JPS628888B2 - - Google Patents
Info
- Publication number
- JPS628888B2 JPS628888B2 JP54076612A JP7661279A JPS628888B2 JP S628888 B2 JPS628888 B2 JP S628888B2 JP 54076612 A JP54076612 A JP 54076612A JP 7661279 A JP7661279 A JP 7661279A JP S628888 B2 JPS628888 B2 JP S628888B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- copper
- linear body
- impregnated
- stabilizing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 38
- 239000000463 material Substances 0.000 claims description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 229910052802 copper Inorganic materials 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 18
- 230000000087 stabilizing effect Effects 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000000155 melt Substances 0.000 claims 2
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
Description
【発明の詳細な説明】
本発明は銅線状態を銅安定化材中へ半田により
埋め込む方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention is directed to a method of embedding copper wire structures into a copper stabilizer by soldering.
近年の技術の進歩により、例えば、超電導ケー
ブルのようにボイドレスな構造の導体を製造する
必要が生じてきた。しかし、現実には満足のいく
方法が開発されていず、新たに本発明においてそ
の方法が開発された。 With recent advances in technology, it has become necessary to manufacture conductors with voidless structures, such as superconducting cables, for example. However, in reality, no satisfactory method has been developed, and a new method has been developed in the present invention.
本発明の目的は少なくとも外層に銅または銅合
金を有する金属線状体を銅安定化材の溝内へ半田
によつて埋め込む際、空気の混入によるボイドの
発生を防止することのできる半田埋め込み方法を
提供しようとするにある。 An object of the present invention is to provide a solder embedding method that can prevent the generation of voids due to air intrusion when embedding a metal linear body having copper or a copper alloy in at least the outer layer into a groove of a copper stabilizing material by soldering. We are trying to provide the following.
本発明によれば、予め半田含浸線状体を製造
し、銅安定化材の長手方向に形成した溝内に上記
半田含浸線状体と固体半田を導入し、銅安定化材
を加熱して半田を溶融させ、半田含浸線状体を銅
安定化材の溝中に埋め込む。この際、半田を溶融
させた後半田含浸線状体およびその銅安定化材に
機械的振動または超音波振動を付与して半田埋込
材中にボイドが形成されないようにするのが好適
である。また、銅安定化材の溝にも線状体と同様
にAgまたはSn或はその合金メツキを施して半田
の濡れ性を良くし、ボイドの形成を防止するよう
にする。 According to the present invention, a solder-impregnated linear body is manufactured in advance, the solder-impregnated linear body and solid solder are introduced into grooves formed in the longitudinal direction of the copper stabilizing material, and the copper stabilizing material is heated. The solder is melted and the solder-impregnated linear body is embedded in the groove of the copper stabilizing material. At this time, it is preferable to apply mechanical vibration or ultrasonic vibration to the solder-impregnated linear body in which the solder is melted and its copper stabilizing material to prevent voids from forming in the solder embedding material. . Further, the grooves of the copper stabilizing material are also plated with Ag, Sn, or an alloy thereof in the same manner as the linear bodies to improve solder wettability and prevent the formation of voids.
溝内に導入設置する半田材は含浸線状体の半田
よりも低融点のものを使用し、含浸線の半田は溶
融させずに半田埋込作業を行い、ボイドの発生の
チヤンスを極力少なくした方がよい。 The solder material introduced into the groove has a lower melting point than the solder for the impregnated wire, and the solder for the impregnated wire is filled in without melting to minimize the chance of voids occurring. It's better.
次に、本発明による半田埋込法を図面を参照し
つつ詳細に説明する。 Next, the solder embedding method according to the present invention will be explained in detail with reference to the drawings.
本発明において使用される半田含浸線状体は次
のようにして製造するのが好適である。 The solder-impregnated linear body used in the present invention is preferably manufactured as follows.
第２Ａ図に断面を示すように好ましくはAgま
たはSn或はその合金メツキを施した撚線条件１
を溶融半田２の入つた半田浴３中に導入し、好ま
しくは半田浴中で撚線状体１にバイブレータ４に
より機械的振動または超音波振動を与えつつ半田
を撚線の素線間に含浸させ、半田浴３の下方の好
ましくはテフロン製のノズル５より引き出し、ノ
ズル先端部において冷却装置６により冷却固化さ
せることにより得られる。かようにして得られた
半田含浸線状体の断面を第２Ｂ図に示す。これを
Ｘ線探傷法および超音波探傷法により検査したと
ころ全くボイドは認められない優れた品質のもの
であることが確認された。 Stranded wire condition 1, preferably plated with Ag or Sn or an alloy thereof, as shown in the cross section in Figure 2A
is introduced into a solder bath 3 containing molten solder 2, and preferably while applying mechanical vibration or ultrasonic vibration to the stranded wire body 1 with a vibrator 4 in the solder bath, solder is impregnated between the strands of the stranded wire. It is obtained by pulling it out from a nozzle 5, preferably made of Teflon, below the solder bath 3, and cooling and solidifying it with a cooling device 6 at the tip of the nozzle. A cross section of the solder-impregnated linear body thus obtained is shown in FIG. 2B. When this was inspected by X-ray flaw detection and ultrasonic flaw detection, it was confirmed that it was of excellent quality with no voids observed at all.
一方、銅安定化材７には所要寸法の長手方向溝
８を形成し、これにも上述したような理由から
AgまたはSn或はその合金のメツキを施しておく
のが好ましい。 On the other hand, a longitudinal groove 8 of a required size is formed in the copper stabilizing material 7, and also for the reasons mentioned above.
It is preferable to apply plating with Ag or Sn or an alloy thereof.
次いで、この銅安定化材７の溝内に半田材９お
よび半田含浸線状体１０を第３図に示すように導
入する。 Next, a solder material 9 and a solder-impregnated linear body 10 are introduced into the groove of the copper stabilizing material 7 as shown in FIG.
半田含浸線状体と半田材とが会合する近傍にお
いて適当な加熱手段１１により加熱して半田材９
を溶融させる。 The solder material 9 is heated by an appropriate heating means 11 in the vicinity where the solder-impregnated linear body and the solder material meet.
melt.
半田の溶融状態においてバイブレータ１２によ
り機械的振動または超音波振動を半田含浸線１０
およびまたは銅安定化材７に加え、振動の脱泡作
用と、これに伴なう半田の浸透作用により半田埋
込部にボイドが形成されないようにする。振動付
与により半田埋込部を安定化させた後ロール１３
により半田含浸線状体１０を銅安定化材の溝８内
に押入し、適当な冷却装置１４によりこれらを冷
却固化させて半田埋込材１５を得ることができ
る。 When the solder is in a molten state, a vibrator 12 applies mechanical vibration or ultrasonic vibration to the solder-impregnated wire 10.
And/or in addition to the copper stabilizing material 7, voids are prevented from being formed in the solder-embedded portion by the defoaming effect of vibration and the associated solder penetration effect. Roll 13 after stabilizing the solder embedded part by applying vibration
The solder-impregnated linear body 10 is pushed into the groove 8 of the copper stabilizing material, and the solder embedding material 15 can be obtained by cooling and solidifying them using a suitable cooling device 14.
この断面を第２Ｃ図に示す。 This cross section is shown in FIG. 2C.
また、半田材９は半田含浸線状体に用いた半田
材よりは低い融点のものを用い、加熱部１１にお
いては半田材９のみが溶融し、線状体の半田は溶
融しないようにするのが好ましい。これは双方の
半田の溶融によりボイドの発生の可能性が大きく
なるからである。 Further, the solder material 9 is made of a material with a lower melting point than the solder material used for the solder-impregnated linear body, so that only the solder material 9 is melted in the heating section 11, and the solder on the linear body is not melted. is preferred. This is because the melting of both solders increases the possibility of voids occurring.
本発明方法により得られる半田埋込材１５は、
フラツクスを使用しないため残留フラツクスによ
る気泡の残留、すなわち、ボイドの形成は起ら
ず、その他上述した種々のボイド発生防止策を講
じているため、Ｘ線または超音波探傷法により検
査しても全くボイドが形成されていないことが確
認された。 The solder embedding material 15 obtained by the method of the present invention is
Since no flux is used, no bubbles remain due to residual flux, that is, no voids are formed, and since we have taken the various measures to prevent the occurrence of voids as described above, there is no problem even when inspected using X-ray or ultrasonic flaw detection methods. It was confirmed that no voids were formed.
上述した処は、本発明の一例を示すにすぎず、
本発明の範囲内で種々の変更を加えることができ
る。 What has been described above is merely an example of the present invention.
Various modifications can be made within the scope of the invention.
第１図は半田含浸線を製造する方法を説明する
ための図、第２Ａ，ＢおよびＣ図はそれぞれＡ−
Ａ，Ｂ−Ｂ，Ｃ−Ｃ線上での断面図、第３図は本
発明による半田埋込法の一実施例を示す部分側面
図である。
１：線状体、２：溶融半田、３：半田浴、４：
バイブレータ、５：ノズル、６：冷却装置、７：
銅安定化材、８：溝、９：半田材、１０：半田含
浸線状体、１１：加熱装置、１２：バイブレー
タ、１３：ロール、１４：冷却装置、１５：半田
埋込材。
Figure 1 is a diagram for explaining the method of manufacturing solder-impregnated wire, and Figures 2A, B, and C are A-A-C, respectively.
3 is a partial side view showing an embodiment of the solder embedding method according to the present invention. 1: Linear body, 2: Molten solder, 3: Solder bath, 4:
Vibrator, 5: Nozzle, 6: Cooling device, 7:
Copper stabilizing material, 8: groove, 9: solder material, 10: solder-impregnated linear body, 11: heating device, 12: vibrator, 13: roll, 14: cooling device, 15: solder embedding material.
Claims (1)
属素線より成る撚線の半田含浸線状体を銅安定化
材中へ半田により埋め込むに際し、前記半田含浸
線状体および固体半田を前記安定化材に形成した
長手方向の溝内に導入し、少なくとも前記固体半
田を加熱して溶融させ、半田が溶融した状態にお
いて半田含浸線状体と銅安定化材の少なくとも一
方に振動を加え、次いで溶融せる半田を冷却固化
することを特徴とする銅線状体の銅安定化材への
半田埋込方法。1. When embedding a solder-impregnated linear body of stranded wires made of metal wires having copper or copper alloy in at least the outer layer into a copper stabilizing material by soldering, the solder-impregnated linear body and solid solder are placed in the stabilizing material. The solder is introduced into the formed longitudinal groove, heats and melts at least the solid solder, applies vibration to at least one of the solder-impregnated linear body and the copper stabilizing material in the molten state, and then melts the solder. A method for embedding solder into a copper stabilizing material in a copper wire-shaped body by cooling and solidifying the material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7661279A JPS561417A (en) | 1979-06-18 | 1979-06-18 | Method of burying solder to copper stabilizer material for copper wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7661279A JPS561417A (en) | 1979-06-18 | 1979-06-18 | Method of burying solder to copper stabilizer material for copper wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS561417A JPS561417A (en) | 1981-01-09 |
| JPS628888B2 true JPS628888B2 (en) | 1987-02-25 |
Family
ID=13610156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7661279A Granted JPS561417A (en) | 1979-06-18 | 1979-06-18 | Method of burying solder to copper stabilizer material for copper wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS561417A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5635312A (en) * | 1979-08-30 | 1981-04-08 | Furukawa Electric Co Ltd | Method of soldering superconductor |
| JPS6183788A (en) * | 1984-09-27 | 1986-04-28 | ミサワホ−ム株式会社 | Clamp structure of upstair and downstair opening unit |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5175982A (en) * | 1974-12-26 | 1976-06-30 | Furukawa Electric Co Ltd | CHODENDOKEEBURUNOSEIZOHOHO OYOBI SONOSOCHI |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54173971U (en) * | 1978-05-29 | 1979-12-08 |
-
1979
- 1979-06-18 JP JP7661279A patent/JPS561417A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5175982A (en) * | 1974-12-26 | 1976-06-30 | Furukawa Electric Co Ltd | CHODENDOKEEBURUNOSEIZOHOHO OYOBI SONOSOCHI |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS561417A (en) | 1981-01-09 |
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