JPS58222107A - 熱硬化性樹脂組成物 - Google Patents
熱硬化性樹脂組成物Info
- Publication number
- JPS58222107A JPS58222107A JP10506482A JP10506482A JPS58222107A JP S58222107 A JPS58222107 A JP S58222107A JP 10506482 A JP10506482 A JP 10506482A JP 10506482 A JP10506482 A JP 10506482A JP S58222107 A JPS58222107 A JP S58222107A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- cyanate
- epoxy resin
- epoxy
- masking agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10506482A JPS58222107A (ja) | 1982-06-16 | 1982-06-16 | 熱硬化性樹脂組成物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10506482A JPS58222107A (ja) | 1982-06-16 | 1982-06-16 | 熱硬化性樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58222107A true JPS58222107A (ja) | 1983-12-23 |
JPS6228970B2 JPS6228970B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-06-23 |
Family
ID=14397525
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10506482A Granted JPS58222107A (ja) | 1982-06-16 | 1982-06-16 | 熱硬化性樹脂組成物 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58222107A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6534179B2 (en) | 2001-03-27 | 2003-03-18 | International Business Machines Corporation | Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and use |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55160021A (en) * | 1979-05-30 | 1980-12-12 | Mitsubishi Electric Corp | Thermosetting resin composition |
-
1982
- 1982-06-16 JP JP10506482A patent/JPS58222107A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55160021A (en) * | 1979-05-30 | 1980-12-12 | Mitsubishi Electric Corp | Thermosetting resin composition |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6534179B2 (en) | 2001-03-27 | 2003-03-18 | International Business Machines Corporation | Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and use |
Also Published As
Publication number | Publication date |
---|---|
JPS6228970B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-06-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4473674A (en) | Process for improving mechanical properties of epoxy resins by addition of cobalt ions | |
US4309512A (en) | Heat-resistant thermosetting resin composition | |
JPH03504025A (ja) | ポリイミド樹脂 | |
EP0747434A2 (en) | Epoxy resin composition and adhesive based thereon | |
JPS58222107A (ja) | 熱硬化性樹脂組成物 | |
JPH06172495A (ja) | エポキシ樹脂組成物 | |
JPS6257650B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
JPH06192396A (ja) | 一液型エポキシ樹脂組成物 | |
JPS6395221A (ja) | 熱硬化性エポキシ樹脂組成物 | |
JPH0478433A (ja) | 無機粉体の表面処理方法 | |
JPH0337220A (ja) | エポキシ樹脂硬化剤 | |
JPS5923330B2 (ja) | 耐熱性エポキシ樹脂組成物 | |
JPS58138725A (ja) | 熱硬化性樹脂組成物 | |
JP3150366B2 (ja) | 樹脂組成物の硬化物 | |
JP2864842B2 (ja) | 光半導体封止用エポキシ樹脂組成物 | |
JPS555932A (en) | Cathode deposition-type electrodeposition coating composition | |
JPH0721048B2 (ja) | エポキシ樹脂組成物、及びその用途 | |
JPS5964623A (ja) | エポキシ樹脂注型材料 | |
JP2688399B2 (ja) | 含浸用熱硬化性樹脂組成物 | |
JPH1060231A (ja) | 封止用エポキシ樹脂組成物 | |
JPH0160051B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
JPS5941358A (ja) | 耐熱接着剤用組成物 | |
JPH04146918A (ja) | 樹脂組成物、透明薄膜の形成法及び透明薄膜 | |
JPS59187056A (ja) | 熱硬化性樹脂組成物 | |
JPS60210685A (ja) | 耐熱接着剤用組成物 |