981-09-08 1981-09-08 ボンデイングツ−ルの構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981133393U JPS5839042U (ja) 1981-09-08 1981-09-08 ボンデイングツ−ルの構造

Publications (2)

Publication Number Publication Date
JPS5839042U true JPS5839042U (ja) 1983-03-14
JPH0356054Y2 JPH0356054Y2 (enrdf_load_stackoverflow) 1991-12-16

Family

ID=29926856

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981133393U Granted JPS5839042U (ja) 1981-09-08 1981-09-08 ボンデイングツ−ルの構造

Country Status (1)

Country Link
JP (1) JPS5839042U (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6122404U (ja) * 1984-07-18 1986-02-08 太陽鍛工株式会社 耕耘爪のマルチホルダ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6122404U (ja) * 1984-07-18 1986-02-08 太陽鍛工株式会社 耕耘爪のマルチホルダ

Also Published As

Publication number Publication date
JPH0356054Y2 (enrdf_load_stackoverflow) 1991-12-16

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