JPS5823464A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS5823464A
JPS5823464A JP56122655A JP12265581A JPS5823464A JP S5823464 A JPS5823464 A JP S5823464A JP 56122655 A JP56122655 A JP 56122655A JP 12265581 A JP12265581 A JP 12265581A JP S5823464 A JPS5823464 A JP S5823464A
Authority
JP
Japan
Prior art keywords
holding member
terminal holding
conductive terminals
holes
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56122655A
Other languages
English (en)
Japanese (ja)
Other versions
JPS622702B2 (cg-RX-API-DMAC10.html
Inventor
Tsutomu Kamata
勉 鎌田
Takeyoshi Masuno
桝野　雄義
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56122655A priority Critical patent/JPS5823464A/ja
Publication of JPS5823464A publication Critical patent/JPS5823464A/ja
Publication of JPS622702B2 publication Critical patent/JPS622702B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W90/00—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP56122655A 1981-08-04 1981-08-04 半導体装置の製造方法 Granted JPS5823464A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56122655A JPS5823464A (ja) 1981-08-04 1981-08-04 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56122655A JPS5823464A (ja) 1981-08-04 1981-08-04 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5823464A true JPS5823464A (ja) 1983-02-12
JPS622702B2 JPS622702B2 (cg-RX-API-DMAC10.html) 1987-01-21

Family

ID=14841344

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56122655A Granted JPS5823464A (ja) 1981-08-04 1981-08-04 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5823464A (cg-RX-API-DMAC10.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60258458A (ja) * 1984-06-06 1985-12-20 Mitsubishi Heavy Ind Ltd 溶融めつき装置
JPS61266560A (ja) * 1985-05-22 1986-11-26 Nippon Steel Corp 薄目付溶融メツキ法
JPS62103353A (ja) * 1985-10-31 1987-05-13 Nippon Steel Corp 薄目付溶融メツキ法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60258458A (ja) * 1984-06-06 1985-12-20 Mitsubishi Heavy Ind Ltd 溶融めつき装置
JPS61266560A (ja) * 1985-05-22 1986-11-26 Nippon Steel Corp 薄目付溶融メツキ法
JPS62103353A (ja) * 1985-10-31 1987-05-13 Nippon Steel Corp 薄目付溶融メツキ法

Also Published As

Publication number Publication date
JPS622702B2 (cg-RX-API-DMAC10.html) 1987-01-21

Similar Documents

Publication Publication Date Title
CN104425471A (zh) 半导体装置及半导体装置的制造方法
JPH09330950A (ja) 半導体装置及びその製造方法
CN104425435A (zh) 具有散热器的重叠模塑的基板-芯片布置
JPS62198139A (ja) 電力用半導体モジユ−ル及びこのモジユ−ルの製造方法
CN101675520A (zh) 电力用半导体模块
US7364684B2 (en) Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels
JPS62202548A (ja) 半導体装置
JPH1022435A (ja) 半導体装置及びその製造方法
JPH05121644A (ja) 電子回路デバイス
JPS5823464A (ja) 半導体装置の製造方法
US6887777B2 (en) Method for connecting an integrated circuit to a substrate and corresponding circuit arrangement
JPH0661372A (ja) ハイブリッドｉｃ
JPH10256411A (ja) 電力用半導体モジュール
KR100199279B1 (ko) 전력용 반도체 모듈
JPS617692A (ja) 導体ピンの固着方法および導体ピン固着のプリント配線板
JPS63174344A (ja) ピングリツドアレイ
JPH1168254A (ja) 光モジュール及び光モジュールの製造方法
JP2000323646A (ja) 絶縁材料ケース及び半導体装置
JPH0236281Y2 (cg-RX-API-DMAC10.html)
JP2621722B2 (ja) 半導体装置
JP2721790B2 (ja) 半導体装置の封止方法
JPS6365657A (ja) ピングリツドアレイ
JPH02203555A (ja) 半導体装置
JPH04262376A (ja) 混成集積回路装置
JPS61216438A (ja) 封止された電子部品の製造方法