JPS62276656A - Compact electronic equipment - Google Patents

Abstract

PURPOSE:To thin the thickness of the titled equipment while sufficiently holding strength by unifying an electronic part constituent with a metal plate-like sheet member constituting upper and lower covers of the equipment. CONSTITUTION:The electronic part constituent 1 is constituted by combining a wired substrate 11, a semiconductor integrated circuit element 12, electronic parts 13, a display panel 14, and solar battery. The upper cover 2 is constituted by laminating a metal sheet 16 serving as a main quest, an upper protecting sheet 18, a spacer 17, and a frame body 19. The lower cover 3 is constituted by laminating a metal sheet 20 serving as a main body and a lower protection sheet 21. The upper and lower metal sheet 16, 20 are stuck to the electronic part constituent 1 by insulating adhesives 22.

Description

[Detailed description of the invention] 3. Detailed description of the invention [Industrial application field] The present invention relates to a thin electronic device.

[Conventional technology] Conventionally, small electronic devices such as small electronic calculators
A device case is known in which various electronic components are housed in an equipment case that is a combination of a pair of upper and lower cases made of synthetic resin.

[Problem to be solved by the invention] In recent years, small electronic devices such as small electronic calculators have been becoming thinner, and it has become possible to make small electronic devices as thin as credit cards. It is being considered.

However, conventional small electronic devices, as mentioned above,
Since various electronic components are housed in a device case made of synthetic resin, if the thickness of the upper and lower resin cases is made thinner in order to make the device thinner, the strength of the device will be weakened. For this reason, in conventional small electronic devices, the thickness of the case cannot be made very thin, so the thickness of the device cannot be made as thin as that of a credit card. The present invention has been made in view of the above-mentioned circumstances, and its purpose is to provide a small electronic device.

[Means for solving problems]

The small electronic device of the present invention has a metal plate sheet member forming an upper cover of the device and a metal plate sheet member forming a lower cover of the device on both upper and lower surfaces of an electronic component structure including at least an integrated circuit element and a wiring board. It is characterized in that the sheet members are bonded to each other using an insulating adhesive.

[Function] According to the small electronic device of the present invention, since there are metal plate sheet members constituting the upper cover and metal plate sheet members constituting the lower cover on the upper and lower surfaces of the device, the upper and lower The strength of the upper and lower surfaces of the device can be ensured by the metal plate sheet members, and since the upper and lower metal plate sheet members are each bonded to the electronic component structure with an insulating adhesive, the upper part of the device The strength of the entire device can be ensured by integrating the metal plate sheet members that make up the cover and the lower cover with the electronic component components, so it is possible to achieve a significant reduction in thickness while ensuring sufficient strength. Can be done.

[Embodiments of the invention] Embodiments of the present invention illustrated in the drawings will be described below.

DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to a sheet-like small electronic calculator shown in FIGS. 1 to 11.

Figure 2 shows the external appearance of a sheet-like small electronic calculator;
The figure shows a disassembled state. In the figure, 1 is an electronic component structure, 2 is an upper cover, and 3 is a lower cover. The electronic component structure 1 is configured by combining a wiring board 11, a semiconductor integrated circuit element 12, an electronic component 13, a display panel 14, and a solar cell 15. The upper cover 2 includes a metal sheet 16 as its main body, a top protection sheet 18, a spacer 17,
and a frame body 19 are laminated. The lower cover 3 is mainly composed of a metal sheet 20 and a lower protective sheet 2.
1 is laminated. Although not shown in FIG. 3, reference numeral 4 in FIG. 1 and FIGS. 4 to 6 indicates an adhesive layer made of an insulating adhesive 22. In FIG. Then, an upper cover 2 is closely laminated on the upper side of the electronic component structure 1, an adhesive layer 4 is provided on the lower side of the electronic component structure 1, and an adhesive layer 4 is provided on the lower side of the electronic component structure 1.
A lower cover 3 is closely laminated on the lower side of the holder, and the whole is in the form of a thin sheet.

Next, the structure of each part will be described with reference to FIG. 1 and FIGS. 4 to 8. Figure 1 is a sectional view taken along line C-C in Figure 2;
FIG. 4 is a sectional view taken along the line C-C in FIG. 2, FIG. 5 is a sectional view taken along the line C-C in FIG. and FIG. 8 are drawings showing the switch portion, respectively.

The electronic component structure 1 will be described. The wiring board 11 is made of an insulating material and has a rectangular sheet shape with a thickness of about 220 μm, and has a plurality of fixed contacts 23 arranged in a grid pattern on the top surface, each consisting of a pair of contacts as switch contacts. A predetermined wiring pattern including fixed contacts 23 and terminals 24 and 28, which will be described later, is formed on the upper and lower surfaces. A semiconductor integrated circuit element 12 and electronic components 13 such as chip capacitors and diodes are installed in the β-shaped hole 11a of the wiring board 11 by passing through the hole 11a from above and below.
These are connected to the wiring pattern of the wiring board 11.

The display panel 14 consists of a liquid crystal display panel with a thickness of about 550 μm in which liquid crystal is packaged in a film.The liquid crystal is sealed between the upper and lower films, which serve as upper and lower electrode substrates, and one end portion 14a of the film is sealed. It is.

The display panel 14 has the same air I on one side of the wiring board 11.
, J+,: I￥! □Wow. □1.7□ The terminals 24 formed on the lower surface of the wing 11 and the terminals 25 formed on the lower surface of the upper electrode substrate of the display panel 14 are connected to a flexible film 27 having wiring 26 made of conductive adhesive. The terminals 24 and 25 and the wiring 26 are bonded together by heat and pressure.

The solar cell 15 has a thickness of about 180 μm and is made by forming an amorphous silicon thin film on the upper surface of a stainless steel substrate, and is disposed on the same plane as the display panel 14 on one side of the wiring board 11 . As shown in FIG. 4, the terminals 28 formed on the lower surface of the wiring board 11 and the solar cell 15
The terminals 29 formed on the upper surface of the substrate are connected by a flexible film 31 having wiring 30 made of a conductive adhesive, and the wiring 30 and the terminals 28 and 29 are bonded by heating and pressing. In this case, the wiring 30 is formed on the opposite surface of the flexible film 31 so as not to short-circuit to the substrate side of the solar cell 15, and the wiring 30 is connected to the solar cell 15 through a through hole 31a at the terminal 29 portion of the solar cell 15.
It is led out to the side and electrically connected to the terminal 29. In this way, the electronic component structure 1 is constructed by arranging each component in a plane and electrically connecting them to each other, and the semiconductor integrated circuit element 12 operates using the solar cell 15 as a power source and the input signal from the fixed contact 23. A display signal is output to the display panel 14, and the calculation result is displayed.

The upper cover 2 will be described. The metal sheet 16, which is the main body of the upper cover, is made of a metal plate, for example, a stainless steel plate, with a thickness of about 100 μm, and has a rectangular shape corresponding to the entire frame 19. This metal sheet 16 also serves as a contact sheet, and a plurality of contact springs 32 having the shape shown in FIG.
They are arranged in a grid pattern facing the fixed contacts 23 of 1 and formed by an etching process, and a display window 33 and a battery window 34 corresponding to the display panel 14 and the solar cell 15 are formed by an etching process. A plurality of relief recesses 35 corresponding to the integrated circuit element 12 and the electronic component 13 are formed by half-etching. A movable contact 36 is provided as an operation section for inputting input to the fixed contact 23 by printing carbon paint on the lower center surface of each contact spring 32, respectively. In addition,
An escape recess 34a is formed in the battery window 34 of the metal sheet 16 to allow the wiring 30 of the flexible film 31 to escape. The spacer 17 maintains the distance between the metal sheet 16, which also serves as a contact sheet, and the wiring board 11, and is made of a transparent polyester film with a thickness of approximately 50 μm, and has a rectangular shape corresponding to the size of the wiring board 11. I am doing it. A plurality of contact holes 37 are formed in the spacer 17 in a grid pattern at positions facing each of the fixed contacts 23 of the wiring board 11, and a plurality of relief holes 38 are formed corresponding to the integrated circuit element 12 and each electronic component 13. is formed. Note that a transparent insulating adhesive 43 having a thickness of approximately 25 μm is applied in advance to the upper and lower surfaces of the spacer 17, respectively.

The frame 19 is formed of a metal plate, for example, a stainless steel plate, with a thickness of about 400 μm, and has a size that surrounds the electronic component structure 1, and has a protrusion 19a that partitions the display panel 14 and the solar cell 15. It has a rectangular frame shape as a whole. As shown in FIGS. 5 and 6, a contact piece 39a cut upward and a contact piece 39b cut downward are provided at appropriate locations on the frame 19 for electrostatic shielding. It is formed. The upper surface protection sheet 18 protects the upper surface of the metal sheet 16, is made of a transparent polyester film with a thickness of approximately 50 μm, and has a rectangular shape slightly larger than the metal sheet 16. This protective sheet 18 has opaque printing applied to the entire lower surface of the protective sheet 18, except for the transparent display section 40 of the display panel 14 and the light receiving section 41 of the solar cell 15, and also has a pattern corresponding to each contact spring 32 of the metal sheet 16. Display print 4 that displays switch contact input items
2 is printed. Furthermore, a transparent insulating adhesive 43 with a thickness of about 25 μm is applied to the entire surface of the lower surface of the upper surface protection sheet 18.
is coated. The spacer 17 is arranged on the upper surface of the wiring board 11 of the electronic component structure 1, and the spacer 17
The metal sheet 16 is bonded to the wiring board 11 by an insulating adhesive 43 applied to the lower surface of the spacer 17, and furthermore, the metal sheet 16 is placed on the upper surface of the spacer 17, and the metal sheet 16 is bonded to the spacer 17 by the insulating adhesive 43 applied to the upper surface of the spacer 17. It is glued with. Further, the upper surface protection sheet 18 is placed on the upper surface of the metal sheet 16, and the transparent insulating adhesive 43 applied to the lower surface of this upper surface protection sheet 18 is applied to the metal sheet 16.
6 is glued.

Further, the frame body 19 is arranged below the metal sheet 16 to surround the electronic component construction method 1 and the spacer 17, and is bonded to the lower surface of the metal sheet 16 via an adhesive 43. Therefore, as shown in FIG.
The contact springs 32 and the contact holes 37 of the spacer 17 are vertically opposed and overlap each other, and each movable contact 3 of each contact spring 32 is
6 is connected to the wiring board 11 through each contact hole 37 of the spacer 17.
are located above and face each of the fixed contacts 23 . Each item of the display print 42 on the top protection sheet 18 is located above each contact spring 32. This constitutes a switch. Since the contact spring 32 of the metal sheet 16 is normally in a horizontal state due to the spring force as shown in FIG.
6 is spaced apart from the fixed contact 23, and when the display print 42 portion of the upper protective sheet 18 is pressed down with a finger as shown in FIG. 8, the contact spring 32 of the metal sheet 16 also resists the spring force The contact hole 37 of the spacer 17 is bent downward.
The movable contact 36 contacts the fixed contact 23 of the wiring board 11. Therefore, the pair of contacts of the fixed contact 23 are electrically connected to each other.

Further, as shown in FIG. 1, the display transparent portion 40 of the top protection sheet 18 and the display window 33 of the metal sheet 16 are vertically overlapped, and the upper part of the display panel 14 is fitted into the display window 33, so that the display surface faces the transparent display see-through section 40. Therefore, the display on the display panel 14 can be read from the outside via the display see-through section 40. In addition, display panel 1
The upper surface of 4 is adhered to the upper surface protection sheet 18 with a transparent insulating adhesive 43. Further, as shown in FIG. 4, the light receiving section 41 of the protective sheet 18 and the battery window 34 of the metal sheet 16 are vertically overlapped, and the solar cell 15 is fitted into the battery window 34, and the battery element is placed in the transparent light receiving section. I am facing 41. Therefore, the solar cell 15 can receive external light via the light receiving section 41. Note that the solar cell 15 is adhered to the protective sheet 18 via a transparent insulating adhesive 43. As shown in FIG. 1, the escape recesses 35 of the metal sheet 16 and the escape holes 38 of the spacer 17 overlap vertically, and the escape holes are such that the integrated circuit element 12 mounted on the wiring board 11 and the upper part of each electronic component 13 face each other. 38 and the escape recess 35 . Note that the integrated circuit element 12 and the electronic component 13 are electrically insulated from the metal sheet 16 by a layer of insulating adhesive 43.

In this way, the upper cover 2 is laminated in close contact with the entire upper surface of the electronic component structure 1. In this embodiment, a frame 19 is provided as a part of the upper cover 2, and this frame 19
holds the electronic component structure 1 from the periphery.

The adhesive layer 4 will be described. The adhesive layer 4 is formed of an acrylic or epoxy two-component hot-melting insulating adhesive 22. The adhesive 22 is applied to the entire lower surface of the wiring board 11 in the electronic component assembly 1, and is filled so as to cover the integrated circuit element 12 protruding from the lower surface of the wiring board 11 and the lower part of each electronic component 13. agent 22
It covers and fills the lower part of the display panel 14, and also fills the lower space of the solar cell 15.

Furthermore, the adhesive 22 surrounds the entire outer periphery of the frame 19 in the upper cover 2 and is filled between the protective sheet 18 of the upper cover 2 and the protective sheet 21 of the lower cover 3. In this way, the adhesive layer 4 is formed by filling the entire lower surface of the electronic component structure 1 with the adhesive 22 in a layered manner, and adheres and fixes each component of the electronic component structure 1 from the bottom side. The unevenness of each component on the lower side of the body 1, that is, the variation in height of each component, is absorbed.

If a case structure constituting the device case is provided below the electronic component structure 1 instead of the adhesive layer 4, the structure will be complicated in order to fix the electronic component structure 1, and the electronic component structure will be It is difficult to absorb the irregularities of each component of the electronic component structure 1, and it is especially difficult to absorb the irregularities when an error occurs in the mounting dimensions of the components of the electronic component structure 1 or the thickness of the component itself during assembly. On the other hand, since the adhesive layer 4 of this embodiment has fluidity, it can absorb the unevenness of each component of the electronic component structure 1 while reliably fixing each component, especially when attaching each component during assembly. It can flexibly absorb errors in dimensions and thickness of the parts themselves. In addition, in this embodiment, since the adhesive 22 adheres and fixes the outer periphery of the frame 19 between the protective sheets 18 and 21, the strength of the sheet-like small electronic calculator can be increased, and the small electronic calculator The appearance can be improved by covering the laminated seams of each component on the outer periphery with the adhesive 22.

The lower cover 3 will be described. The metal sheet 20, which is the main body of the lower cover 3, is formed of a metal plate, for example, a stainless steel plate, with a thickness of about 100 μm.
It is a rectangle of the same size. Lower surface protection sheet 21
is made of a transparent polyester film with a thickness of about 25μ, and has a rectangular shape that is slightly larger than the metal sheet 20.
A transparent insulating adhesive 43 with a thickness of about 25μ is attached to the upper surface side.
is coated. The metal sheet 2G is placed overlappingly on the lower surface of the adhesive layer 4 and fixed by adhesive. The upper surface of the metal sheet 20 is coated with an insulating adhesive 43 on the portion facing each component of the electronic component structure 1 in order to insulate each component from each other. The lower surface protection sheet 21 is overlaid and adhesively fixed to the lower surface of the metal sheet 2G via an adhesive 43. In this case, the adhesive 22 flows and stops holding the lower cover 3, so the lower cover 3 can be set parallel to the upper cover 2 and at the required spacing position with high precision. (dimensions) can be freely adjusted at the manufacturing stage. The metal sheet 20 supports the adhesive layer 4 from below, and the lower surface protection sheet 21 protects the lower surface of the metal sheet 20.
For example, there is decorative printing on the top surface.

In this sheet-like small electronic calculator, the contact sheet 16, the frame 19, and the support sheet 20 are made of metal plates, such as stainless steel plates, so that the entire computer has high mechanical strength and rigidity. The overall thickness of this sheet-like small electronic calculator is 800μ.

Furthermore, the sheet-like small electronic calculator of this embodiment is provided with electrostatic shielding measures. That is, as shown in FIG. 5, the upward contact piece 39a formed on the frame 19 contacts the lower surface of the metal sheet 16 of the upper cover 2, and the downward contact formed on the frame 19 as shown in FIG. The piece 39b is in contact with the upper surface of the metal sheet 20 of the lower cover 3.

Therefore, since the metal sheet 16 located on the upper side and the metal sheet 20 located on the lower side are electrically connected at the same potential through the metal frame 19, the influence of static electricity from the outside is reduced. This prevents any influence on the semiconductor integrated circuit element 12 on the semiconductor integrated circuit element 11.

Next, a method of manufacturing a sheet-like small electronic calculator having the above-mentioned configuration will be explained. First, in the electronic component structure 1, the integrated circuit element 12 and each electronic component 13 are attached to the wiring board 11 with its surface (top surface) as a reference position, and the display panel 14 and the solar cell 15 are attached to the flexible film 27.31.
Connect it to the wiring board 11 and assemble it. Upper cover 2
The frame body 19 is adhesively fixed to the lower surface of the metal sheet 16 via the adhesive 43 by heating and pressing, and then the metal sheet 16 is
The upper surface protection sheet 18 is adhered and fixed to the upper surface of the substrate via the adhesive 43 by heating and pressing to assemble.

Then, the electronic component structure 1 and the laminate of the metal sheet 16 and the top protection sheet 18 are stacked with the spacer 17 in between, and the two layers are heated and heated via the adhesive 43 applied to both sides of the spacer 17. Glue and fix with a pressure blade. In this case, the surface side of the upper surface protection sheet 18 is used as a reference surface for bonding. As a result, the upper cover 2 and the electronic component assembly 1 are assembled, and the upper surface side of the upper cover 2 becomes a flat surface. Note that the lower side of the electronic component structure 1 has an uneven state in which each component protrudes (see FIGS. 9 and 10).

Next, as shown in FIG. 9, the laminate of the upper cover 2 and the electronic component structure 1 is placed with the upper cover 2 facing down, and
The back side of the electronic component structure 1 is positioned on the upper side. An adhesive 22 is filled on the back side of the electronic component structure 1 which is now on the upper side, on the top and outer periphery of the aS body. Since this adhesive 22 has fluidity, it easily enters the recesses between the parts on the back side of the electronic component structure 11 and covers and embeds the convex parts of each component. The adhesive layer 4 is formed by absorbing the irregularities and dimensional variations of the parts on the side. Next, the lower cover 3 is manufactured by bonding and fixing the metal sheet 20 and the protective sheet 21 to each other via the adhesive 43 by heating and pressing, and as shown in FIG. 10, the lower cover 3 is placed on the adhesive 22. Pressure is applied from above to fix it to the adhesive 22. The lower cover 3 is made parallel to the upper cover 2 and rolled down to a position where the total thickness is 800μ. In this case, since the adhesive 22 is pressed by the lower cover 3 and flows toward the outer circumference, the lower cover 3 can be lowered to a preset height position. Therefore, the upper cover 2 and the lower cover 3 can be arranged in parallel with high precision, and the thickness between the upper cover 2 and the lower cover 3 can be set with high precision relative to the design value. Note that the excess adhesive 22 is applied to the protective sheet 18 of the upper cover 2 and the lower sheet 3.
The liquid flows between the protective sheets 21 and protrudes to the outer periphery.

Next, as shown in FIGS. 10 and 11, the outer periphery of both protective sheets lli, 21 and the adhesive 22 between the protective sheets 18.degree. 21 is cut into the final shape shown by broken lines. For this cutting, both protective sheets 18 and 21 are previously formed to be larger than the final shape at the manufacturing stage. After cutting into the final shape, the adhesive 22 present between the protective sheets 18 and 21 is applied to the upper and lower metal contact sheets 16.
．． 20 and the outer periphery of the frame 19 can be hidden, and the periphery of the sheet-like small electronic calculator can be made to look like resin in combination with the protective sheets 18 and 21 made of resin.

That is, the sheet-like small electronic calculator of the above embodiment is as follows:
The main body is a metal sheet 16, and a metal frame 19 is provided on the lower surface of the metal sheet 16.
A case body of the computer is constituted by an upper cover 2 to which is glued and a lower cover 3 mainly made of a metal sheet 20.
Between the upper cover 2 and the lower cover 3, an electronic component structure 1 is housed, in which a display panel 14 and a solar cell 15 are connected to a wiring board 11 on which an integrated circuit element 12 and an electronic component 13 are attached. A metal sheet 1 constituting the upper cover 2 is placed on the upper surface of the wiring board 11 of the component structure 1.
6 is bonded via a spacer 17 with an adhesive 43 applied to the upper and lower surfaces of this spacer 17, and then the wiring board 11 of the electronic component structure 1, the display panel 14, and the solar cell 1 are bonded together.
5, a metal sheet 20 constituting the lower cover 3 is adhered to the lower surface of the sheet-like According to a small electronic calculator, since there are a metal sheet 16 constituting the upper cover 2 and a metal sheet 20 constituting the lower cover 3 on its upper and lower surfaces, respectively, these upper and lower metal sheets 16 and 20 cover the upper and lower surfaces of the calculator. In addition, the upper and lower metal sheets 16 and 20 can be attached to the electronic component structure 1, respectively.
Since the metal sheets 16 and 20 constituting the upper cover 2 and lower cover 3 of the computer and the electronic component structure 1 are bonded together with the insulating adhesives 43 and 22, the strength of the entire computer is improved. Since it is possible to ensure sufficient strength, it is possible to significantly reduce the thickness while ensuring sufficient strength.

Next, a second embodiment of the present invention will be described with reference to FIG. This second embodiment is applied to a sheet-like small electronic calculator like the first embodiment described above, and the same parts in FIG. 12 as in FIGS. 1 and 3 are given the same reference numerals and explained. omitted.

In this second embodiment, the adhesive 22 of the adhesive layer 4 is provided between the electronic component structure 1 and the lower cover 3, and the adhesive 22 of the adhesive layer 4 is provided between the metal sheet 16 of the upper cover 2 and the metal sheet 20 of the lower cover 3. The outer periphery of the frame 19 is surrounded and filled. In this case, the strength of the outer periphery is improved.

In addition, in the above embodiment, the upper cover 2 is made of metal sheet 1.
6 has a structure in which the upper surface protection trunk 18, the spacer and the frame body 19 are bonded, and the lower cover 3 has a structure in which the lower surface protection sheet 18 is bonded to the metal sheet 20, but the upper cover 2 and the lower cover 3 are However, the frame body 19 is not limited to the above embodiment as long as it is made of a sheet member made of a metal plate, and the frame body 19 may be formed integrally with the metal sheet. Further, the present invention is not limited to sheet-like small electronic calculators, but can be widely applied to other small electronic devices, and the electronic component structure may include at least an integrated circuit element and a wiring board.

[Effects of the Invention] According to the small electronic device of the present invention, there are metal plates constituting the upper cover and metal plates constituting the lower cover on the upper and lower surfaces of the device, respectively. The strength of the upper and lower surfaces can be ensured, and since the upper and lower metal plates are each bonded to the electronic component components using insulating adhesive, the metal plates that make up the upper and lower covers of the device and the electronic Although it is possible to ensure the strength of the entire device by integrating the parts and components, there are some problems.

A thin and wide seal with sufficient strength.
to'

[Brief explanation of drawings]

1 to 11 show a first embodiment of the present invention, in which FIG. 1 is a sectional view taken along the line C-C in FIG. 2, and FIG. 2 is an external view showing a sheet-like small electronic calculator. , FIG. 3 is an exploded perspective view, FIG. 4 is a sectional view taken along line C-C in FIG. 2, FIG. 5 is a sectional view taken along line C-C in FIG. 2, and FIG. 6 is a sectional view taken along line C-C in FIG. 7 is a plan view showing the contact spring of the contact sheet, FIG. 8 is a sectional view of the switch section showing the operating state of the switch, and FIGS. 9 and 10 are sheet-like small electronic types. FIG. 11 is a perspective view showing a semi-finished product of a sheet-like small electronic calculator. FIG. 12 is a sectional view of a sheet-like small electronic calculator showing a second embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Electronic component structure, 2... Upper cover, 3...
- Lower cover, 4... Adhesive layer, 11... Wiring board, 12... Integrated circuit element, 13... Semiconductor component, 1
4...Display panel, 15...Solar cell, 16...
Metal sheet, 17... Spacer, 18... Top protection sheet, 19... Frame, 20... Metal sheet, 21
... Bottom protection sheet, 22 ... Adhesive, 23 ...
Fixed contact, 32...Contact spring, 33...Display window, 3
4... Battery window, 36... Movable contact, 4G... Transparent display section, 41... Light receiving section, 43... Insulating adhesive. Applicant's Representative Patent Attorney Takehiko Suzue Figure 2 Figure 4 Figure 3R Figure 5 Figure 6 Figure 8 Figure 9 Figure 10

Claims (1)

[Claims] A metal plate sheet member constituting the upper cover of the device and a metal plate sheet member constituting the lower cover of the device are insulatively bonded to both upper and lower surfaces of the electronic component structure including at least an integrated circuit element and a wiring board. A small electronic device characterized by being bonded with an adhesive.