JPS6121745B2 - - Google Patents
Info
- Publication number
- JPS6121745B2 JPS6121745B2 JP9874982A JP9874982A JPS6121745B2 JP S6121745 B2 JPS6121745 B2 JP S6121745B2 JP 9874982 A JP9874982 A JP 9874982A JP 9874982 A JP9874982 A JP 9874982A JP S6121745 B2 JPS6121745 B2 JP S6121745B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- lead wire
- video head
- flux
- spherical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 64
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 44
- 230000004907 flux Effects 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 12
- 238000002844 melting Methods 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 7
- 238000005476 soldering Methods 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000009835 boiling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は、ビデオヘツド（VTRヘツド）のリ
ード線接続方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a lead wire connection method for a video head (VTR head).
従来のビデオヘツドのリード線接続方法は、ビ
デオヘツドのリード線接続部にフラツクスを塗布
し、このフラツクス上に球状はんだを供給し、こ
の球状はんだにリード線の先端を近づけ、この球
状はんだをビーム照射によつて溶解してリード線
に浸透させ、その後に固化したはんだによつてリ
ード線の先端とビデオヘツドのリード線接続部と
を固くはんだ付けすることによつて行なつてい
る。
The conventional method for connecting video head lead wires is to apply flux to the lead wire connection part of the video head, supply spherical solder onto the flux, bring the tip of the lead wire close to the spherical solder, and beam the spherical solder. This is done by melting the solder by irradiation and permeating it into the lead wire, and then using the solidified solder to firmly solder the tip of the lead wire and the lead wire connection part of the video head.
一般的に、はんだ付けは、はんだとともに被は
んだ付け物をも加熱する必要がある。
Generally, soldering requires heating the solder as well as the object to be soldered.
そこで上記従来方法を行う場合、球状はんだと
リード線とを極わずかな間隙（接触するかしない
かという微細な間隙）を介して横に並べ、この球
状はんだとリード線とに同一ビームの半分づつを
照射して両方を同時に加熱している。 Therefore, when performing the above conventional method, the spherical solder and the lead wire are arranged side by side with an extremely small gap (a minute gap that may or may not be in contact with each other), and half of the same beam is applied to the spherical solder and the lead wire. irradiates and heats both at the same time.
したがつて球状はんだは、リード線に対向する
片側が先に加熱されることなる。 Therefore, the one side of the spherical solder facing the lead wire is heated first.
この球状はんだの片側の加熱は、その下側に塗
布されているフラツクスのアンバランスな突沸現
象を引起こす。すなわち、球状はんだの片側のフ
ラツクスは、ビームの照射により急激に沸点温度
まで温度上昇し、突発的に蒸発するが、そのとき
に発生する蒸気圧が球状はんだの片側に作用し
て、球状はんだが溶解する直前に横にずれること
がある。したがつて不良品が出る確率も高い。 Heating one side of the spherical solder causes an unbalanced bumping phenomenon of the flux applied to the lower side. In other words, the temperature of the flux on one side of the spherical solder rapidly rises to the boiling point temperature due to beam irradiation and suddenly evaporates, but the vapor pressure generated at that time acts on one side of the spherical solder, causing the spherical solder to It may shift sideways just before it dissolves. Therefore, there is a high probability that defective products will be produced.
このため、この従来のはんだ付け方法は高価な
ビデオヘツドには適さない。 Therefore, this conventional soldering method is not suitable for expensive video heads.
また球状はんだは、フラツクスの粘性のみによ
つて定位置を保つているから、この球状はんだに
対してリード線を近づけすぎると、このリード線
が球状はんだを動かしてしまつて位置ずれが生
じ、またリード線の先端と球状はんだとが離れて
いると、ビーム照射によつて溶解したはんだがリ
ード線の先端に浸透することなく離れたまま固化
してしまうおそれがある。 Also, since the spherical solder is kept in place only by the viscosity of the flux, if the lead wire is brought too close to the spherical solder, the lead wire will move the spherical solder, causing the position to shift. If the tip of the lead wire and the spherical solder are separated from each other, there is a risk that the solder melted by the beam irradiation will not penetrate into the tip of the lead wire and will solidify while being separated.
しかし、リード線の先端と球状はんだとの近づ
きぐあいを、接触するかしないかという微妙な状
態に保持することは非常に困難であり、これも不
良品の出る確率を高める原因となつている。 However, it is extremely difficult to keep the tip of the lead wire and the spherical solder in a delicate state of contact or non-contact, which also increases the probability of producing defective products.
本発明は、ビデオヘツドのリード線接続部とリ
ード線の先端とを確実にはんだ付けできる方法を
提供しようとするものである。
SUMMARY OF THE INVENTION The present invention provides a method for reliably soldering the lead wire connection portion of a video head to the tip of the lead wire.
本発明の構成は、ビデオヘツドのリード線接続
部にフラツクスを塗布し、このフラツクス上に球
状はんだを供給し、この球状はんだをビーム照射
によつて溶解し、この溶解後に山形に固化したは
んだにフラツクスを塗布し、この山形のはんだに
対しリード線の先端を押付け、この山形のはんだ
をビーム照射によつて溶解し、その後に固化した
はんだによつてリード線の先端とビデオヘツドの
リード線接続部とをはんだ付けするビデオヘツド
のリード線接続方法である。
The structure of the present invention is to apply flux to the lead wire connection part of the video head, supply spherical solder onto the flux, melt the spherical solder by beam irradiation, and after melting, the solder solidifies into a mountain shape. Apply flux, press the tip of the lead wire against this chevron-shaped solder, melt the chevron-shaped solder by beam irradiation, and then use the solidified solder to connect the tip of the lead wire to the lead wire of the video head. This is a video head lead wire connection method that involves soldering the parts.
以下、本発明を図面に示す実施例を参照して詳
細に説明する。
Hereinafter, the present invention will be explained in detail with reference to embodiments shown in the drawings.
第１図に示すものは、ビデオヘツドにリード線
がはんだ付けされた状態であり、搬送用のパレツ
ト１上にビデオヘツド取付け本体２が載せられ、
この本体２の２個所にビス３によつてビデオヘツ
ド４が固定され、このビデオヘツド４の近傍に穿
設されたリード線挿通孔５にリード線６が挿入さ
れ、このリード線６の上端折曲部の先端が第３図
に示すようにビデオヘツド４のリード線接続部と
してのパターン面７にはんだ付けされている。 What is shown in FIG. 1 is a state in which lead wires are soldered to the video head, and the video head mounting body 2 is placed on a pallet 1 for transportation.
A video head 4 is fixed to two parts of the main body 2 with screws 3, a lead wire 6 is inserted into a lead wire insertion hole 5 drilled near the video head 4, and the upper end of the lead wire 6 is bent. The tip of the curved portion is soldered to a pattern surface 7 serving as a lead wire connection portion of the video head 4, as shown in FIG.
このようなビデオヘツド４に対するリード線６
のはんだ付け工程は、第２図Ａに示すビデオヘツ
ド４の両側のパターン面７に対して、第２図Ｂに
示すように、フラツクス１１を点滴塗布し、さら
にパレツト１を次工程に搬送して第２図Ｃに示す
ように、フラツクス１１上に球状はんだ１２を供
給し、さらにパレツト１を次工程に搬送して第２
図Ｄに示すように、球状はんだ１２をビーム照射
ユニツト１３から照射されたビーム１４によつて
溶解し、さらにパレツト１を次工程に搬送して第
２図Ｅに示すように、溶解後に山形に固化したは
んだ１５にフラツクス１６を点滴塗布し、さらに
パレツト１を次工程に搬送して第２図Ｆに示すよ
うに、山形の固化はんだ１５に対しリード線６の
先端の芯線を押付け、さらにこの位置で第２図Ｇ
に示すように、山形の固化はんだ１５にビーム照
射ユニツト１８から照射されたビーム１９を当て
てこの固化はんだ１５を溶解すると、それまで固
化はんだ１５の表面に押付けられていたリード線
６の芯線は溶解はんだ２０中に埋没し、このリー
ド線６の芯線に溶解はんだ２０が浸透し、そお後
に第３図に示すように固化したはんだ２１によつ
て、リード線６の先端の芯線とビデオヘツド４の
パターン面７とを固くはんだ付けする。 A lead wire 6 for such a video head 4
In the soldering process, as shown in FIG. 2B, flux 11 is applied dropwise to the pattern surfaces 7 on both sides of the video head 4 shown in FIG. 2A, and then the pallet 1 is transported to the next process. Then, as shown in FIG. 2C, the spherical solder 12 is supplied onto the flux 11, and the pallet 1 is further conveyed to the next process, and the second process is carried out.
As shown in Figure D, the spherical solder 12 is melted by the beam 14 irradiated from the beam irradiation unit 13, and the pallet 1 is then transported to the next process, where it is shaped into a mountain shape after melting, as shown in Figure 2E. Flux 16 is applied dropwise to the solidified solder 15, and then the pallet 1 is transported to the next process, and as shown in FIG. Figure 2G in position
As shown in the figure, when the beam 19 emitted from the beam irradiation unit 18 is applied to the chevron-shaped solidified solder 15 to melt the solidified solder 15, the core wire of the lead wire 6 that had been pressed against the surface of the solidified solder 15 until then is The core wire of the lead wire 6 is buried in the melted solder 20, and the melted solder 20 permeates into the core wire of the lead wire 6. Then, as shown in FIG. firmly solder it to the pattern surface 7 of.
本発明によれば、ビデオヘツドのリード線接続
部にフラツクスを塗布し、このフラツクス上に球
状はんだを供給し、この球状はんだをビーム照射
によつて溶解し、この溶解後に山形に固化したは
んだにフラツクスを塗布し、この山形のはんだに
対しリード線の先端を押付け、この山形のはんだ
をビーム照射によつて溶解し、その後に固化した
はんだによつてリード線の先端とビデオヘツドの
リード線接続部とをはんだ付けするようにしたか
ら、リード線のない状態で球状はんだを溶解して
得た山形の固化はんだは固くリード線接続部に固
着していて、この山形の固化はんだにリード線の
先端を押付けてもこのはんだが位置ずれをおこす
おそれがなく、しかもこの山形の固化はんだにリ
ード線の先端を押付けた状態でこのはんだをビー
ム照射によつて溶解すると、その押付け力によつ
てリード線の先端は自然に溶解はんだ中に埋没し
て、確実にはんだ付けされる。また球状はんだを
溶解するときは、リード線を加熱する必要がない
ので、球状はんだの中央部にビームを照射してこ
の球状はんだを溶解することができ、このとき球
状はんだの下側のフラツクス球状はんだの周囲で
均等に蒸発するので、その蒸気圧によつて球状は
んだが横にずれるおそれがなく、はんだ付けを確
実に行うことができる。
According to the present invention, flux is applied to the lead wire connection portion of the video head, spherical solder is supplied onto the flux, the spherical solder is melted by beam irradiation, and after the melting, the solder solidifies into a mountain shape. Apply flux, press the tip of the lead wire against this chevron-shaped solder, melt the chevron-shaped solder by beam irradiation, and then use the solidified solder to connect the tip of the lead wire to the lead wire of the video head. Since the parts are soldered together, the chevron-shaped solidified solder obtained by melting the spherical solder without the lead wire is firmly attached to the lead wire connection part. Even if the tip is pressed, there is no risk of the solder becoming misaligned.Moreover, if the tip of the lead wire is pressed against this chevron-shaped solidified solder and the solder is melted by beam irradiation, the pressing force will cause the lead to move. The tip of the wire is naturally buried in the molten solder and is securely soldered. Furthermore, when melting spherical solder, there is no need to heat the lead wires, so the beam can be irradiated to the center of the spherical solder to melt this spherical solder. Since the solder evaporates evenly around the solder, there is no fear that the spherical solder will shift laterally due to the vapor pressure, and soldering can be performed reliably.
第１図はパレツト上のビデオヘツドを示す斜視
図、第２図は本発明のビデオヘツドのリード線接
続方法の一実施例を示す断面図、第３図はリード
線が接続されたビデオヘツドの斜視図である。
４……ビデオヘツド、６……リード線、７……
リード線接続部としてのパターン面、１１……フ
ラツクス、１２……球状はんだ、１４……ビー
ム、１５……山形の固化はんだ、１６……フラツ
クス、１９……ビーム、２０……溶解はんだ、２
１……固化はんだ。
FIG. 1 is a perspective view showing a video head on a pallet, FIG. 2 is a sectional view showing an embodiment of the video head lead wire connection method of the present invention, and FIG. 3 is a view of the video head with lead wires connected. FIG. 4...Video head, 6...Lead wire, 7...
Pattern surface as a lead wire connection part, 11... flux, 12... spherical solder, 14... beam, 15... chevron-shaped solidified solder, 16... flux, 19... beam, 20... molten solder, 2
1...Solidified solder.
Claims (1)
を塗布し、このフラツクス上に球状はんだを供給
し、この球状はんだをビーム照射によつて溶解
し、この溶解後に山形に固化したはんだにフラツ
クスを塗布し、この山形のはんだに対しリード線
の先端を押付け、この山形のはんだをビーム照射
によつて溶解し、その後に固化したはんだによつ
てリード線の先端とビデオヘツドのリード線接続
部とをはんだ付けすることを特徴とするビデオヘ
ツドのリード線接続方法。1 Apply flux to the lead wire connection part of the video head, supply spherical solder onto this flux, melt this spherical solder by beam irradiation, apply flux to the solder that has solidified into a mountain shape after melting, The tip of the lead wire is pressed against this chevron-shaped solder, this chevron-shaped solder is melted by beam irradiation, and then the solidified solder is used to solder the tip of the lead wire and the lead wire connection part of the video head. A video head lead wire connection method characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9874982A JPS58215274A (en) | 1982-06-09 | 1982-06-09 | Connection of lead wire of video head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9874982A JPS58215274A (en) | 1982-06-09 | 1982-06-09 | Connection of lead wire of video head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58215274A JPS58215274A (en) | 1983-12-14 |
| JPS6121745B2 true JPS6121745B2 (en) | 1986-05-28 |
Family
ID=14228107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9874982A Granted JPS58215274A (en) | 1982-06-09 | 1982-06-09 | Connection of lead wire of video head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58215274A (en) |
-
1982
- 1982-06-09 JP JP9874982A patent/JPS58215274A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58215274A (en) | 1983-12-14 |
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