JPS62276657A - Compact electronic equipment - Google Patents

Abstract

PURPOSE:To simplify assembling and to thin the thickness of an equipment by forming movable contact points corresponding to respective fixed contact points formed on the surface of a wiring board on an upper cover forming the upper surface of the equipment. CONSTITUTION:A contact point sheet 16 is a square shape having the size corresponding to the whole frame body 19. Plural contact point springs 32 are formed on the contact point sheet 16 like gratings by etching processing so as to be opposed to the fixed contact points 23 on the wiring board 11 and a display window and a battery window 34 are formed by etching processing so as to correspond to a display panel and a solar battery 15. The movable contact points 36 to be an operation parts for inputting signals to the fixed contact points 23 are formed by printing out carbon paint to the lower center surfaces of respective contact point spring 32.

Description

[Detailed description of the invention] 3. Detailed description of the invention [Industrial application field] The present invention relates to small electronic equipment.

[Conventional technology] Conventionally, small electronic devices such as small electronic calculators
Inside the equipment case, which is a combination of a pair of upper and lower cases made of synthetic resin, is a wiring board with an integrated circuit element mounted thereon and a plurality of fixed contacts formed on the top surface, and a movable circuit board that corresponds to each fixed contact on the wiring board surface. There is a known structure that houses a sheet member for key operation with contacts provided on the bottom surface.
The wiring board is fixed to the lower case with screws, and the sheet member for key operation is printed on the bottom surface of the sheet member or is stacked on the wiring board with a spacing material interposed between the sheet member and the wiring board. The outer periphery of the sheet member is pressed and fixed onto the wiring board by an upper case having an opening that exposes the sheet member. Note that the spacing material maintains the spacing between the wiring board and the key operation sheet member.
Contact holes are formed in this spacing material at positions facing each of the fixed contacts on the wiring board surface, and the movable contacts of the key operation sheet member are connected to the fixed contacts on the wiring board surface by pressing the sheet member. It is meant to be in contact.

[Problem to be solved by the invention] In recent years, there has been a tendency for small electronic devices such as small electronic calculators to become thinner, and it is now possible to make small electronic devices as thin as credit cards. It is being considered.

However, in conventional small electronic devices, as described above, the wiring board is screwed to the lower case, and the sheet member with the key m function is stacked on the wiring board via the spacing material, and then the upper case is closed. Because the presser is fixed on the wiring board,
It is difficult to make the device thin, so it is impossible to make the device as thin as a credit card, and it is also troublesome to assemble the device.

The present invention was made in view of the above-mentioned circumstances, and its purpose is to make the thickness of the electronic device much thinner than that of conventional small electronic devices, and to make it easy to assemble. Our goal is to provide compact electronic equipment that is easy to use.

[Means for Solving the Problems] A small electronic device of the present invention includes an upper cover forming an upper surface of the device on the upper surface of a wiring board on which an integrated circuit element is mounted and a plurality of fixed contacts formed on the upper surface. A wiring board is bonded via a spacing material having a contact hole at a position facing each fixed contact, a lower cover forming the lower surface of the device is bonded to the lower surface of the wiring board, and a lower cover forming the lower surface of the device is bonded to the lower surface of the upper cover. , a movable contact corresponding to each fixed contact on the wiring board surface is provided.

[For production]

According to the small electronic device of the present invention, since the upper cover forming the top surface of the device is provided with movable contacts that correspond to each fixed contact on the wiring board surface, the wiring can be wired inside the device case like a conventional small electronic device. There is no need to stack the board and the sheet member for key operation, and therefore the thickness can be made much thinner than conventional small electronic devices.
Furthermore, since the upper cover is adhered to the upper surface of the wiring board via a spacing material, and the lower cover that forms the lower surface of the device is also adhered to the lower surface of the wiring board, the wiring board is fixed to the lower case with screws. However, it is easier to assemble than conventional small electronic devices in which a sheet member for key operation is held and fixed onto a wiring board by an upper case.

[Embodiments of the invention] Embodiments of the present invention illustrated in the drawings will be described below.

DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to a sheet-like small electronic calculator shown in FIGS. 1 to 11.

Figure 2 shows the appearance of a sheet-like small electronic calculator;
The figure shows a disassembled state. In the figure, 1 is an electronic component assembly, 2 is an upper cover, and 3 is a lower cover. The electronic component structure 1 is configured by combining a wiring board 11, a semiconductor integrated circuit element 12, an electronic component 13, a display panel 14, and a solar cell 15. Top cover 2 is top protection sheet 1
8, a contact sheet 16, a smoother 17, and a frame 19 are stacked one above the other. The lower cover 3 is constructed by stacking a support sheet 20 and a lower protection sheet 21 vertically. Although not shown in FIG. 1, reference numeral 4 in FIGS. 3 to 6 indicates an adhesive layer made of an insulating adhesive 22. Then, the upper cover 2 is closely laminated on the upper side of the electronic component structure 1, the adhesive layer 4 is provided on the lower side of the electronic component structure 1, and the lower cover 3 is closely laminated on the lower side of the adhesive layer 4. The whole thing is so thin!・Has a shape.

Next, the configuration of each part will be described with reference to FIGS. 3 to 8. Figure 3 is a sectional view taken along the line C-C in Figure 2, and Figure 4 is a cross-sectional view along the line C-C in Figure 2.
5 is a sectional view taken along line C-C in FIG. 2, FIG. 6 is a sectional view taken along line C-C in FIG. It is a drawing showing a switch part.

The electronic component structure 1 will be described. The wiring board 11 is made of an insulating material and has a rectangular sheet shape with a thickness of about 220 μm, and has a plurality of fixed contacts 23 arranged in a grid pattern on the top surface, each consisting of a pair of contacts as switch contacts. A predetermined wiring pattern including fixed contacts 23 and terminals 24 and 28, which will be described later, is formed on the upper and lower surfaces. A semiconductor integrated circuit element 12 and electronic components 13 such as chip capacitors and diodes are housed in the D-shaped mounting holes 11a of the wiring board 11, passing through them from the top and bottom, and these can be connected to the wiring pattern of the wiring board 11. be. The display panel 14 is a film-packaged liquid crystal with a thickness of 55 mm.
It consists of a liquid crystal display panel with a size of approximately 0 μm, in which liquid crystal is sealed between upper and lower films, which serve as upper and lower electrode substrates, and one end portion 14a of the film is sealed. The display panel 14 is disposed on one side of the wiring board 11 on the same plane. Terminals 24 formed on the lower surface of the wiring board 11 and terminals 25 formed on the lower surface of the upper electrode substrate of the display panel 14 are wires 2 made of conductive adhesive.
connected by a flexible film 27 having 6;
The terminals 24 and 25 and the wiring 26 are bonded together by heating and pressing.

The solar cell 15 has a thickness of about 180 μm and is made by forming an amorphous silicon thin film on the upper surface of a stainless steel substrate, and is disposed on the same plane as the display panel 14 on one side of the wiring board 11 . As shown in FIG. 4, the terminals 28 formed on the lower surface of the wiring board 11 and the solar cell 15
The terminals 29 formed on the upper surface of the substrate are connected by a flexible film 31 having wiring 30 made of a conductive adhesive, and the wiring 30 and the terminals 28 and 29 are bonded by heating and pressing. As shown in FIG. 4, terminals 28 are formed on the bottom surface of the wiring board 11, and terminals 29 are formed on the top surface of the substrate of the solar cell 15. Connected by a flexible film 31 having wiring 30 made of conductive adhesive, wiring 3G
The terminals 28 and 29 are bonded together by heating and pressing. In this case, the wiring 30 is formed on the opposite side of the flexible film 31 so as not to short-circuit to the substrate side of the solar cell 15, and the through hole 3 is formed at the terminal 29 portion of the solar cell 15.
A wiring 30 is led out to the solar cell 15 side via 1a and electrically connected to the terminal 29. In this way, the electronic component structure 1 is constructed by arranging each component in a plane and electrically connecting them to each other, and the semiconductor integrated circuit element 12 operates using the solar cell 15 as a power source and the input signal from the fixed contact 23. A display signal is output to the display panel 14, and the calculation result is displayed.

The upper cover 2 will be described. The contact sheet 16 has a thickness of 1
It is made of a stainless steel plate of about 00μ and has a rectangular shape with a size corresponding to the entire frame 19. The contact sheet 16 includes a plurality of contact springs 32 having the shape shown in FIG.
are arranged in a grid pattern facing the fixed contacts 23 of the wiring board 11 and formed by an etching process, and a display window 33 and a battery window 34 corresponding to the display panel 14 and the solar cell 15 are formed by an etching process. Furthermore, a plurality of relief recesses 35 are formed on the lower surface by half-etching to correspond to the integrated circuit element 12 and electronic component 13. A movable contact 36 is provided as an operation section for inputting input to the fixed contact 23 by printing carbon paint on the lower center surface of each contact spring 32, respectively. Note that the flexible film 3 is attached to the battery window 34 of the contact sheet 16.
An escape recess 34a is formed to escape the first wiring 30.

The spacer 17 maintains the distance between the contact sheet 16 and the wiring board 11, is made of a transparent polyester film with a thickness of approximately 50 μm, and has a rectangular shape corresponding to the size of the wiring board 11.

A plurality of contact holes 37 are formed in the spacer 17 in a grid pattern at positions facing each of the fixed contacts 23 of the wiring board 11, and a plurality of relief holes 38 are formed corresponding to the integrated circuit element 12 and each electronic component 13. are formed, and each contact hole 3
7 that are adjacent to each other in one direction are communicated with each other by a communication path 37a, as shown in FIG. Note that a transparent insulating adhesive 43 having a thickness of approximately 25 μm is applied in advance to the upper and lower surfaces of the spacer 17, respectively. The frame body 19 has a thickness of 40
It is formed of a striped steel plate of about 0μ, and has a size that surrounds the electronic component structure 1, and also has a size that surrounds the electronic component structure 1.
4 and the solar cell 15, and has a rectangular frame shape as a whole. As shown in FIGS. 5 and 6, a contact piece 39a cut upward and a contact piece 39b cut downward are provided at appropriate locations on the frame 19 for electrostatic shielding. It is formed.

The upper surface protection sheet 18 protects the upper surface of the contact sheet 16, is made of a transparent polyester film with a thickness of approximately 50 μm, and has a rectangular shape slightly larger than the contact sheet 16. Opaque printing is applied to the entire lower surface of the protective sheet 18 except for the transparent display section 40 of the display panel 14 and the light receiving section 41 of the solar cell 15, and the contact sheet 1
A display print 42 for displaying the input items of the switch contacts corresponding to each of the contact springs 32 of 6 is printed. Furthermore, a transparent insulating adhesive 43 having a thickness of about 25 μm is applied to the entire lower surface of the upper surface protection sheet 18 . The spacer 17 is placed on the upper surface of the wiring board 11 of the electronic component assembly 1 and is adhered to the wiring board 11 by an insulating adhesive 43 applied to the lower surface of the spacer 17. Spacer 1 is placed on the top surface of
The spacer 7 is bonded to the spacer 17 by an insulating adhesive 43 applied to the upper surface of the spacer 7. Furthermore, the top protection sheet 18
is arranged on the upper surface of the contact sheet 16, and the transparent insulating adhesive 4 is applied to the lower surface of this upper surface protection sheet 18.
3 to the contact sheet 16. Further, the frame body 19 is provided with the electronic component structure 1 on the lower side of the contact sheet 16.
and are arranged around the spacer 17 and adhered to the lower surface of the contact sheet 16 via an adhesive 43. Thus, as shown in FIG. 4, each contact spring 32 of the contact sheet 16 and each contact hole 37 of the spacer 17 are vertically opposed and overlap each other, and each movable contact 36 of each contact spring 32 is connected to each contact of the spacer 17. It is located above and faces each fixed contact 23 of the wiring board 11 via the hole 37 . Top protection sheet 18
Each item of the display print 42 is located above each contact spring 32. This constitutes a switch.

Since the contact springs 32 of the contact sheet 16 are normally in a horizontal state due to spring force as shown in FIG.
is spaced apart from the fixed contact 23, and when the display print 42 portion of the top protection sheet 18 is pressed down with a finger as shown in FIG. 8, the contact spring 32 of the contact sheet 16 also moves downward against the spring force. The movable contact 36 bends and enters the contact hole 37 of the spacer 17, and the movable contact 36 connects to the fixed contact 2 of the wiring board 11.
3. Contact. Therefore, the pair of contacts of the fixed contact 23 are electrically connected to each other. In addition, as shown in FIG.
3 are stacked one above the other, the upper part of the display panel 14 fits into the display window 33, and its display surface faces the transparent display see-through section 40. Therefore, the display on the display panel 14 can be read from the outside via the display see-through section 40. Note that the upper surface of the display panel 14 is adhered to the upper surface protection sheet 18 with a transparent insulating adhesive 43. Further, as shown in FIG. 4, the light receiving section 41 of the protective sheet 18 and the contact sheet 1
The battery windows 34 of No. 6 are stacked vertically, the solar cell 15 is fitted into the battery window 34, and the battery element faces the transparent light receiving section 41. Therefore, the solar cell 15 can receive external light via the light receiving section 41. Note that the solar cell 15 is adhered to the protective sheet 18 via a transparent insulating adhesive 43. As shown in FIG. 3, each escape recess 35 of the contact sheet 16
The escape holes 38 of the spacer 17 overlap vertically, and the upper portions of the integrated circuit element 12 and each electronic component 13 attached to the wiring board 11 fit into the opposing escape holes 38 and escape recesses 35. Note that the integrated circuit element 12 and the electronic component 13 are electrically insulated from the contact sheet 16 by a layer of insulating adhesive 43. In this way, the upper cover 2 is laminated in close contact with the entire upper surface of the electronic component structure 1. In this embodiment, a frame 19 is provided as a part of the upper cover 2, and this frame 19 holds the electronic component structure 1 from the periphery.

The adhesive layer 4 will be described. The adhesive layer 4 is formed of an acrylic or epoxy two-component hot-melting insulating adhesive 22. The adhesive 22 is applied to the entire lower surface of the wiring board 11 in the electronic component assembly 1, and is filled to cover the integrated circuit element 12 protruding from the lower surface of the wiring board 11 and the lower part of each electronic component 13. 22
It covers and fills the lower part of the display panel 14, and also fills the lower space of the solar cell 15.

Furthermore, the adhesive 22 surrounds the entire outer periphery of the frame 19 in the upper cover 2 and is filled between the protective sheet 18 of the upper cover 2 and the protective sheet 21 of the lower cover 3. In this way, the adhesive layer 4 is formed by filling the entire lower surface of the electronic component structure 1 with the adhesive 22 in a layered manner, and adheres and fixes each component of the electronic component structure 1 from the bottom side. The unevenness of each component on the lower side of the body 1, that is, the variation in height of each component, is absorbed.

If a case structure constituting the device case is provided below the electronic component structure 1 instead of the adhesive layer 4, the structure will be complicated in order to fix the electronic component structure 1, and the electronic component structure will be It is difficult to absorb the irregularities of each component of the electronic component structure 1, and it is especially difficult to absorb the irregularities when an error occurs in the mounting dimensions of the components of the electronic component structure 1 or the thickness of the component itself during assembly. On the other hand, since the adhesive layer 4 of this embodiment has fluidity, it can absorb the unevenness of each component of the electronic component structure 1 while reliably fixing each component, especially when attaching each component during assembly. Flexibly absorbs errors in dimensions and thickness of parts themselves. In addition, in this embodiment, since the adhesive 22 adheres and fixes the outer periphery of the frame 19 between the protective sheets 18 and 21, the strength of the sheet-like small electronic calculator can be increased, and the small electronic calculator The appearance can be improved by covering the laminated seams of each component on the outer periphery with the adhesive 22.

The lower cover 3 will be described. The support sheet 20 has a thickness of 1
The upper cover 2 is made of stainless steel plate with a thickness of about 00μ.
It has a rectangular shape with the same size as the frame body 19 of. The lower surface protection sheet 21 is formed of a transparent polyester film with a thickness of about 25 μm, and has a rectangular shape slightly larger than the support sheet 20, and a transparent insulating adhesive 43 with a thickness of about 25 μm is coated on the upper surface side. has been done. And the support sheet 20
is placed overlappingly on the lower surface of the adhesive layer 4 and fixed by adhesive. The upper surface of the support sheet 20 is coated with an insulating adhesive 43 on the portion facing each component of the electronic component structure 1 in order to insulate the components from each other. The lower surface protection sheet 21 is adhesive 4
The support sheet 20 (7) is overlaid and adhesively fixed to the lower surface of the support sheet 20 (7) via the support sheet 3. In this case, the adhesive 22 flows and stops holding the lower cover 3, so the lower cover 3 can be set parallel to the upper cover 2 and at the required spacing position with high precision. (dimensions) can be freely adjusted at the manufacturing stage. The support sheet 20 supports the adhesive layer 4 from below, and the lower surface protection sheet 21 protects the lower surface of the support sheet 20. For example, decorative printing is printed on the upper surface of the lower surface protection sheet 21. It's being done.

In this sheet-like small electronic calculator, the contact sheet 16, the frame 19, and the support sheet 20 are made of metal plates, such as stainless steel plates, so that the entire computer has high mechanical strength and rigidity. The overall thickness of this sheet-like small electronic calculator is 800μ.

Furthermore, the sheet-like small electronic calculator of this embodiment is provided with electrostatic shielding measures. That is, as shown in FIG. 5, the upward contact piece 39a formed on the frame 19 contacts the lower surface of the contact sheet 16, and as shown in FIG. 6, the downward contact piece 39 formed on the frame 19 supports the It is in contact with the upper surface of the sheet 20. Therefore, since the stainless steel contact sheet 16 located on the upper side and the stainless steel support sheet 20 located on the lower side are electrically connected at the same potential via the stainless steel frame 19, This eliminates the influence of static electricity from the outside on the semiconductor integrated circuit element 12 on the wiring board 11.

Next, a method of manufacturing a sheet-like small electronic calculator having the above-mentioned configuration will be explained. First, in the electronic component structure 1, the integrated circuit element 12 and each electronic component 13 are attached to the wiring board 11 with its surface (top surface) as a reference position, and the display panel 14 and the solar cell 15 are attached to the flexible film 27.31.
Connect it to the wiring board 11 and assemble it. Upper cover 2
The frame body 19 is adhesively fixed to the lower surface of the contact sheet 16 via the adhesive 43 by heating and pressing, and then the contact sheet 16 is
The upper surface protection sheet 18 is adhered and fixed to the upper surface of the substrate via the adhesive 43 by heating and pressing to assemble.

Then, the electronic component structure 1 and the laminate of the contact sheet 16 and the top protection sheet 18 are stacked on top of each other with the spacer 17 interposed therebetween, and these two layers are heated and heated via the adhesive 43 applied to both sides of the spacer 17. Adhesive and fix by pressure. In this case, the surface side of the upper surface protection sheet 18 is used as a reference surface for bonding. As a result, the upper cover 2 and the electronic component assembly 1 are assembled, and the upper surface side of the upper cover 2 becomes a flat surface.

Note that the lower side of the electronic component structure 1 has an uneven state in which each component protrudes (see FIGS. 9 and 10).

Next, as shown in FIG. 9, the laminate of the upper cover 2 and the electronic component structure 1 is placed with the upper cover 2 facing down, and
The back side of the electronic component structure 1 is positioned on the upper side. An adhesive 22 is filled on the back side of the electronic component structure 1, which is now on the upper side, on the top and outer periphery of the laminate. Since this adhesive 22 has fluidity, it easily enters the recesses between the parts on the back side of the electronic component structure 11 and covers and embeds the convex parts of each component. The adhesive layer 4 is formed by absorbing the irregularities and dimensional variations of the parts on the side. Next, the support sheet 20 and the protection sheet 21 are bonded and fixed to each other via the adhesive 43 by heating and pressing to produce the lower cover 3, and the lower cover 3 is tested on the adhesive 22 as shown in FIG. Pressure is applied from above to fix it to the adhesive 22. Lower cover 3 is the upper part!
Press it parallel to the cover 2 until the total thickness is 800μ. In this case, since the adhesive 22 is pressed by the lower cover 3 and flows toward the outer circumference, the lower cover 3 can be lowered to a preset height position. Therefore, the upper cover 2 and the lower cover 3 can be arranged in parallel with high precision, and the thickness between the upper cover 2 and the lower cover 3 can be set with high precision relative to the design value. Note that the excess adhesive 22 is applied to the protective sheet 18 of the upper cover 2 and the lower sheet 3.
The liquid flows between the protective sheets 21 and protrudes to the outer periphery.

Next, as shown in FIGS. 10 and 11, the outer periphery of both protective sheets 18.21 and the adhesive 22 between the protective sheets 18.21 is cut into the final shape shown by broken lines. For this cutting, both protective sheets 113.21 are previously formed larger than the final shape at the manufacturing stage. After cutting into the final shape, the adhesive 22 present between the protective sheets 18 and 21 hides the outer periphery of the stainless steel contact sheet 16, frame 19 and support sheet 20, and By combining the periphery of the electronic calculator with the protective sheet 18, 21 made of resin, it is possible to create an appearance that has the feel of resin.

That is, the sheet-like small electronic calculator of the above embodiment is as follows:
An integrated circuit element 12 is attached and a plurality of fixed contacts 2 are provided on the top surface.
The upper cover 2 forming the upper surface of the computer is placed on the upper surface of the wiring board 11 on which the wiring board 11 is formed.
The lower cover 3, which forms the lower surface of the computer, is bonded to the lower surface of the wiring board 11 via a spacer 17 for maintaining sensation, which has a contact hole 37 at a position opposite to the lower surface of the upper cover 2. The contact sheet 16 is provided with a movable contact 36 corresponding to each fixed contact 23 on the surface of the wiring board 11. According to this sheet-like small electronic calculator, the wiring board is mounted on the upper cover 2 forming the top surface of the computer. 11
Since movable contacts 36 are provided that correspond to each of the fixed contacts 23 on the surface, there is no need to stack the wiring board and the sheet member for key operation in the case as in conventional small electronic calculators. The thickness can be made much thinner than that of conventional small electronic calculators, and the upper surface of the wiring board 11 can be attached to the upper surface of the wiring board 11 through a spacer 17 that is integrally provided by bonding the upper cover 2 to its lower surface. Since the lower cover 3, which forms the lower surface of the computer, is also adhered to the lower surface of the wiring board 11, the wiring board is fixed to the lower case with screws, and the sheet member for key operation is attached to the wiring board using the upper case. It is easier to assemble than conventional small electronic devices that are fixed on the top. Further, in the above embodiment, since the adjacent contact holes 37 and 37 formed in the spacer 17 are communicated with each other through the communication passage 37a formed in the spacer 17, the air in each contact hole 37 is Therefore, the key manual operation and pressing force of pressing the upper cover 2 to bring the movable contact 36 on the lower surface into contact with the fixed contact 23 on the wiring board 11 surface are released. Since the elastic return of the upper cover 2 can be performed without being affected by air pressure, the movable contact 36 can be separated from the fixed contact 23.

Next, second to fourth embodiments of the present invention will be explained with reference to FIGS. 12 to 14. Each of the embodiments shown in FIGS. 12 to 14 is applied to a sheet-like small electronic calculator like the first embodiment described above, and in FIGS. 12 to 14, FIGS. The same parts are given the same reference numerals and the explanation will be omitted.

In the second embodiment shown in FIG.
is provided between the electronic component structure 1 and the lower cover 3, and is filled between the contact sheet 16 of the upper cover 2 and the support sheet 20 of the lower cover 3, surrounding the outer periphery of the frame 19. In this case, the strength of the outer periphery is improved.

The third embodiment shown in FIG. 13 includes an upper cover 44 made of hard vinyl chloride or the like that integrates the contact sheet 16, spacer 17 and upper surface protection sheet 18 in the first embodiment described above, and an electronic component structure 1. , an adhesive layer 45;
It is composed of a lower cover 46 made of hard vinyl chloride or the like, which is an integral part of the support sheet 20 and lower surface protection sheet 21 in the first embodiment described above. The upper cover 44 does not have the function of the frame 19 in the first embodiment, but has the function of tightly holding the upper surface of the electronic component structure. Furthermore, the adhesive layer 45 directly holds the periphery of the electronic component structure 1.

The fourth embodiment shown in FIG. 14 uses an upper cover 47 made of hard vinyl chloride or the like in which the contact sheet 16, spacer 17, upper surface protection sheet 18, and frame 19 of the first embodiment are integrated.

Note that the lower cover 46 has the same configuration as the third embodiment.

The adhesive layer 48 of this fourth embodiment is interposed between the upper cover 47 and the electronic component structure 1 and the lower cover 46.

In this way, the upper cover includes the contact sheet 16, the spacer 1
7 and the upper surface protection sheet 1B may be all separated and laminated, or may be provided in whole or in part, and the frame 19 may be provided separately or integrally as necessary. The lower sheet includes a support sheet 20 and a protection sheet 2.
1 may be separated and laminated, or may be provided integrally. The adhesive layer 4 is provided between the electronic component structure 1 and the lower cover, and may be provided on the outer periphery if necessary.

Further, the configuration of each part of the electronic component structure 1 is not limited to the above embodiments, and for example, a sheet-shaped manganese battery or the like may be used instead of a solar battery.

Note that the present invention is not limited to sheet-like small electronic calculators, but can of course be widely applied to other small electronic devices.

[Effects of the Invention] According to the small electronic device of the present invention, movable contacts corresponding to each fixed contact on the wiring board surface are provided on the upper cover forming the top surface of the device, so compared to conventional small electronic devices. The thickness can be made significantly thinner, and the upper cover can be adhered to the upper surface of the wiring board via a spacing material, and the lower cover forming the lower surface of the device can also be adhered to the lower surface of the wiring board. Because of this, it is easier to assemble than conventional small electronic devices.

[Brief explanation of the drawing]

1 to 11 show a first embodiment of the present invention, FIGS. 1 and 2 are an exploded perspective view and an external view of a sheet-like small electronic calculator, and FIG. 3 is a second embodiment of the present invention. 4 is a sectional view taken along line C-C in Figure 2, Figure 5 is a sectional view taken along line C-C in Figure 2, and Figure 5 is a sectional view taken along line C-C in Figure 2. 7 is a plan view showing the contact spring of the contact sheet, FIG. 8 is a sectional view of the switch section showing the operating state of the switch, and FIGS. 9 and 10 are a sheet-like small electronic calculator. FIG. 11 is a perspective view showing a semi-finished product of a sheet-like small electronic calculator. Figure 12,
FIGS. 13 and 14 are sectional views of sheet-like small electronic calculators showing second to fourth embodiments, respectively. 1... Electronic component structure, 2, 44. 47... Upper cover, 3, 46... Lower cover, 4. ．． 45.48・
... Adhesive layer, 11... Wiring board, 12... Integrated circuit element, 13... Semiconductor component, 14... Display panel, 15... Solar cell, 16... Contact sheet, 17・
...Spacer, 18...Top protection sheet, 19...
Frame body, 20... Support sheet, 21... Lower surface protection sheet, 22... Adhesive, 23... Fixed contact, 32...
・Contact spring, 33...Display window, 34...Battery window, 3
6... Movable contact, 37... Contact hole, 37a... Communication path, 40... Transparent display section, 41... Light receiving section, 43
...Insulating adhesive. Applicant's Representative Patent Attorney Takeshi Suzue 3.2nd Diagram 4.5 Figure 9a Figure 6.8 Figure 9.10 Figure 11

Claims (2)

[Claims] (1) On the top surface of a wiring board on which an integrated circuit element is mounted and a plurality of fixed contacts are formed on the top surface, a top cover forming the top surface of the device is attached, and a contact hole is formed at a position facing each fixed contact on the surface of the wiring board. A lower cover forming the lower surface of the device is adhered to the lower surface of the wiring board via a spacing material having a spacing material, and a movable contact corresponding to each fixed contact on the wiring board surface is attached to the lower surface of the upper cover. A small electronic device characterized by being equipped with. (2) A small electronic device according to claim 1, wherein adjacent contact holes of the spacing member are in communication with each other.