JPS5834171A - Vacuum vapor-depositing device - Google Patents

Abstract

PURPOSE:To eliminate variations of thickness of a vapor-deposited film of every body to be vapor-deposited, by detecting a fly-coming direction distribution of a vapor-deposition substance from an evaporation source, by plural vapor-deposited film thickness detectors, and controlling the distribution of the vapor-deposition substance in accordance with its signal. CONSTITUTION:In a vacuum vapor-depositing device whose evaporation power is an electronic beam, plural vapor-deposited film thickness detectors 10, 20 and 21' are installed symmetrically to an evaporation source 5 within a prescribed range where a vapor-deposition substance comes flying. When vapor-deposition is started, a vapor-deposited film is formed on each detector 10, 20 and 20', and each detecting signal is sent to a controlling circuit 11. The controlling circuit 11 applies a control signal to a control driving mechanism 22 so that each detected vapor-depositing speed becomes equal to a set value, nd controls a position of the evaporation source 5 in the upper and lower directions. Also, it controls an electronic beam from an electronic beam source 4 through an electric power supplying circuit 12. In this way, thickness of a film of a lot of bodies to be vapor-deposited held by a rotary plate 9 is held uniformly by desirably changing a fly-coming direction distribution of a vapor-deposition substance.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a vacuum evaporation apparatus using an electron beam as evaporation power, which allows easy control of film thickness on a large number of objects to be evaporated.

Vacuum evaporation equipment has traditionally been widely used as a means of forming thin films on the surface of objects, but when it is necessary to control the thickness of the deposited film, vacuum evaporation equipment that uses electron beam evaporation power is mainly used. ing.

FIG. 1 shows an example of a vacuum evaporation apparatus using such an electron beam as evaporation power.

In the figure, 1 is a Pelger (vacuum container), 2 is a base (base), 3 is a viewing chamber, 4 is an electron beam source, S is an evaporation source, 6 is an evaporation source container (hearth), T is a shutter, and 8 is a Planetary jig, 9 is a rotating plate for holding the object to be deposited, 1
0 is a deposition film thickness detector.

11 is a control circuit, and 12 is a power supply circuit for operating the electron beam source.

The Pel jar 1 is placed on a base 2 via a backing (not shown), which is also equipped with a vacuum pump (not shown) to maintain a high vacuum state inside the base 2.

Electron beam i! [4 consists of a filament serving as a cathode, an accelerating electrode serving as an anode, and an electrode for beam formation], which receives electric power for heating the filament and high voltage for the electron beam 1Xi speed from the power supply circuit 12; Under an accelerating voltage of 10 kV, an electron beam is generated to reach % on the order of amperes. This electron beam has a polarization of 1Ni (not shown).
t (fit, t magnetic field type) is deflected by K and is evaporated from aluminum ingot etc. from the top of the figure against #SK? ! He was forced to shoot in the right direction.

Therefore, the evaporation ms#i is locally dissolved by the impact of this electron beam, and the evaporated constant molecules are scattered as shown by the broken line arrow in the figure.

The planetary jig itself rotates horizontally as the central axis in the vertical direction of the figure, and then is further pivoted to support several pieces of shallow %A.
This is because it operates to rotate the ll-shaped rotary plate 9.

Therefore, a predetermined number of objects to be deposited are attached to the inner surface of the rotating plate 9, and the inside of the Pelger 1 is kept at a predetermined temperature.
If shirt #7 is removed from above the evaporation source 5 while operating the planetary jig 8, the evaporation material from the evaporation source 5 will fly onto the surface of the object to be evaporated, as shown by the broken line arrow in the figure, and evaporation will be performed. .

At this time, the thickness of the deposited film on the object to be deposited is controlled as follows. That is, since the vapor deposited film thickness detector 10 is provided on the top of the Pelger 1, when vapor deposition is started as described above, a vapor deposited film is also formed on the detection surface of this detector 10, and this detection - From 10, a t detection signal is outputted according to the thickness of the deposited film that has just begun to be formed, and is supplied to the control circuit 11.

Therefore, the control circuit 11 controls the power supply circuit 12 according to the supplied detection signal, and changes the filament heating power etc. supplied to the electron beam #4 to correspond to a predetermined evaporation rate that is set in advance. Control of the film thickness can be performed so that a detection signal is obtained from the deposited film thickness detector 10.

However, in such conventional vacuum evaporation equipment,
Since the evaporation film thickness detector 10 installed at the top of the Pelger 10 only detects the evaporation speed, it is possible to detect differences in the film thickness distribution over the entire surface of the rotating plate 9 of the planetary jig and the film thickness distribution that occurs during the evaporation operation. It is not possible to perform control to compensate for the difference, and as a result, there is a drawback that the thickness of the deposited film tends to vary from one object to another.

The object of the present invention is to eliminate the drawbacks of the prior art as described above. To provide a vacuum evaporation device capable of operating at 5K so that there is almost no variation in the thickness of the evaporated film for each object to be evaporated.

In order to achieve this object, the present invention detects the flying direction of the evaporation material 11v coming from the evaporation source toward the object to be evaporated KR,
A unique feature is that the distribution of the deposition material in the flying direction is controlled accordingly.

An embodiment of a vacuum evaporation apparatus according to the present invention will be described below with reference to FIG. 1iK.

No.! The figure shows one embodiment of the present invention, and the same or opening parts as in the conventional example of FIG. 1 are given the same reference numerals.

I will omit the detailed explanation. In the figure, 2G.

20' and 2F are vapor deposition film thickness detectors, 21 is an evaporation source position control mechanism, and 22 is a control drive mechanism.

The evaporation film thickness detectors 20, 20', 20' detect the evaporation [! !
It is mounted diagonally above the ``clII turn plate 9'' and at a position that is almost symmetrical to the vapor deposited film thickness detector 10 on the top, and sends a film thickness detection signal to the control circuit 1.
1.

The evaporation source position control mechanism 21 is driven by a control drive mechanism 22, and operates to arbitrarily change the position of the evaporator i1[5 of the aluminum 1-ram in-bod or the like housed in the 8th 6 in the direction of the arrow in the figure. do.

A control signal for the control drive mechanism 22 at this time is supplied from the control circuit 11.

Next, the operation will be explained.

When vapor deposition is started in the same manner as in the conventional example shown in FIG. Signals are provided respectively m@N 11 K.

So, control surface 1! i11 controls the vertical position of the evaporator I15 by giving a control signal to the control drive mechanism 22 so that the evaporation speed detected by all the detectors 1G, 20°, 20', and 20' is equal to the preset value l1lK. Control and call! The output of the electron beam from the electron beam j14 is controlled via the circuit 12. In addition.

Although not shown, at this time the deflection device is controlled and the evaporation source s
The impact position t of the electron beam relative to k may also be controlled.

Displace the evaporation source I in the vertical direction 7? Well, if you change the impact position of the stone electron beam.

Since the scattering direction distribution of vapor deposited substances scattered from the evaporogen algae can be determined, the control circuit 111C and p
Control drive mechanism 22YIIILyt6. Deflection device Vl
If controlled, each detection 1) 10, 20, 20'
.

From 20'K onwards, the film thickness can be controlled in such a way that the detected evaporation rates are not equal to each other.

Therefore, according to this actual m*, it is impossible to obtain a sufficiently uniform film thickness at any part of the rotation of the planetary jig. It is possible to sufficiently prevent variations in film thickness.

Furthermore, such variations in the thickness distribution of the deposited film change depending on the deposition operation. Therefore, with the conventional method shown in Fig.
In many cases, it is difficult to obtain a uniform product, but according to this example, it is possible to always control the distribution of the deposited substance, so even if the deposition operation is different, there will be no variation in film thickness. This eliminates the risk and allows products with sufficiently uniform film thickness to be stably obtained.

In addition, in the above embodiment, a total of four detectors 10.2
0.20'*20'Y, or the number of detectors is not limited to 4, but can be arbitrarily determined. No, it's not even 5 tons.

The i hole and the mounting position of these multiple detectors are also
The embodiment shown in the figure is merely an example. First, it goes without saying that any arrangement may be used as long as the distribution of the evaporation material flying toward the object to be evaporated can be detected.

As explained above, according to the present invention, it is possible to maintain a sufficiently uniform deposition film thickness distribution in the portion where the object to be deposited is held, thereby eliminating the drawbacks of the prior art.

It is possible to provide a vacuum evaporation apparatus that can obtain devices with sufficient performance at a high yield when manufacturing surface acoustic wave devices that require precise film thickness control.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram showing a conventional vacuum evaporation apparatus using an electron beam as evaporation power, and FIG. 2 is a schematic diagram illustrating an implementation of the vacuum evaporation apparatus according to the present invention. 1...Perger, 2...Base, 3
...Peeping room, 4...Electron beam source, 5
...Evaporation source, 6...8-th, 7-...
...Shutter, 8...Planetary jig, S
・-・・Rotating plate, 10, 20.20', 20'...-
Vapor deposition film thickness detector, 11... Control circuit, 12...
... Power supply circuit, 21 ... Evaporation source position pupil control mechanism, 22 ... Control drive mechanism Fig. 1

Claims (1)

[Claims] (1) In a vacuum evaporation apparatus using an electron beam as evaporation power, a plurality of evaporation film thicknesses can be detected distributed over a predetermined range 1iK in the direction in which the evaporation material comes from the evaporation source. a, and is configured to control the distribution state of the above-mentioned evaporation material in the flying direction according to the film thickness detection signals from the plurality of evaporation film thickness detectors.
(7) In claim 1, the elaborate means for controlling the distribution pattern tlAyt of the evaporation material in the direction in which it comes is constituted by means for displacing the position of the evaporation source with respect to the direction of incidence of the electron beam. Vacuum evaporation equipment with special features.