JPS58215274A - Connection of lead wire of video head - Google Patents

Connection of lead wire of video head

Info

Publication number
JPS58215274A
JPS58215274A JP9874982A JP9874982A JPS58215274A JP S58215274 A JPS58215274 A JP S58215274A JP 9874982 A JP9874982 A JP 9874982A JP 9874982 A JP9874982 A JP 9874982A JP S58215274 A JPS58215274 A JP S58215274A
Authority
JP
Japan
Prior art keywords
solder
lead wire
flux
tip
video head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9874982A
Other languages
Japanese (ja)
Other versions
JPS6121745B2 (en
Inventor
Tsugunori Masuda
増田　二紀
Hisashi Kimoto
恒 木本
Minoru Adachi
稔 安達
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tamura Corp
Original Assignee
Tamura Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamura Corp filed Critical Tamura Corp
Priority to JP9874982A priority Critical patent/JPS58215274A/en
Publication of JPS58215274A publication Critical patent/JPS58215274A/en
Publication of JPS6121745B2 publication Critical patent/JPS6121745B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

PURPOSE:To solder the tip of a lead wire surely, by supplying spherical solder on flux coated on the connecting part of the lead wire of a head, making it conical by irradiation of a beam, and after coating flux, pressing the tip of the lead wire and irradiating a beam. CONSTITUTION:Flux 11 is applied by dropping onto pattern faces 7 on both sides of a video head 4. Then spherical solder 12 is supplied onto the flux 11. The spherical solder 12 is molten by a beam 14 irradiated from a beam irradiating unit 13. After melting, flux 16 is dropped to the solder 15 solidified to conical form. A core wire at the tip of the lead wire 6 is pressed against the conical solidified solder 15. The solder 15 is molten by irradiating a beam onto the solidified solder 15 from a beam irradiating unit 18. Thus, the core wire of the lead wire is burried in the molten solder 20 to permeate the solder 20. Then, by solidification of the solder 20, the core wire is soldered firmly to the pattern faces 7.

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明は、ビデオヘッド（ＶＴＲヘッド）のリード線接
続方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a lead wire connection method for a video head (VTR head).

〔発明の技術的背景〕[Technical background of the invention]

従来のビデオヘッドのリード線接続方法は、ビデオヘッ
ドのリード線接続部に７ラツクスを塗布し、このフラッ
クス上に球状はんだを供給し、この球状はんだにリード
線の先端を近づけ、この球状はんだをビーム照射によっ
て溶解してリード線に浸透させ、その後に固化したはん
だによってリード線の先端とビデオヘッドのリード線接
続部とを固（はんだ付けすることによって行なっている
。The conventional video head lead wire connection method is to apply 7lux to the lead wire connection part of the video head, supply spherical solder onto this flux, bring the tip of the lead wire close to this spherical solder, and then apply this spherical solder. This is done by melting the solder by beam irradiation and permeating it into the lead wire, and then solidifying the solder to firmly (solder) the tip of the lead wire and the lead wire connection part of the video head.

〔背景技術の問題点〕[Problems with background technology]

上記従来の方法は、球状はんだに対してリード線の先端
を直接近づけるようにしているため、リード線が近づき
すぎると、このリード線が球状はんだを動かしてしまっ
て位置ずれが生じ、またリード線の先端と球状はんだと
が離れていると、ビーム照射によって溶解したはんだが
リード線の先端に浸透することなく離れたまま固化して
しまうおそれがあり、このように１リード線の先端と球
状はんだとの近づきぐあいを全ての場合（適度圧保つこ
とは容易ではない。In the conventional method described above, the tip of the lead wire is brought directly close to the spherical solder, so if the lead wire is brought too close, the lead wire moves the spherical solder, causing misalignment. If the tip of the lead wire and the spherical solder are far apart, there is a risk that the solder melted by the beam irradiation will solidify without penetrating the tip of the lead wire. It is not easy to maintain a moderate pressure in all cases.

〔発明の目的〕[Purpose of the invention]

本発明は、ビデオヘッドのリード線接続部とリード線の
先端とを確実にはんだ付けできる方法を提供しようとす
るものである。The present invention aims to provide a method for reliably soldering the lead wire connection portion of a video head and the tip of the lead wire.

〔発明の概要〕[Summary of the invention]

本発明の構成は、ビデオヘッドのリード線接続部に７ラ
ツクスを塗布し、このスラックス上に球状はんだを供給
し、この球状はんだをビーム照射によって溶解し、この
溶解後に山形に固化１７たをまんだに７ラツクスを塗布
し、この山形の１んだに対しリード線の先端を押付け、
この山形のしまんだをビーム照射によつ℃溶解し、その
後に固化したはんだによってリード線の先端とビデオへ
゛ノドのリード線接続部とをはんだ付けするビデオへ゛
ンドのリード線接続方法である。The structure of the present invention is to apply 7lux to the lead wire connection part of the video head, supply spherical solder on this slack, melt the spherical solder by beam irradiation, and after melting, solidify into a mountain shape. Apply Dani 7lux, press the tip of the lead wire against this chevron-shaped solder,
This method of connecting video lead wires involves melting this mountain-shaped strip by beam irradiation at °C, and then using the solidified solder to solder the tip of the lead wire to the lead wire connection part of the video lead wire. .

〔発明の実施例〕[Embodiments of the invention]

以下、本発明を図面に示す実施例を参照して詳細に説明
する。Hereinafter, the present invention will be explained in detail with reference to embodiments shown in the drawings.

矛１図に示すものは、ビデオヘッドにリード線がはんだ
付けされた状態であり、搬送用のｌ（し゛ノド（１）上
にビデオヘッド取付は本体（２）が載せられ、この本体
（２）の２個所にビス（３）によってビデオへ°ノド（
４）が固定され、このビデオヘッド（４）の近傍に穿設
されたリード線挿通孔（５）にリード線（６）が挿入さ
れ、このリード線（６）の上端折曲部の先端が第３図に
示すよ５ＶＣ−ビデオヘッド（４）のリード線接続部と
してのパターン面（力にはんだ付けされている。Figure 1 shows a video head with lead wires soldered to it, a main body (2) on which the video head is attached is placed on a transport lug (1), and a main body (2) on which the video head is attached is placed. ) to the video using the two screws (3) at the throat (
4) is fixed, the lead wire (6) is inserted into the lead wire insertion hole (5) drilled near this video head (4), and the tip of the upper bent part of this lead wire (6) As shown in FIG. 3, the pattern surface (which is soldered to the surface) as the lead wire connection part of the 5VC-video head (4) is soldered.

このようなビデオヘッド（４）Ｋ対するリード線（６）
のはんだ付は工程は、牙２図囚に示すビデオヘッド（４
）の両側のパターン面（７）に対して、牙２図の）に示
すように、フラックスＱｌ）を点滴塗布し、さらにパレ
ット（１）を次工程に搬送し一１ｔ２図（ＯＫ示すよう
に、スラックス（１１）上に球状はんだＱ２を供給し、
さらにパレット（１）を次工程に搬送して矛２図υに示
すように、球状はんだ（Ｉｚをビーム照射ユニット（Ｉ
３１から照射されたビームＩによって溶解し、さらにパ
レット（１）を次工程に搬送して牙２図（ト）に示すよ
うに、溶解後に山形に固化したはんだ（１５１にフラッ
クス（Ｌｏを点滴塗布し、さらにパレット（１）を次工
程に搬送して牙２図［Ｆ］に示すように、山形の固化は
んだＱ９に対しリード線（６）の先端の芯線を押付け、
さらにこの位置で牙２図（２）に示すように、山形の固
化ハんだ（１５１にビーム照射ユニット（１８１から照
射されたビームＱｌを当ててこの同化はんだＱ９を溶解
すると、それまで固化はんだ霞の表面に押＋１けられ曵
いたリード線（６）の芯線は溶解はんだ（イ）中に埋没
し、このリード線（６）の芯線に溶解はんだ（至）が浸
透し、その後に矛３図に示すように同化したはんだＣＩ
’ｌ）Ｋよって、リード線（６）の先端の芯線とビデオ
ヘッド（４）のパターン面（７）とを固くはんだ付げす
る。Lead wire (6) for such a video head (4) K
The soldering process is for the video head (4) shown in Figure 2.
), as shown in Fig. 2), apply flux Ql) dropwise, and then transport the pallet (1) to the next process. , supplying the spherical solder Q2 onto the slacks (11),
Furthermore, the pallet (1) is transported to the next process, and the spherical solder (Iz) is transferred to the beam irradiation unit (I) as shown in Figure 2.
The pallet (1) is melted by the beam I irradiated from 31, and the pallet (1) is further transported to the next process, and as shown in Figure 2 (G), flux (Lo is dripped onto the solder (151) that has solidified into a mountain shape after melting. Then, the pallet (1) is transported to the next process, and as shown in Figure 2 [F], the core wire at the tip of the lead wire (6) is pressed against the chevron-shaped solidified solder Q9.
Furthermore, as shown in Fig. 2 (2) at this position, when the beam Ql emitted from the beam irradiation unit (181) is applied to the chevron-shaped solidified solder (151) to melt this assimilated solder Q9, the solidified solder (151) melts. The core wire of the lead wire (6) that was pushed to the surface of the mist was buried in the melted solder (a), and the melted solder (see) penetrated into the core wire of this lead wire (6), and then the lead wire (6) was pulled out. Assimilated solder CI as shown in the figure
'l)K Therefore, firmly solder the core wire at the tip of the lead wire (6) and the pattern surface (7) of the video head (4).

〔発明の効果〕〔Effect of the invention〕

本発明によれば、ビデオヘッドのリード線接続部にフラ
ックスを塗布し、このフラウクス上に球状はんだを供給
し、この球状はんだをビーム照射によって溶解し、この
溶解後に山形に同化したはんだに７ラツクスを塗布し、
この山形のはんだに対しリード線の先端を押付け、この
山形のはんだをビーム照射によって溶解し、その後に固
化したはんだ罠よってリード線の先端とビデオヘッドの
リード線接続部とをはんだ付ゆするようにしたから、リ
ード線のない状態で球状はんだを溶解して得た山形の固
化はんだは固くリード線接続部に固着していて、この山
形の固化はんだにリード線の先端を押付けてもこのはん
だが位置ずれをおこすおそれがな（、しかもこの山形の
固化はんだにリード線の先端を押付けた状態でこのはん
だをビーム照射によって溶解すると、その押付は力によ
ってリード線の先端は自然に溶解はんだ中に埋没して、
確実にはんだ付けされる。According to the present invention, flux is applied to the lead wire connection portion of the video head, spherical solder is supplied on the flux, the spherical solder is melted by beam irradiation, and after the melting, 7 flux is applied to the solder assimilated into a chevron shape. Apply and
The tip of the lead wire is pressed against this chevron-shaped solder, the chevron-shaped solder is melted by beam irradiation, and then the solidified solder trap is used to solder the tip of the lead wire and the lead wire connection part of the video head. Therefore, the chevron-shaped solidified solder obtained by melting the spherical solder without a lead wire firmly adheres to the lead wire connection part, and even if the tip of the lead wire is pressed against this chevron-shaped solidified solder, this solder will not melt. (However, if the tip of the lead wire is pressed against this chevron-shaped solidified solder and the solder is melted by beam irradiation, the force of the pressing will cause the tip of the lead wire to naturally move into the melted solder.) buried in
Soldered securely.

【図面の簡単な説明】[Brief explanation of drawings]

牙１図はパレット上のビデオヘッドを示す斜視図、牙２
図は本発明のビデオヘッドのリード線接続方法の一実施
例を示す断面図、１・３図はリード線が接続されたビデ
オヘッドの斜視図である。 （４）・・ビデオヘッド、（６）・・リード線、（刀・
・リード線接続部としてのパターン面、αｌｌφ・フラ
ックス、０２）・・球状はんだ、■・・ビーム、ｔｔＳ
＠参山形の固化はんだ、α０・・フラックス、（Ｉ９・
拳ビーム、翰・・溶解はんだ、Ｃ１１ｌ・・固化はんだ
。 （。 （ （Fang 1 is a perspective view showing the video head on the pallet, Fang 2
The figure is a sectional view showing an embodiment of the video head lead wire connection method of the present invention, and Figures 1 and 3 are perspective views of the video head to which the lead wires are connected. (4)...Video head, (6)...Lead wire, (sword/
・Pattern surface as lead wire connection part, αllφ・Flux, 02)・・Spherical solder, ■・・Beam, ttS
@ Sanyamagata solidified solder, α0... flux, (I9...
Fist beam, kiln: molten solder, C11l: solidified solder. (. ((

Claims (1)

【特許請求の範囲】[Claims] （１）　　ビデオヘッドのリード線接続部にフラックス
を塗布し、このフラックス上に球状はんだを供給し、こ
の球状はんだをビーム照射によって溶解し、この溶解後
に山形に固化したはんだにフラックスを塗布し、この山
形のはんだに対しリード線の先端を押付け、この山形の
はんだをビーム照射によって溶解し、その後に固化した
はんだによってリード線の先端とビデオヘッドのリード
線接続部とをはんだ付けすることを特徴とするビデオヘ
ッドのリード線接続方法。(1) Apply flux to the lead wire connection part of the video head, supply spherical solder onto this flux, melt this spherical solder by beam irradiation, apply flux to the solder that solidifies into a mountain shape after melting, The tip of the lead wire is pressed against this chevron-shaped solder, the chevron-shaped solder is melted by beam irradiation, and then the solidified solder is used to solder the tip of the lead wire and the lead wire connection part of the video head. How to connect the video head lead wires.
JP9874982A 1982-06-09 1982-06-09 Connection of lead wire of video head Granted JPS58215274A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9874982A JPS58215274A (en) 1982-06-09 1982-06-09 Connection of lead wire of video head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9874982A JPS58215274A (en) 1982-06-09 1982-06-09 Connection of lead wire of video head

Publications (2)

Publication Number Publication Date
JPS58215274A true JPS58215274A (en) 1983-12-14
JPS6121745B2 JPS6121745B2 (en) 1986-05-28

Family

ID=14228107

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9874982A Granted JPS58215274A (en) 1982-06-09 1982-06-09 Connection of lead wire of video head

Country Status (1)

Country Link
JP (1) JPS58215274A (en)

Also Published As

Publication number Publication date
JPS6121745B2 (en) 1986-05-28

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