JPS596086U

JPS596086U - wire bonding chip

Info

Publication number: JPS596086U
Application number: JP1982098304U
Authority: JP
Inventors: 後藤　正伯
Original assignee: 富士通株式会社
Priority date: 1982-06-30
Filing date: 1982-06-30
Publication date: 1984-01-14

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of drawings]

第１図は従来のワイヤボンディングチップの正面断面図
、第２図は同下面図、第３図はこのワイヤボンディング
チップによる被覆線ボンディング要領図、第４図乃至第
８図は本考案に係るワイヤボンディングチップの実施例
を示すもので、第４図はワイヤボンディングチップの正
面断面図、第５図は同下面図、第６図は同原点状態説明
図、第７図ａ、　　ｂ、　　ｃは始点、終点、中間の各
接続位置におけるチップ角度位置決め要領図、第８図は
被覆線接続の具体例を示す接続要領図である。図中、４は極細被覆線、５は被接続部材、６はパッド、
７はレーザ光、１１はワイヤボンディングチップ、１２
は円すい部、１３は切り欠き、１４は中空部、１５はチ
ップ保持部材である。FIG. 1 is a front cross-sectional view of a conventional wire bonding chip, FIG. 2 is a bottom view of the same, FIG. 3 is a procedure for bonding covered wires using this wire bonding chip, and FIGS. 4 to 8 are wires according to the present invention. Fig. 4 is a front sectional view of the wire bonding chip, Fig. 5 is a bottom view of the wire bonding chip, Fig. 6 is an explanatory diagram of the origin state, and Fig. 7 a, b, and c are the starting points. , the end point, and the intermediate connection position. FIG. 8 is a connection procedure diagram showing a specific example of covered wire connection. In the figure, 4 is an ultra-fine coated wire, 5 is a connected member, 6 is a pad,
7 is a laser beam, 11 is a wire bonding chip, 12
13 is a conical portion, 13 is a notch, 14 is a hollow portion, and 15 is a chip holding member.

Claims

[Scope of utility model registration request]

The ultra-fine coated wire is pressed onto a pad on the surface of the member to be connected by the tip of a pipe-shaped wire bonding tip equipped with a hollow part for guiding laser light, and the coating of the coated wire is melted by the laser light passing through the hollow part. In a laser bonding device that melts the solder on the pad and bonds the core wire of the covered wire to the pad, at three positions among positions dividing the end surface of the tip into four equal parts in the circumferential direction,
A notch into which the covered wire fits is formed in the radial direction, and the notch presses the covered wire to perform bonding, and the portion of the tip end face where no notch is formed allows the wire of the covered wire to be pressed. A wire bonding tip characterized in that it is configured such that its tail can be cut.