JPS561417A - Method of burying solder to copper stabilizer material for copper wire - Google Patents

Method of burying solder to copper stabilizer material for copper wire

Info

Publication number
JPS561417A
JPS561417A JP7661279A JP7661279A JPS561417A JP S561417 A JPS561417 A JP S561417A JP 7661279 A JP7661279 A JP 7661279A JP 7661279 A JP7661279 A JP 7661279A JP S561417 A JPS561417 A JP S561417A
Authority
JP
Japan
Prior art keywords
copper
burying
solder
stabilizer material
copper wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7661279A
Other languages
Japanese (ja)
Other versions
JPS628888B2 (en
Inventor
Eerushiyureegeru Deiitoritsuhi
Hajime Abe
Kouichi Tamura
Katsumi Nakada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP7661279A priority Critical patent/JPS561417A/en
Publication of JPS561417A publication Critical patent/JPS561417A/en
Publication of JPS628888B2 publication Critical patent/JPS628888B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Superconductors And Manufacturing Methods Therefor (AREA)
JP7661279A 1979-06-18 1979-06-18 Method of burying solder to copper stabilizer material for copper wire Granted JPS561417A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7661279A JPS561417A (en) 1979-06-18 1979-06-18 Method of burying solder to copper stabilizer material for copper wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7661279A JPS561417A (en) 1979-06-18 1979-06-18 Method of burying solder to copper stabilizer material for copper wire

Publications (2)

Publication Number Publication Date
JPS561417A true JPS561417A (en) 1981-01-09
JPS628888B2 JPS628888B2 (en) 1987-02-25

Family

ID=13610156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7661279A Granted JPS561417A (en) 1979-06-18 1979-06-18 Method of burying solder to copper stabilizer material for copper wire

Country Status (1)

Country Link
JP (1) JPS561417A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5635312A (en) * 1979-08-30 1981-04-08 Furukawa Electric Co Ltd Method of soldering superconductor
JPS6183788A (en) * 1984-09-27 1986-04-28 ミサワホ−ム株式会社 Clamp structure of upstair and downstair opening unit

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5175982A (en) * 1974-12-26 1976-06-30 Furukawa Electric Co Ltd CHODENDOKEEBURUNOSEIZOHOHO OYOBI SONOSOCHI
JPS54173971U (en) * 1978-05-29 1979-12-08

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5175982A (en) * 1974-12-26 1976-06-30 Furukawa Electric Co Ltd CHODENDOKEEBURUNOSEIZOHOHO OYOBI SONOSOCHI
JPS54173971U (en) * 1978-05-29 1979-12-08

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5635312A (en) * 1979-08-30 1981-04-08 Furukawa Electric Co Ltd Method of soldering superconductor
JPS6183788A (en) * 1984-09-27 1986-04-28 ミサワホ−ム株式会社 Clamp structure of upstair and downstair opening unit

Also Published As

Publication number Publication date
JPS628888B2 (en) 1987-02-25

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