JPS5828862A - テ−プキヤリア - Google Patents

テ−プキヤリア

Info

Publication number
JPS5828862A
JPS5828862A JP56127048A JP12704881A JPS5828862A JP S5828862 A JPS5828862 A JP S5828862A JP 56127048 A JP56127048 A JP 56127048A JP 12704881 A JP12704881 A JP 12704881A JP S5828862 A JPS5828862 A JP S5828862A
Authority
JP
Japan
Prior art keywords
hole
tape carrier
insulating film
pad
metal wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56127048A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6234141B2 (enExample
Inventor
Takashi Miyamoto
隆 宮本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56127048A priority Critical patent/JPS5828862A/ja
Publication of JPS5828862A publication Critical patent/JPS5828862A/ja
Publication of JPS6234141B2 publication Critical patent/JPS6234141B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/453—
    • H10W72/0198—
    • H10W70/655—
    • H10W72/701—

Landscapes

  • Wire Bonding (AREA)
JP56127048A 1981-08-13 1981-08-13 テ−プキヤリア Granted JPS5828862A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56127048A JPS5828862A (ja) 1981-08-13 1981-08-13 テ−プキヤリア

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56127048A JPS5828862A (ja) 1981-08-13 1981-08-13 テ−プキヤリア

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP63099776A Division JPS63288038A (ja) 1988-04-22 1988-04-22 テープキャリア

Publications (2)

Publication Number Publication Date
JPS5828862A true JPS5828862A (ja) 1983-02-19
JPS6234141B2 JPS6234141B2 (enExample) 1987-07-24

Family

ID=14950312

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56127048A Granted JPS5828862A (ja) 1981-08-13 1981-08-13 テ−プキヤリア

Country Status (1)

Country Link
JP (1) JPS5828862A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59161848A (ja) * 1983-03-04 1984-09-12 Nec Corp 樹脂封止型半導体装置の製造装置
JPH0179836U (enExample) * 1987-11-17 1989-05-29
US4980219A (en) * 1988-04-06 1990-12-25 Casio Computer Co., Ltd. Carrier tape for bonding IC devices and method of using the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5327364A (en) * 1976-08-26 1978-03-14 Fujitsu Ltd Film carrier integrated circuit and its production
JPS5410867A (en) * 1977-06-25 1979-01-26 Toyota Motor Corp Brake booster for vehicle
JPS54155869A (en) * 1978-05-29 1979-12-08 Seiko Epson Corp Crystal watch

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5327364A (en) * 1976-08-26 1978-03-14 Fujitsu Ltd Film carrier integrated circuit and its production
JPS5410867A (en) * 1977-06-25 1979-01-26 Toyota Motor Corp Brake booster for vehicle
JPS54155869A (en) * 1978-05-29 1979-12-08 Seiko Epson Corp Crystal watch

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59161848A (ja) * 1983-03-04 1984-09-12 Nec Corp 樹脂封止型半導体装置の製造装置
JPH0179836U (enExample) * 1987-11-17 1989-05-29
US4980219A (en) * 1988-04-06 1990-12-25 Casio Computer Co., Ltd. Carrier tape for bonding IC devices and method of using the same
US5019209A (en) * 1988-04-06 1991-05-28 Casio Computer Co., Ltd. Method of manufacturing and using a carrier tape for bonding IC devices

Also Published As

Publication number Publication date
JPS6234141B2 (enExample) 1987-07-24

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