JPS5827118A - レーザ穴あけ装置 - Google Patents

レーザ穴あけ装置

Info

Publication number
JPS5827118A
JPS5827118A JP56124714A JP12471481A JPS5827118A JP S5827118 A JPS5827118 A JP S5827118A JP 56124714 A JP56124714 A JP 56124714A JP 12471481 A JP12471481 A JP 12471481A JP S5827118 A JPS5827118 A JP S5827118A
Authority
JP
Japan
Prior art keywords
spot
laser light
face
annular
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56124714A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0348485B2 (enrdf_load_stackoverflow
Inventor
Ken Ishikawa
憲 石川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56124714A priority Critical patent/JPS5827118A/ja
Publication of JPS5827118A publication Critical patent/JPS5827118A/ja
Publication of JPH0348485B2 publication Critical patent/JPH0348485B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0734—Shaping the laser spot into an annular shape

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP56124714A 1981-08-11 1981-08-11 レーザ穴あけ装置 Granted JPS5827118A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56124714A JPS5827118A (ja) 1981-08-11 1981-08-11 レーザ穴あけ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56124714A JPS5827118A (ja) 1981-08-11 1981-08-11 レーザ穴あけ装置

Publications (2)

Publication Number Publication Date
JPS5827118A true JPS5827118A (ja) 1983-02-17
JPH0348485B2 JPH0348485B2 (enrdf_load_stackoverflow) 1991-07-24

Family

ID=14892284

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56124714A Granted JPS5827118A (ja) 1981-08-11 1981-08-11 レーザ穴あけ装置

Country Status (1)

Country Link
JP (1) JPS5827118A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002302117A (ja) * 2001-04-06 2002-10-15 Harman Kikaku:Kk 包装容器
EP1508397A1 (de) * 2003-08-21 2005-02-23 Leister Process Technologies Verfahren und Vorrichtung zum simultanen Erwärmen von Materialien
EP1666188A3 (en) * 2004-12-01 2006-08-16 Fanuc Ltd Laser processing device with a light gathering member for irradiating the workpiece with a shape other than a one-point like profile, i.e. like a circle or a ring
CN100457362C (zh) * 2004-01-30 2009-02-04 武汉天宇激光数控技术有限责任公司 激光环切打孔方法及其装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4917195A (enrdf_load_stackoverflow) * 1972-03-30 1974-02-15
JPS5034821A (enrdf_load_stackoverflow) * 1973-07-31 1975-04-03

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4917195A (enrdf_load_stackoverflow) * 1972-03-30 1974-02-15
JPS5034821A (enrdf_load_stackoverflow) * 1973-07-31 1975-04-03

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002302117A (ja) * 2001-04-06 2002-10-15 Harman Kikaku:Kk 包装容器
EP1508397A1 (de) * 2003-08-21 2005-02-23 Leister Process Technologies Verfahren und Vorrichtung zum simultanen Erwärmen von Materialien
CN1305631C (zh) * 2003-08-21 2007-03-21 莱斯特加工技术公司 同时加热材料的方法和装置
CN100457362C (zh) * 2004-01-30 2009-02-04 武汉天宇激光数控技术有限责任公司 激光环切打孔方法及其装置
EP1666188A3 (en) * 2004-12-01 2006-08-16 Fanuc Ltd Laser processing device with a light gathering member for irradiating the workpiece with a shape other than a one-point like profile, i.e. like a circle or a ring

Also Published As

Publication number Publication date
JPH0348485B2 (enrdf_load_stackoverflow) 1991-07-24

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