JPS5827392A - Method of plating printed board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of plating a pattern on a printed circuit board.

Conventionally, in order to manufacture a printed circuit board with a plating pattern, first, as shown in FIG. After the formation, electrolytic plating is performed by applying electricity from the current input portion 9 to plate the portion 2. Afterwards, the mask 3 is removed and etching is then performed using the plating as a resist.

However, in this method, it is not possible to plate a part of the pattern, so patterns that do not need to be plated are also plated, so the cost becomes very high, for example, in the case of gold plating. . Also,
Since etching is performed using plating as a resist, overhang of the plating occurs, and there is a risk that the overhanging portion will peel off and cause accidents such as bridging. Furthermore, since the etched side surfaces of the pattern are not plated, the pattern may be corroded.

This invention was made to solve the above-mentioned problems, and it is possible to plate a part of the pattern without causing overhang of the plating, and also to plate the etched side surface of the pattern. The purpose of the present invention is to provide a method for plating a printed circuit board.

In order to achieve this object, in the present invention, conductor films are formed on both sides, and a pattern is formed only on the first surface of the substrate where the conductor films on both sides are electrically connected by the conductor provided on the inner surface of the through hole. A mask is formed on the first surface, leaving a portion to be plated in the pattern, and a mask is formed on the second surface of the substrate, and electrolytic plating is performed to plate the portion to be plated in the pattern. Next, a mask is formed on the entire surface of the first surface, and the second surface is covered with a mask.
Form a pattern on the surface.

FIGS. 2 to 8 are explanatory diagrams of a printed circuit board plating method according to the present invention. First, as shown in FIG. 2, FIG. 6 (cross-sectional view taken along line A-A in FIG. 2), and FIG. The first conductor 7 of the substrate 7 is electrically connected by the conductor 6
The pattern 8 is formed only on the surface (the surface shown in FIG. 2), and the second
No pattern is formed on the surface (the surface shown in FIG. 4). That is, after a resist is formed on a portion of the first surface that will become a pattern and a mask is formed on the entire surface as shown in FIG. 2, etching is performed to remove the resist and mask, and pattern 8 is formed. Next, as shown in FIG. 5, a mask 10 is formed on the first surface, leaving a portion 8a to be plated with a pattern 8, and as shown in FIG. After forming a mask 11 by leaving a portion of the mask 10, electrolytic plating is performed by applying electricity from the current input portion 9, plating is applied to the portion 8a to be plated, and the mask 10.11 is removed later.

In this case, the portion 8a to be plated is the pattern 8° conductor 6.
．． It is electrically connected to the current input portion 9 via the conductor film 4 on the second surface. Next, as shown in FIG. 7, a mask 12 is formed on the entire surface of the first surface, and as shown in FIG. 8, a resist 13 is formed on the part that will become the pattern on the second surface, and etching is performed. Later, mask 12. By removing the resist 13 and forming a pattern on the second surface, a printed circuit board in which only nine portions 8a are plated is completed.

As explained above, in the printed circuit board plating method according to the present invention, it is possible to plate only a part of the turn and only the center turn of the printed circuit board, so for example, in the case of gold plating, etc. Since gold plating can be applied only to the necessary parts of the pattern, the cost is very low. Furthermore, since the plating is applied after forming the pattern, overhang of the plating does not occur, so there is no risk of accidents such as bridging. Furthermore, since the etched side surfaces of the pattern are also plated, the pattern is not corroded and the quality is stable. Also.

Since plating is performed by electrolytic plating, the thickness of the plating can be freely controlled. in this way.

The effects of this invention are remarkable.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram of a conventional printed circuit board plating method, and FIGS. 2 to 8 are explanatory diagrams of a printed circuit board plating method according to the present invention. 4... Conductor film 5... Through hole 6...
Conductor 7... Board 8... Nokuta
- Plating part 8a of pattern 8 9... Power input part 10 to 12... Mask 16... Resist agent Junnosuke Nakamura 1F1 Figure 2 Figure 1'3 Figure 4 Figure 5 Figure 1-7Figure 2

Claims (1)

[Claims] A conductor film is formed on both sides, and a pattern is formed only on the first side of the substrate where the conductor films on both sides are electrically connected by the conductor provided on the inner surface of the through hole, and then the part where the pattern is plated is left. A mask is formed on the first surface, and a mask is formed on the second surface of the substrate, electrolytic plating is performed, and the portions of the pattern to be plated are plated, and then the entire surface of the first surface is plated. A method for plating a printed circuit board, comprising forming a mask to form a pattern on the second surface.