JPS58207163A - Sheet type miniature electronic device - Google Patents

Abstract

PURPOSE:To obtain a sheet type miniature electronic computer with an extremely small case thickness and high tenacity, by laminating close an electronic parts structure to the upper and lower cases on a tenacious sheet. CONSTITUTION:An upper face sheet 12 containing an operation part where key names 51, etc. are printed is laminated close to an upper sheet 13 to form an upper case 1. In the same way, a lower face sheet 14 and a lower sheet 15 form a lower case 2. The sheets 12 and 14 use transparent resin such as a polyester film, etc.; while the sheets 13 and 15 use hard poly vinyl chloride, etc. An electronic parts structure 11 constains a grid-shaped contact 24, an IC element 26, a solar battery 43, a display element 34, etc. distributed on a substrate 21. This structure 11 is put close between the cases 1 and 2 together with a frmae 16 which encloses the structure 11. Thus a sheet type miniature electronic device is obtained.

Description

[Detailed description of the invention] -1'.

2. Description of the Related Art Recently, there has been a trend toward thinning of small electronic devices such as small electronic calculators, small electronic watches, and electronic game machines in order to improve portability.

Taking a small electronic calculator as an example, a portable calculator is a small and thin seed-like computer (like a credit card).
The card-shaped one is considered to be the eye stalk. That is,
Thin like a sheet φ), one
There is a demand for the development of a one-time smaller electronic calculator.

However, the conventional small electronic calculator in this building was constructed with a case made of molded synthetic resin or a metal plate attached to it, and inside this case there was a wiring board, Parts such as display bins and batteries are arranged.

However, the case structure of such conventional small electronic calculators is based on the idea of increasing the thickness of the case to provide high rigidity in order to protect the parts inside the case from external forces. For this reason, the wall thickness of the case cannot be made very thin, and therefore, the thickness of the entire case should be approximately 1.6 mm at the deepest part, i<lii q. This has led to the inconvenience that small electronic calculators, ie their cases, cannot be made extremely thin like credit cards.

The present invention was made in consideration of the above-mentioned annual bonds, and the entire case is equipped with electronic components and has a sheet structure of WIli5L, which is a compact sheet-like structure that maintains mechanical strength while reducing the thickness of the case and improving portability. It provides electronic equipment.

That is, the present invention has been developed by laminating an upper case and a lower case, which are in the form of tough sheets, on the upper and lower sides of an electronic component structure, respectively, in close contact with each other, and the thickness of the case is extremely thin, for example, less than 1V+i. The purpose of the present invention is to provide a sheet-like small electronic device that can be easily restored to its original state by absorbing external forces and has toughness.

Embodiments of the present invention will be described below with reference to drawings.

An embodiment in which the sheet-like small-sized four-child device of the present invention is applied to a small-sized electronic calculator will be described.

1 to 24 show one embodiment of the present invention.

FIG. 1 is an external view of the small electronic calculator of this embodiment. As shown in this figure, the small electronic calculator is in the form of a rectangular sheet. FIG. 2 is an exploded view of a small electronic calculator. In this figure, 11 is an electronic component structure, 12 is a top sheet, 13 is an upper sheet, 14 is a bottom sheet, 15 is a lower sheet, and 16 is a frame. Each of these sheets 12゜13
．． 14, 15 and the frame 16 each have a rectangular outer shape with the same size. The upper sheet 12 and the upper sheet 13 are laminated in close contact with each other to form a sheet-shaped upper case 1, and the lower sheet 14 and the lower sheet 15 are laminated in close contact with each other to form a sheet-shaped lower case. 2.

'111 Then, the upper case 1 is laminated in close contact with the upper part of the electronic component structure 11, and the lower case 22 is laminated in close contact with the lower side of the electronic component structure 11.

Note that the frame 16 is laminated in close contact between the upper case 1 and the lower case 2, and supports the electronic component structure 11 by surrounding its periphery. In this way, a small electronic calculator in the form of a rectangular sheet is assembled.

The configuration of each part of the small electronic i'i field machine will be explained with reference to FIGS. 3-18. 3 to 9 are plan views showing each component. Figures 10 to 13 are cross-sectional views showing the well logging structure, with Figure 10 showing the boundary between the board and frame (part A in Figure 1), and Figure 11 showing the part where the simulator switch is installed (part A in Figure 1). Fig. 1 B section), Fig. 12 shows the display section (Fig. 1 c section), and Fig. 13 shows the section where the battery is installed (Fig. 1 c section).
The cross-sections of the first drawing section) are shown. The electronic component structure 11 will be described with reference to FIGS. 3 and 14 to 18. As shown in FIG. 3, the substrate 21 is in the form of a rectangular sheet made of glass epoxy resin or bismaleimide-triazine resin, and has a thickness of 190 μm. A copper foil 22 with a thickness of about 35 μm forming a pattern is adhered via an insulating adhesive 23 with a thickness of about 20 μm. @Foil 22 is the substrate 21
The wiring patterns formed on the upper and lower surfaces of the substrate 21 include wiring, contacts, and terminals, and the wiring patterns on the upper and lower surfaces are connected through through holes (not shown) formed at predetermined locations on the substrate 21. The wiring pattern on the upper surface of the substrate 21 is schematically shown in FIG. 3, and connects fixed contacts, capacitors, display clusters, batteries, light emitting diodes, etc. around the circuit elements. On the top half of the board 21, multiple F' fixed contacts 24, which are switch clusters, are arranged in a grid pattern as part of the wiring pattern, and the fixed contacts 24 consist of a pair of contacts. Each contact is connected to an integrated circuit assembly 26, which will be described later, via a wiring pattern. As shown in FIG. 14, in the other half of the board 2, a hole 25 is formed leaving the wiring pattern (copper foil 22 and adhesive 23) on the lower surface, and the on/off switch of the switch collector is placed in the hole 25.
A semiconductor circuit collector 26 that performs predetermined calculations when turned off.
In other words, a large-scale integrated circuit (LSI') is supported by the white P@ pattern on the lower surface side, and this centralized circuit element 2
6 is connected to the distribution pin (fi@%22) on the upper surface 9111 of the substrate 21 via a gold wire 27, and is also exposed from the upper layer by an insulating resin 28 such as silicone rubber or epoxy expanded resin. is sealed. Centralized circuit element 26
For example, #! is made of a rectangular chip measuring 4μ in length x 4μ in width x 200μ in thickness, and #! #/Hondenoma 28 is, for example, 10 pieces x 10 pieces x 1 year, and the thickness from the top of the circuit is 245 μm.
It is something that does. As shown in FIG. 15(0), a chip capacitor 30 is placed in the hole 29 formed in the other half of the board 21, leaving the wiring pattern (copper foil 22 and adhesive 23) on the bottom side. The electrodes 30a formed at both ends of the capacitor 30 are supported by the wiring pattern (copper foil 22 ) to? , and qh is covered with an insulating adhesive 32, such as ultraviolet curing ink, spread on the upper surface of the substrate 21. This capacitor 30 is connected to the integrated circuit element 26 via a wiring pattern. Substrate 21
The corner on the other end side is cut out leaving the wiring pattern on the bottom side (copper foil 22 and adhesion %1zs), and the 16th corner is cut out at this location.
As shown in the figure (01), a light emitting diode 33 for power braking is arranged to be supported by the wiring pattern on the lower surface side, and the electrode 33a of this light emitting diode 33 is adhered to the cream solder 31 applied to the substrate 21. It is connected to the wiring pattern (copper foil 22) on the top surface of the substrate 21 @I, and the periphery is sealed with an insulating adhesive 32 applied to the top surface of the base 1f52J, for example, with ultraviolet curable ink. and is connected to the integrated circuit element 26.

A display element 34, ie, a liquid crystal panel, is arranged on the -1llll edge side of the substrate 21, and is in contact with the wiring pattern extending on the upper surface of the substrate 21. The display element (liquid crystal panel) 34 is the 17th
As shown in the figure, a liquid crystal 37 is sealed between upper and lower substrates 35 and 36, which are made of a transparent resin film such as a polyester film with a polarizer layer embedded therein, and are provided with electrodes, and the periphery of the liquid crystal 37 is sealed with a seal 38. , a reflective plate 39 with a thickness of about 50μ is placed on the lower surface of the lower electrode base 36 to a thickness of 36 ia' $i
K Terminal electrode 4 made of connected transparent conductive ink
0... have elasticity (toughness) by arranging them in the longitudinal direction and using a shape.Also, on one side edge of the upper surface of the board 21, the wiring pattern f@ foil 22 is extended to form a plurality of terminal 4
1... are formed side by side in the longitudinal direction, and these terminals 4
1... project laterally from the substrate 21. Terminal ionization 40 of display element (quasi-crystal panel) 34 and terminal 4 of substrate 21
1, a brush cloth with a conductive adhesive 42, such as carphone ink, is applied to each contact surface to adhere them to each other and connect them at once, and the surrounding area is insulated 8: an adhesive 32, for example, ultraviolet cured It's Enoki with shaped ink on his palm. The display element 34 is connected to the central circuit element 26 through the distribution pattern on the substrate 2, and displays a predetermined routine based on a signal from the central circuit element 26. A battery 43, for example a solar cell, for supplying a driving voltage to the central circuit element 26 is disposed on one side edge of the substrate 21, alongside the display element 34.
is connected to the wiring pattern. Battery (solar battery) 43
As shown in FIG.
An amorphous thick VA battery layer 46 is deposited on the upper surface of the insulating layer 45 with a thickness of about 25 μm, for example, through polyimide, and a polymostyl film 47 with a thickness of 175 μm is further formed on the thick layer 46 as a protective layer. cover and also fluorophore basal root 4
A pair of terminal electrodes 48.4 are placed on the upper surface of 4 with an insulating layer 45 interposed therebetween.
8. This cell (solar cell) 43 has an overall thickness of about 300μ, and has an overall elasticity (fJ
gender).

Furthermore, a pair of terminals 49 and 49 are formed on one side edge of the substrate 2 at a location opposite to the battery (solar cell) 43 by making the wiring pattern @foil 22 protrude laterally. The terminal electrodes 48 of the battery (solar cell) 43 and the terminals 49 of the substrate 2 are electrically connected by applying conductive folds 4j 424<'11, for example, by dripping carbon ink and adhering them to each other. Its circumference is covered with a wall covering material 32, such as ultraviolet curable ink. Therefore, the battery (solar cell) 43 is connected to the circuit collector 26 via the arrangement and pattern of the substrate 21.

The magnetic component assembly 11 configured in this way is arranged inside the frame 16. The frame 16 is, for example, made of hard cyclized vinyl and has a thickness of about 300μ, and as shown in FIG. It has a shape that rests on Sm of the part and surrounds it according to the part I of the first part.

The frame 16 is placed around the auspicious sin of the 奼子 component box structure 11, as shown in FIG. 3 and the tenth sections 1, 12, and 13.

The upper case 1 will be described with reference to FIGS. 4 to 6 and 10 to 13. Upper case 1 has upper sheet 12
The upper sheet 13 is assembled to the upper sheet 13. Top sheet 1
2 is a rectangular sheet with excellent strength (toughness) made of a transparent sheet such as a polyester film with a thickness of about 80 μm. An operating section 50 is provided at a location corresponding to the fixed contact forming section of the base number 21 of the component structure 11. This operation section 50 has key name printing sections 51 for the number of sleeves corresponding to the identification contacts 24 of the board 21 on the lower surface of the top sheet 12.
are printed in a grid pattern, and each key name stamp is printed on the delivery section 5.
A plurality of movable sharpening points 52 having a thickness of about 15 to 30 μm are lined up in pairs on the lower side of each of the points 1 and 1, and are formed by printing carbon ink or the like. A frame-shaped display protrusion 11 forming a display window is printed on the lower surface of the top sheet 12, facing the display element 34 of the electronic component assembly 11, and forming a battery window corresponding to the battery 43. A frame-shaped battery window receiving section 54 is formed for immediate delivery. In addition, 55 in the figure is a blindfold seal part. Upper sheet 1
3 is 18 which has the highest strength (toughness) such as gun material vinyl chloride
It is a rectangular sheet made of an acid-containing resin having a thickness of about 0 μm. Upper sheet 1 as shown in Figure 6
3 is formed with a plurality of holes 56 . . . that penetrate vertically corresponding to the fixed contacts 24 . . . of the substrate 21, and
Holes 57 and 5B penetrating vertically are formed side by side to correspond to the display element 34 and battery 43, respectively. In addition, 59 in the figure
is a hole through which the integrated circuit assembly 26, capacitor 30 and light emitting diode 33 of the substrate 21 can escape. As shown in FIGS. 10 to 13, this upper case 1 is constructed by bonding and laminating an upper sheet 13 on the underside of the upper sheet 12 via an insulating adhesive 60 with a thickness of approximately 20 μm. The upper sheet 13 provides mechanical strength to the upper sheet 12. Top sheet 1
2' - The entire upper surface of the upper sheet 13 is behind, and the key name printing part 51 of the upper sheet 12... is the upper sheet 1
The movable contacts 52 are located in the respective holes 56 . . . corresponding to the holes 56 . . . The display window printed portion 53 and the Semiikemado Sokutsumugi portion 54 of the Ueyama I sheet 12 are located above the holes 57 and 5B of the upper sheet 113 and form one pupil, and these printed portions 53 and 54
The transparent upper sheet portion surrounded by the display window and the battery is transparent through the holes 57 and 5B. The blind printing part 55 of the top sheet 12 is the top sheet 1
The entire upper side of each hole 59 of No. 3 is covered. In addition,
The upper sheet 13 serves as a spacer that separates the movable contacts 52 of the upper sheet 12 from the fixed contacts 24 of the substrate 21 to maintain a constant switch operation interval.

The lower case 2 will be described with reference to FIGS. 7, WJB, and 10 to 13. The lower case 2 is made of a lower sheet 14 and a lower sheet 15 made of rough metal. The lower sheet 14 is made of an acid-containing resin such as a polyester film with a thickness of about 80 μm, and has a rectangular sheet shape with excellent strength (toughness).As shown in FIG. The printed portion 61 is formed by printing. The lower sheet 15 is a rectangular sheet with a thickness of about 80 μm made of a synthetic resin with excellent strength (toughness) such as hard vinyl chloride, and as shown in FIG. A hole 62 is formed to allow the (liquid crystal panel) 34 to escape. As shown in FIGS. 10 to 13, the lower case 2 is made by laminating the lower sheet 15 on top of the lower sheet 14 with an insulating adhesive 60 having a thickness of about 20 μm, and The sheet 14 covers the entire lower surface of the lower sheet 15, and the blind printing part 61 covers and hides the hole part 62 of the lower sheet 15 from below.

As shown in FIGS. 10 to 13, the upper case 1 is constructed by laminating the upper sheet 13 on the entire upper surface of the electronic component structure 11 and the frame 16 with an adhesive 60 having a thickness of about 20 μm.

The lower case 2 is made by bonding and layering the lower sheet 15 over the entire lower surface of the electronic component structure 11 and the frame 16 with an adhesive ax 60 having a thickness of 20 μm. The upper case 1 includes a substrate 21 of the electronic component structure 11, an integrated circuit assembly 26, and a capacitor 30.
, display element 34, and Nm4.43 are supported and covered from above.

The lower case 2 supports and covers the substrate 21, display element 34, and battery 43 from below. Here, as shown in FIG. 11, each hole 56 of the upper sheet 13 in the upper case 1
... are positioned so as to surround each fixed contact 24 ... of the substrate 21 on the upper side, and each movable contact 52 ... of the top sheet 12 ...
are located above the fixed contacts 24 through the holes 56. The key name printed portion 51 of the top sheet 12, the movable contact 52, the hole 56 of the top sheet 13, and the fixed contact 24 of the board 2 constitute an operation switch, and the key name printed portion 51 of the top sheet 12 is pressed from the top. Then, the contact 7 can be brought into contact with the fixed contact 24 of the pressing board 21 through the hole 56 of the upper sheet 13 to turn it on. 12th
As shown in the figure, the display element (liquid crystal panel 1) 134 is connected to the sheet 12 surrounded by the display window seal part 53 of the top sheet 12 through the hole 57 of the top sheet 13 in the top case 1.
That is, it faces the display window, and the display by the display element 34 can be viewed from outside the upper case 1 through the display window. As shown in FIG. 13, the battery (solar cell) 43 is exposed through the hole 58 of the upper sheet 13 to the cell window of the sheet 12 surrounded by the electronic window printed area 53 of the upper sheet 12. It is possible to receive external light from outside the upper case 1 through the battery window. Note that the display element 34 and the cold oil 43 are provided with ultraviolet edge hardening shadow ink 32 as a spacer and adhesive between the respective upper surfaces and the upper sheet 12.

In this way, the top of the electronic component structure 11 (!
L1vC The upper case 1 in the form of a sheet is laminated in close contact with each other, and the lower case 2 in the form of a sheet is deposited and laminated on the lower side of the electronic component structure 11, thereby creating a compact device that is integrally formed into a sheet. An electronic calculator is constructed. This small electronic calculator consists of a top sheet 12 (80μ), an adhesive 6
0 (20μ), top sheet 13 (180μ), adhesive 6
0 (20μ), substrate 21 (300μ), adhesive 60 (2
0μ), lower sheet 15 (80μ), adhesive 60C2
By combining the bottom sheet 14 (80μ) and the bottom sheet 14 (80μ), a very thin sheet with a total thickness of 800μ (Q, Bug) is formed. Each sheet 12, 13, 14, 15 and base number 21 shall have sufficient mechanical strength and elastic toughness for bending with a radius of curvature of approximately 40u, and the small electronic calculator as a whole has excellent toughness. It has become a thing. Display element (liquid crystal panel) 34 of electronic component structure 11
Similarly, the battery (great circle battery) 43 has sufficient toughness against bending with a He radius of about 408. In addition, the small electronic calculator has an upper surface and a lower surface composed of an upper sheet 12 and a lower sheet 14, and one upper sheet 12 is provided with an input key operation section for the sheet. The entire surface is X+ flat, with no uneven parts and is flat over the entire surface.

Next, an embodiment of the method for manufacturing this small electronic calculator will be described with reference to FIGS. 19 to 24. The basic manufacturing process consists of assembling the electronic component structure 11, molding each sheet 12 to 15, and then forming the electronic component structure 11.
The upper and lower sheets 13.15 are closely layered on the upper and lower sides of the laminate, and the upper and lower sheets 12.14 are laminated on the upper and lower sheets 13.15, and the periphery of the resulting laminate is It is cut into a predetermined external shape.

The case of assembling the electronic component mass body 11 will be described with reference to the construction explanatory diagram of FIG. 19. A roll film made of glass epoxy resin etc. is prepared by continuously winding a large number of films of the substrate 21 formed with holes 25° 29 into a roll shape, and this roll film is sequentially fed out and fed. % A predetermined wiring pattern is formed on the upper and lower surfaces of each substrate 21 using a dowel foil 22, and then an integrated circuit element (LSI) 26 is bonded to the hole 25 of each substrate 21 to form an integrated circuit element 26. After wire bonding and sealing with the Kizukishi 28, the roll film is cut into individual substrates 21. Then, solder 31 is applied to the holes 29 and notches of the cut substrate 21 as shown in FIG. 15 fat and FIG. .

(As shown by cl, a capacitor 30 is placed in the hole 29 and a light emitting diode (LED) 33 is placed in the center of the I device, respectively.
The solder 31 is melted and the capacitor 30 and the light emitting diode 33 are pressurized to fix the name. Next, in contact with the substrate 21, the display element (finished panel) 34 and the terminal 41 are bonded under pressure to the semi-dry electrodes 40, 4B using a battery (solar type 6℃, time 4 seconds), and this bonded portion is is completely dried and fixed by hot air drying (temperature: 120° C., 60 seconds). Finally, capacitor 30, light emitting diode 3
3. The display element 34 and the battery are cured. Note that positioning holes 63 for assembly jigs are formed at predetermined positions in the substrate 21, display element 34, and battery 43, respectively.

The case of manufacturing the upper and lower sheets 12 and 14 will be described. Both sheets 12 and 14 are roll films made of, for example, polyester and have a predetermined thickness of 80 μm. In the case of the top surface/sheet 12, the roll film is unrolled, and the key name printing section 51, display window printing section j, 9, and battery window printing section 54 are printed on each sheet 12, and carbon ink is perforated. , cut each sheet 12 into a predetermined shape.
cut off The lower sheet 14 is cut into each sheet 14 after being printed with the Efj printing section 61 once for each sheet 14 while unwinding and feeding the roll film. When cutting, the upper Φj sheet 12 has an external dimension larger than the external dimension of the final product, as shown by the two-point line in Figures 4 and g5, and the lower sheet 14, as shown by the two-point plane line in Figure 7. Cut with. Further, during this cutting, positioning holes 6J for assembly jigs are punched out in portions of the upper sheet 12 and the lower sheet 14 located outside the external dimensions of the final product.

That is, the reason why each sheet 12, 14 is cut to have an outer dimension larger than that of the final product is to position and hold the sheet during the construction process.

The case of manufacturing the upper and lower sheets 13, 15 and the frame 16 will now be described. For example, a roll film wound with a film made of high-density reinforced vinyl having a thickness corresponding to the thickness of each sheet 13゜15 and the frame 16,
Each sheet 13.15 and frame 16 are prepared according to the manufacturing process, and each sheet 13.15 and frame 16 are formed by unwinding the roll film one by one and cutting and punching it into a predetermined shape. The upper sheet 13 has the two points shown in Figure 6 @
As shown by the lines, it is cut to a larger external size than the final product, and holes 56 to 59 are punched out. The lower sheet 15 is cut to have a larger external dimension than the final product as shown by the two-point brocade in FIG. 8, and holes 62 are punched out. The frame 16 is cut to have an outer dimension larger than that of the final product as shown by the two-dot chain line in FIG. 9, and the inside is punched into the frame shape shown. In addition, the upper and lower sheets 13.15 and the frame 16 are provided with figures 6, 8 and 9.
As shown in the figure, positioning holes 63 are punched out in the predetermined positions of the part that will become the final product and the external extension part of the final product.
do.

Further, each of the parts manufactured in this way is assembled through the steps shown in the process diagram of FIG. 20. In this assembly, an assembly jig 64 shown in FIG. 21 and an assembly jig 65 shown in FIG. 22 are used, respectively. The assembly jig 64 is a stand 66
Gluing pins 6 are placed on the upper surface at a predetermined position within (in%) and at a predetermined position outside the external shape of the final product.
7 is installed protrudingly. The assembly jig 65 has positioning pins 67 protruding from the upper surface of a table 66 at predetermined positions on the outer side of the final product. Note that the stand 66 has larger external dimensions than the final product, and the position of each positioning pin 61 is determined by the positioning hole 6 formed in each component.
It corresponds to 3. First, an insulating adhesive 60 is applied to the upper surface of the lower sheet 15, and the lower sheet 15 is positioned and held by an assembly jig 64. In this case, the positioning pins 67 of the assembly jig 64 are inserted into the positioning holes 63 of the lower sheet 15, and the lower sheet 15 is placed on the upper surface of the stand 66. Next, by inserting the positioning pins 67 of the assembly jig 64 into the positioning holes 63 of the substrate 21, the display element 34, and the battery 43', the electronic component assembly 11 is positioned and the lower sheet 15 held on the stand 66 is inserted. Lay it on top of the top. In this state, the electronic component structure 11
and the lower sheet 15 are pressurized and heated to be crimped together.

,'■ Next, the frame 16 is inserted into the positioning hole 63 in the same manner as in the above operation.
The frame 16 is positioned by fitting into the positioning pin 67 of the assembly jig 64 and placed over the inner edge of the upper surface of the lower sheet 15, and the frame 16 is crimped to the lower sheet 15 by pressure and heating.

In this case, the frame 16 will enclose the S-circle of the electronic component structure 11. Next, an insulating adhesive 60 is applied to the lower surface of the upper sheet 13, and this upper sheet 13 is positioned by an assembly jig 64 and placed #i overlappingly on the upper surfaces of the electronic component structure 11 and the frame 16, The upper sheet 13 is pressed onto the electronic component structure 11 and the frame 16 by applying pressure and heat. In this way, a laminate is obtained in which the electronic component structure 11, the upper sheet 13, the lower sheet 15, and the frame 16 are combined to form 87 closely-adhered layers. FIG. 23 shows this essence.

Next, an adhesive 60 is applied to the upper surface of this laminate, that is, the upper surface of the upper sheet 13. At this stage, an assembly jig 65 is used in place of the assembly jig 64. By passing the positioning pin 67 of this assembly jig 65 through the positioning hole 63 formed outside the external shape of the final product in the laminate (fl!+m), the laminate is placed on the stand 6 of the assembly jig 65.
6 Position and place it on the top surface. Next, top sheet 1
2 is positioned by an assembly jig 65 and placed on top of the upper surface of the upper sheet 13 in the laminate, and the upper sheet 12 is pressed onto the upper sheet 13 by applying pressure and heating. Thereafter, ultraviolet rays are irradiated to cure the ultraviolet curable ink 32 on the display element 34 and battery 43. Next, flip @Spring Break so that the vertical position is reversed and reinstall the assembly jig 65.
The adhesive 6o is applied to the upper surface (lower surface) of the lower sheet 15. Next, the lower sheet 14 is positioned and held by the assembly jig 65 and placed on the surface (lower surface) of the lower sheet 15, and the lower sheet 14 is pressed onto the lower sheet 15 by pressure and heating.

Through the manufacturing process up to this point, the upper and lower sheets 13.15 shown in FIG.
A laminate is obtained in which 4 is closely adhered to each other. That is, a laminated body is obtained in which the upper case 1 and the lower case 2 are laminated integrally on the electronic component structure 11 in close contact with each other.

Further, a portion on the outer side that is larger than the external shape of the final product when integrated with VW is cut and molded into the external shape of the final product shown in FIG. top sheet 12, top sheet 13,
The lower sheet 14, the lower sheet 15, and the frame 16 are formed to have an outer shape that is different from the outer shape of the final product, and the excess outer circumferential portion is cut off.

In this way, as shown in FIG.
It is possible to manufacture a sheet-shaped compact electronic calculator having an upper case 71 and a lower case 2 as outer layers.

Therefore, the sheet-like small electronic device of the present invention has a sheet-like upper case and a sheet-like lower case on the upper and lower sides of the electronic component structure. The upper case has a switch operation section and a display window, and is in the form of a sheet that is in close contact with the upper part 111111 of the electronic component structure, and the lower case is in close contact with the lower side 11111 of the electronic component structure. It is in the form of a sheet that bees chew on.

The upper case and lower case will be explained using a small electronic calculator as an example. In the above-described embodiment, the upper case 71 is constructed by combining the upper sheet 12 with the upper sheet 13 as a reinforcing and switch spacer as an integral structure, but since the upper case has the basic functions described above, , the display window printing section (display window) 53 and the operation section 5 are constructed without combining the upper sheet 13 into an integral structure.
The upper case 1 can be constructed only with the upper sheet 12 having the number 0.

When using the top sheet 12 as the top case 1,
A spacer for the switch may be provided on the lower side of the top sheet 12 at a portion corresponding to the operating portion 50, and in this case, the lower case 2 is preferably made of a thick and hard resin in order to provide strength. FIG. 25 shows an example of this case, and in the figure, 6'j□□1 is a spacer. In addition, instead of using the upper sheet 12 as in the above-mentioned embodiment, the upper sheet 12 is made of hard vinyl chloride and thickened like the upper sheet 13 to increase its own strength.
It can be used as FIG. 26 shows an example. In this case, the operating portion of the upper sheet 12 may be made thinner only in that portion, for example, to enable press-forming, and a spacer 68 may be provided at the lower portion 1. In short, the upper case 1 is basically a single sheet having a waiting area and a display window, but it can also have a multilayer structure. The configuration of the operating section is also not limited to the embodiment. Further, in the above-described embodiment, the lower case 2 has a structure in which the lower sheet 14 and the lower sheet 15 are integrally laminated and combined, but the lower case 2 is laminated below the electronic component structure 11. Therefore, it is also possible to use only one of the lower sheets 14 and 15 as the lower case 2 without tying the two sheets 14.1-5 together. The bamboo 11 is attached to the lower sheet 15 as shown in FIGS. 25 and 26.
can be used alone as the lower case 2. Further, although not shown, only the lower sheet 14 can be used as the lower case 2. In this way, the upper case 1 and the lower case 2 can be constructed by laminating individual sheets in close contact with each other on the upper and lower sides of the electronic component component body 11, respectively. The material and thickness of the upper case 1 and the lower case 2 are also not limited to 4+ll.

In addition, in the embodiment described above, the upper case 1 and the lower case 2
Although a frame 16 is provided between the upper case 1 and the lower case 72, the frame 16 is not specially provided between the upper case 1 and the lower case 72, for example, as shown in FIGS. The peripheral edges of the case 2 are sealed together by means such as direct adhesion or fusion, so that the upper case 1 and the lower case 2 can support the cooler component structure 1). Furthermore, a protrusion may be formed on the peripheral edge of either or both of the upper case 1 and the lower case 2.

Furthermore, in the electronic component structure 11, for example, the substrate 2
1 is not limited to the example, but may be divided into two pieces and electrically connected to each other as shown in FIG. 27. In short, each component is electrically connected to form an electronic component structure. The battery is not limited to a solar cell, and a normal button-type battery may be used in combination with a rectangular cell or a solar cell.

Note that the present invention is not limited to small electronic calculators, but can be widely applied to small electronic devices such as sheet-shaped electronic watches and electronic game machines.

As explained above, the sheet-like small electronic device of the present invention has the following features:
By closely stacking the sheet-shaped upper case and lower case on the electronic component structure, the entire sheet structure becomes one piece, and it is possible to make it extremely ambidextrous, for example, less than IU, and it is resistant to external forces. Since it has excellent strength and E properties, portability can be greatly improved. Furthermore, since the sheet-like cases are tightly laminated with the electronic component structure sandwiched between them, it has excellent waterproof and dustproof properties.

[Brief explanation of the drawing]

1 to 18 show an actual example of a small-sized electronic calculator to which the present invention is applied; FIG. 1 is a perspective view showing the external appearance of the small-sized electronic calculator; Figure 3 shows the electronic component structure (al is a plan view, (b)
is an exploded perspective view, FIG. 4 is a top plan view of the top sheet, FIG. 5 is a top plan view of the top sheet, FIG. 6 is a top view of the top sheet, FIG. 7 is a top view of the bottom sheet, The figure is a plan view of the lower sheet, Figure 9 is a plan view of the frame, and Figures 10 to 13.
The figures are a partial sectional view of a small electronic calculator, FIG. 14 is a sectional view showing the attachment part between the integrated circuit assembly and the board, and FIG.
a) lb) (c) are cross-sectional views showing the case where the chip capacitor is rubbed onto the board, and Fig. 16 (al (b)
(cl is a sectional view showing the case where the light emitting diode is attached to the substrate, FIG. 17 (atfb) is a sectional view showing the case where the display element is attached to the substrate, FIG. 18 (at (b)
l is each! Cross-sectional view showing the case where the pond is attached to the board, 1st
Figures 9 to 24 show an example of manufacturing a small electronic calculator, Figure 19 is a process explanatory diagram showing the assembly process of the electronic component structure, and Figure 20.1 shows the entire assembly process. FIGS. 21 and 22 are perspective views showing an assembly jig, FIGS. 23 and 24 are perspective views showing intermediate assembled products, and FIGS. 25 and 26 are perspective views showing an assembly jig, respectively. Cross-sectional view showing another embodiment of the electronic calculator, No. 27
The figure is an exploded perspective view showing another embodiment of the electronic component structure. l...upper case, 2...lower case, 11...
Electronic component structure, 12... Top sheet, 13... Upper sheet, 14... Bottom sheet, 15... Lower sheet, 16... Frame, 21... Substrate, 22...・@Foil, 24...Fixed contact, 26...Integrated circuit assembly, 30
... Capacitor, 33... Light emitting diode, 34.
... Display element (bottom panel), 43... Battery (solar cell), 50... Operation section, 51... Key name printing section,
52... Movable contact, 53... Display window printing section, 54...
...Battery window printing part, 57-59...Hole part, 6th part...
Blindfold printing section, 62... Hole, 63... Positioning hole, 64° 65... Assembly jig, 66... Stand, 67...
・Positioning pin, 68...Spacer. Representative of dispatcher Patent attorney Takehiko Suzue Figure 1 Figure 2 Figure 3 (a) Figure 3 (b) Figure 4 Figure 5 bl bZ ':)':
) Figure 6 Figure 7 Figure 8 Figure 9 Figure 6 Figure 10 Figure 4 Figure 11 Figure 12 Figure 14 Figure 15 Figure 16 Figure 1 Figure 17 Figure 18 Figure 23 Figure 24 Figure 22 23 2 ( 15) 25 r3?1 21 ii 36

Claims (1)

[Claims] A switch element that is turned on and off by external operation, a semiconductor integrated circuit element that performs calculations by turning on and off this switch element, a display element that performs display according to a signal from this integrated circuit element, and a separation voltage applied to the integrated circuit element. A doji part structure to which batteries to be supplied are electrically connected, a shock absorber for operating the switch element, and a display window facing the display element, and closely attached to the upper extension 1 of the doji part structure. A sheet-like small case characterized by comprising a sheet-like upper case having toughness that is laminated as a layer, and a sheet-like lower case that is layered in close contact with the lower side of the elastic component sanitary structure. Electronics.