JPS5824453Y2 - 発光ダイオ−ド基板 - Google Patents

発光ダイオ−ド基板

Info

Publication number
JPS5824453Y2
JPS5824453Y2 JP6425478U JP6425478U JPS5824453Y2 JP S5824453 Y2 JPS5824453 Y2 JP S5824453Y2 JP 6425478 U JP6425478 U JP 6425478U JP 6425478 U JP6425478 U JP 6425478U JP S5824453 Y2 JPS5824453 Y2 JP S5824453Y2
Authority
JP
Japan
Prior art keywords
emitting diode
light emitting
resin
wiring
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP6425478U
Other languages
English (en)
Japanese (ja)
Other versions
JPS54165174U (enrdf_load_stackoverflow
Inventor
昌昭 梅崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP6425478U priority Critical patent/JPS5824453Y2/ja
Publication of JPS54165174U publication Critical patent/JPS54165174U/ja
Application granted granted Critical
Publication of JPS5824453Y2 publication Critical patent/JPS5824453Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
JP6425478U 1978-05-11 1978-05-11 発光ダイオ−ド基板 Expired JPS5824453Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6425478U JPS5824453Y2 (ja) 1978-05-11 1978-05-11 発光ダイオ−ド基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6425478U JPS5824453Y2 (ja) 1978-05-11 1978-05-11 発光ダイオ−ド基板

Publications (2)

Publication Number Publication Date
JPS54165174U JPS54165174U (enrdf_load_stackoverflow) 1979-11-20
JPS5824453Y2 true JPS5824453Y2 (ja) 1983-05-25

Family

ID=28968207

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6425478U Expired JPS5824453Y2 (ja) 1978-05-11 1978-05-11 発光ダイオ−ド基板

Country Status (1)

Country Link
JP (1) JPS5824453Y2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9502624B2 (en) 2006-05-18 2016-11-22 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58194382A (ja) * 1982-05-08 1983-11-12 Matsushita Electric Ind Co Ltd 発光装置用電極構体
JPH0639467Y2 (ja) * 1989-03-01 1994-10-12 星和電機株式会社 Ｌｅｄ表示素子

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9502624B2 (en) 2006-05-18 2016-11-22 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
US9634204B2 (en) 2006-05-18 2017-04-25 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
US9929318B2 (en) 2006-05-18 2018-03-27 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
US10263161B2 (en) 2006-05-18 2019-04-16 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
US10686102B2 (en) 2006-05-18 2020-06-16 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
US10971656B2 (en) 2006-05-18 2021-04-06 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
US11631790B2 (en) 2006-05-18 2023-04-18 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same

Also Published As

Publication number Publication date
JPS54165174U (enrdf_load_stackoverflow) 1979-11-20

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