JPH09311921A - Circuit board and ic card using the same - Google Patents
Circuit board and ic card using the sameInfo
- Publication number
- JPH09311921A JPH09311921A JP8126013A JP12601396A JPH09311921A JP H09311921 A JPH09311921 A JP H09311921A JP 8126013 A JP8126013 A JP 8126013A JP 12601396 A JP12601396 A JP 12601396A JP H09311921 A JPH09311921 A JP H09311921A
- Authority
- JP
- Japan
- Prior art keywords
- card
- electrode
- solar cell
- circuit board
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004973 liquid crystal related substance Substances 0.000 claims description 19
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 abstract description 13
- 229910052751 metal Inorganic materials 0.000 abstract description 13
- 239000002985 plastic film Substances 0.000 abstract description 10
- 229920006255 plastic film Polymers 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 8
- 239000010409 thin film Substances 0.000 abstract description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 2
- 229910052710 silicon Inorganic materials 0.000 abstract 2
- 239000010703 silicon Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 description 26
- 239000010408 film Substances 0.000 description 21
- 239000004020 conductor Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、回路基板及びそれ
を用いたＩＣカードの構造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board and an IC card structure using the same.
【０００２】[0002]
【従来の技術】従来、このような分野の技術としては、
文献名：工業調査会発行、「ＩＣカードの仕組み」、Ｐ
１０〜１４に開示されるものがあった。上記文献にも示
されているように、一般にＩＣカードは５４×８６×
０．７６ｍｍのサイズで実現されており、ＩＳＯの規格
でも同様に定められている。2. Description of the Related Art Conventionally, techniques in such a field include:
Reference name: Published by Industrial Research Society, "Structure of IC card", P
10 to 14 were disclosed. As shown in the above document, IC cards are generally 54 × 86 ×
It is realized with a size of 0.76 mm, and is also defined by the ISO standard.
【０００３】しかし、一方では、ＬＣＤ（液晶表示装
置）や電源用太陽電池、キースイッチ等を具備した、例
えば、電卓カードや、金融用カード等のＩＣカードの需
要も多い。これらのＩＣカードに採用される液晶表示装
置や太陽電池は、ガラス製が一般的であるが、カードの
強度アップや薄型化を考慮すると、フレキシブルタイプ
のものが望まれ、ガラスの代わりに透明フィルムを用い
た液晶表示装置や、ガラスの代わりにプラスチックフィ
ルムを用いた太陽電池が、各メーカーで製造されてお
り、量産レベルでの購入が可能である。On the other hand, on the other hand, there is also a great demand for IC cards such as calculator cards and financial cards equipped with an LCD (liquid crystal display), a solar battery for power supply, a key switch and the like. The liquid crystal display devices and solar cells used in these IC cards are generally made of glass, but considering the strength and thinning of the card, a flexible type is desired, and a transparent film is used instead of glass. Liquid crystal display devices using the above, and solar cells using plastic films instead of glass are manufactured by each manufacturer and can be purchased at a mass production level.
【０００４】図３は従来のＩＣカードの構造を示す断面
図であり、図３（ａ）はＩＣカード組立前を示し、図３
（ｂ）はＩＣカード組立後を示している。まず、図３
（ａ）に示すように、基板３はガラスエポキシ等の樹脂
基板、特に、薄型化を望まれる場合は、プラスチックフ
ィルム基板等を用い、この基板３の表裏にはＣｕ等のキ
ー電極（基板側）４や導体５が形成され、バンプ６にて
ＩＣチップ７が搭載されている。FIG. 3 is a sectional view showing the structure of a conventional IC card, and FIG. 3 (a) shows a state before the IC card is assembled.
(B) shows the IC card after assembly. First, FIG.
As shown in (a), the substrate 3 is a resin substrate such as glass epoxy, and particularly when a thin film is desired, a plastic film substrate or the like is used. On the front and back of this substrate 3, key electrodes such as Cu (on the substrate side) are used. 4) and the conductor 5 are formed, and the IC chip 7 is mounted by the bump 6.
【０００５】液晶表示装置はＩＴＯ（透明電極）が形成
された液晶表示装置（上フィルム）８と液晶表示装置
（下フィルム）９を液晶を注入するギャップを持って貼
り合わせ、接続部透明電極１０と基板３の導体５をヒー
トシール１１で電気的かつ機械的に接続する。フレキシ
ブルなプラスチックフィルムを基材とした太陽電池１２
は、その電極部と基板３の導体５を、やはり、ヒートシ
ール１１で電気的かつ機械的に接続する。In the liquid crystal display device, a liquid crystal display device (upper film) 8 on which ITO (transparent electrode) is formed and a liquid crystal display device (lower film) 9 are bonded together with a gap for injecting liquid crystal, and a transparent electrode 10 at a connecting portion is connected. And the conductor 5 of the substrate 3 are electrically and mechanically connected by a heat seal 11. Solar cell 12 based on flexible plastic film 12
Also electrically and mechanically connects the electrode part and the conductor 5 of the substrate 3 with the heat seal 11.
【０００６】このようにして、組み立てられた基板部
を、樹脂フレーム１４に納め、フィルム側キー電極２が
形成された表面フィルム１でカバーリングして完成とな
る。構造をより明確にするために、図３（ａ）と図３
（ｂ）ともに接着剤を除いて記述しており、実際には各
部組立に接着フィルム等が用いられている。図４は従来
のＩＣカードの斜視図であり、図４（ａ）は表面フィル
ムを、図４（ｂ）は液晶表示装置と樹脂フレームを、図
４（ｃ）はＩＣカードの組立後をそれぞれ示している。The thus assembled substrate portion is placed in the resin frame 14 and covered with the surface film 1 on which the film side key electrode 2 is formed to complete the process. In order to clarify the structure, FIG. 3A and FIG.
Both (b) are described without the adhesive, and in practice, an adhesive film or the like is used for assembling each part. FIG. 4 is a perspective view of a conventional IC card. FIG. 4 (a) shows a surface film, FIG. 4 (b) shows a liquid crystal display device and a resin frame, and FIG. 4 (c) shows an assembled IC card. Shows.
【０００７】この図に示すように、基板３には基板側キ
ー電極４が形成され、ＩＣチップ７やチップコンデンサ
１６が搭載され、液晶表示装置８や太陽電池１２はヒー
トシール１１で基板３と接続されている。このようにし
て、組み立てられた基板部を、樹脂フレーム１４に納
め、キーパッド１５が形成された表面フィルム１を貼り
完成となる。As shown in this figure, the substrate side key electrode 4 is formed on the substrate 3, the IC chip 7 and the chip capacitor 16 are mounted, and the liquid crystal display device 8 and the solar cell 12 are heat-sealed 11 to the substrate 3. It is connected. In this way, the assembled substrate portion is housed in the resin frame 14, and the surface film 1 on which the keypad 15 is formed is attached and completed.
【０００８】[0008]
【発明が解決しようとする課題】しかしながら、上記し
た従来のＩＣカードの構造では、以下に述べるような問
題点があった。 （１）液晶表示装置、太陽電池、ヒートシール等一般の
ＩＣカードと比較して部品点数が多く、部材費、加工費
ともに増加して、結果として高価なカードとなってしま
う。However, the structure of the conventional IC card described above has the following problems. (1) Compared with general IC cards such as liquid crystal display devices, solar cells, and heat seals, the number of parts is large, and both the material cost and the processing cost increase, resulting in an expensive card.
【０００９】ＩＣカードは、その使用環境から薄利多売
品であり、ターゲットコストは数百円〜千数百円であ
る。従来技術で説明したＩＣカードは、液晶表示装置や
電源用太陽電池、キースイッチ等を具備した電卓カード
または金融用カード等のＩＣカードであるが、コストダ
ウン要求が厳しいことには変わりがなく、低価格化はカ
ード拡販の最重要課題となっている。The IC card is a thin-selling product because of the environment in which it is used, and its target cost is several hundred yen to several thousand and several hundred yen. The IC card described in the prior art is an IC card such as a calculator card or a financial card equipped with a liquid crystal display device, a solar battery for power supply, a key switch, etc., but the demand for cost reduction remains the same. Price reduction is the most important issue for card sales expansion.
【００１０】（２）ヒートシール等の接続ポイントが多
く、カードの信頼性が落ちる。特に、金融カード等、金
券対応のカードが要求される場合が多く、カードの信頼
性の向上は低価格化とともに最重要課題である。本発明
は、上記問題点を除去し、信頼性が高く、かつ低価格化
を図ることができる回路基板及びそれを用いたＩＣカー
ドを提供することを目的とする。(2) Since there are many connection points such as heat seals, the reliability of the card decreases. In particular, there are many cases where a card corresponding to a voucher, such as a financial card, is required, and improvement of the reliability of the card is the most important issue along with cost reduction. SUMMARY OF THE INVENTION It is an object of the present invention to provide a circuit board which eliminates the above-mentioned problems, has high reliability, and can be manufactured at low cost, and an IC card using the same.
【００１１】[0011]
【課題を解決するための手段】本発明は、上記目的を達
成するために、 〔１〕回路基板において、キー電極部を有する操作領域
に併設してアモルファスシリコン層を形成した太陽電池
を一体に設けるようにしたものである。したがって、信
頼性が高く、かつ低価格化を図ることができる回路基板
を得ることができる。In order to achieve the above object, the present invention provides [1] a solar cell integrally formed with an amorphous silicon layer in a circuit board in an operating region having a key electrode portion. It is provided. Therefore, it is possible to obtain a circuit board which is highly reliable and whose cost can be reduced.
【００１２】〔２〕ＩＣカードにおいて、（ａ）キー電
極部を有する操作領域に併設してアモルファスシリコン
層を形成した太陽電池を一体に設けた回路基板と、
（ｂ）前記太陽電池と操作領域とを接続する領域に設け
られるＩＣチップと、（ｃ）前記操作領域とヒートシー
ルにより接続される液晶表示パネルと、上記（ａ）〜
（ｃ）を搭載する樹脂フレームと、この樹脂フレームを
覆う表面フィルムとを設けるようにしたものである。[2] In the IC card, (a) a circuit board integrally provided with a solar cell having an amorphous silicon layer formed side by side with an operation area having a key electrode portion,
(B) an IC chip provided in a region connecting the solar cell to the operation region, (c) a liquid crystal display panel connected to the operation region by heat sealing, and (a) to
A resin frame for mounting (c) and a surface film for covering the resin frame are provided.
【００１３】このように、基板と、太陽電池と、太陽電
池接続用ヒートシールが一体化されたことにより、ＩＣ
カードを構成する部品点数が大幅に削減され、組立プロ
セスも単純化され、かつ、機械的接続ポイントも大幅に
削減される。これによりＩＣカードが安価に製造するこ
とが可能となり、かつ、信頼性の向上を図ることができ
る。As described above, by integrating the substrate, the solar cell, and the heat seal for connecting the solar cell, the IC
The number of parts that make up the card is significantly reduced, the assembly process is simplified, and the mechanical connection points are also greatly reduced. As a result, the IC card can be manufactured at low cost and the reliability can be improved.
【００１４】[0014]
【発明の実施の形態】以下、本発明の実施の形態につい
て図面を参照しながら詳細に説明する。図１は本発明の
実施例を示すＩＣカードの基本となる太陽電池付回路基
板の構成図である。この図に示すように、太陽電池付回
路基板２０の薄型化を可能とするために採用されたプラ
スチックフィルム基板２１には、基板側キー電極２９や
裏側金属電極２６、表側金属電極２２が形成されてい
る。表側金属電極２２は回路のネット情報を具現化する
配線パターン以外に、アモルファスシリコンの起電力を
取り出すために必要な太陽電池電極としてのパターンも
形成されている。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a block diagram of a circuit board with a solar cell, which is the basis of an IC card showing an embodiment of the present invention. As shown in this figure, a substrate-side key electrode 29, a back-side metal electrode 26, and a front-side metal electrode 22 are formed on a plastic film substrate 21 adopted to enable the circuit board 20 with a solar cell to be made thinner. ing. In addition to the wiring pattern that embodies the net information of the circuit, the surface-side metal electrode 22 also has a pattern as a solar cell electrode necessary for extracting the electromotive force of amorphous silicon.
【００１５】太陽電池電極としての表側金属電極２２パ
ターンの該当位置上には、アモルファスシリコン層２３
のｎ層、ｉ層、ｐ層（図示なし）が薄膜技術で形成さ
れ、その上には透明電極２４がやはり薄膜技術で形成さ
れ、結果としてプラスチックフィルム基板２１上には太
陽電池が形成されている。なお、透明電極２４上の保護
フィルム２５は特に必要ない場合は、削除することが可
能である。例えば、本発明をカードに組み込む場合、最
終的にはカードの表面フィルムが保護フィルムを兼ねる
ので、保護フィルム２５を削除することでコストダウン
が可能となる。An amorphous silicon layer 23 is formed on the corresponding position of the pattern of the front metal electrode 22 as the solar cell electrode.
N layer, i layer and p layer (not shown) are formed by thin film technology, and the transparent electrode 24 is also formed thereon by thin film technology. As a result, a solar cell is formed on the plastic film substrate 21. There is. The protective film 25 on the transparent electrode 24 can be removed if it is not necessary. For example, when the present invention is incorporated into a card, since the surface film of the card also serves as a protective film, the cost can be reduced by removing the protective film 25.
【００１６】プラスチックフィルム基板２１は一般的に
ポリイミド基板が、表側金属電極２２、裏側金属電極２
６、基板側キー電極２９としてはＣｕ導体が用いられる
が、プラスチックフィルム基板２１は基板としての特性
と太陽電池基材としての特性を満足し、また表側金属電
極２２は特にアモルファスシリコンの密着性を満足する
ことが重要であるが、これらの材料は本発明で限定する
ものではない。The plastic film substrate 21 is generally a polyimide substrate, the front side metal electrode 22 and the back side metal electrode 2
6. A Cu conductor is used as the substrate-side key electrode 29, but the plastic film substrate 21 satisfies the characteristics as a substrate and the characteristics as a solar cell base material, and the front-side metal electrode 22 has an adhesion property particularly for amorphous silicon. While satisfactory is important, these materials are not a limitation of the present invention.
【００１７】アモルファスシリコン層２３の形成順序は
基板側からｎ層、ｉ層、ｐ層（図示なし）と説明してい
るが、これに限定するものではない。但し、採光は透明
電極２４からアモルファスシリコン層２３へ行う。以
上、太陽電池が形成されたプラスチックフィルム基板２
１は、スルーホール２７やレジスト２８により回路基板
としても完成される。Although the order of forming the amorphous silicon layer 23 is explained as n layer, i layer and p layer (not shown) from the substrate side, it is not limited to this. However, the light is taken from the transparent electrode 24 to the amorphous silicon layer 23. Above, the plastic film substrate 2 on which the solar cell is formed
1 is also completed as a circuit board by the through holes 27 and the resist 28.
【００１８】図２は本発明の実施例のＩＣカードの構造
を示す断面図であり、図２（ａ）はＩＣカード組立前を
示し、図２（ｂ）はＩＣカード組立後を示している。図
２（ａ）のカード組立前には太陽電池付回路基板２０の
裏側金属電極２６の該当位置には、バンプ４８によりＩ
Ｃチップ４７が搭載されている。また、液晶表示装置は
ＩＴＯが形成された液晶表示装置（上フィルム）３３と
液晶表示装置（下フィルム）３４を液晶を注入するギャ
ップを持って貼り合わせ、接続部透明電極３５と太陽電
池付回路基板２０の金属電極２６をヒートシール３６で
電気的かつ機械的に接続する。2A and 2B are sectional views showing the structure of the IC card of the embodiment of the present invention. FIG. 2A shows the IC card before assembling, and FIG. 2B shows the IC card after assembling. . Before the card is assembled as shown in FIG. 2A, bumps 48 are provided on the back side metal electrode 26 of the circuit board with solar cell 20 at corresponding positions by the bump 48.
A C chip 47 is mounted. Further, in the liquid crystal display device, a liquid crystal display device (upper film) 33 and a liquid crystal display device (lower film) 34 having ITO formed thereon are attached with a gap for injecting liquid crystal, and a transparent electrode 35 for connection portion and a circuit with a solar cell are attached. The metal electrode 26 of the substrate 20 is electrically and mechanically connected by a heat seal 36.
【００１９】このようにして、組み立てられた基板部を
樹脂フレーム４９に納め、フィルム側キー電極３２が形
成された表面フィルム３１でカバーリングして完成とな
る。なお、２９は基板側キー電極である。ＩＣチップ４
７の搭載はバンプ４８にて行われているが、バンプ４８
にはハンダや金等複数の選択肢があるが、これに限定さ
れるものではなく、またＩＣ搭載手段にもバンプ４８の
他にワイヤボンディングやＴＡＢ等があげられるが、こ
れらも限定されるものではない。In this way, the assembled substrate is housed in the resin frame 49 and covered with the surface film 31 on which the film side key electrode 32 is formed to complete the process. Reference numeral 29 is a substrate-side key electrode. IC chip 4
7 is mounted by bump 48, but bump 48
There are a plurality of options such as solder and gold, but the present invention is not limited to this. In addition to bumps 48, wire bonding, TAB and the like can be used as the IC mounting means, but these are also not limited. Absent.
【００２０】構造をより明確にするために、図２
（ａ）、図２（ｂ）ともに接着剤を除いて記述してお
り、実際には各部組立に接着フィルム等が用いられてい
る。このように構成したので、従来技術と比較すると、
基板と太陽電池と太陽電池接続用ヒートシールが一体化
され、部品点数が大幅に削減され、組立プロセスも単純
化されている。To make the structure clearer, FIG.
Both (a) and FIG. 2 (b) are described without the adhesive, and in practice, an adhesive film or the like is used for assembling each part. Since it is configured in this way, comparing with the conventional technology,
The substrate, solar cell and heat seal for solar cell connection are integrated, the number of parts is greatly reduced, and the assembly process is simplified.
【００２１】なお、本発明は上記実施例に限定されるも
のではなく、本発明の趣旨に基づいて種々の変形が可能
であり、これらを本発明の範囲から排除するものではな
い。The present invention is not limited to the above embodiments, and various modifications can be made based on the spirit of the present invention, and these modifications are not excluded from the scope of the present invention.
【００２２】[0022]
【発明の効果】以上、詳細に説明したように、本発明
は、以下のような効果を奏することができる。 （１）請求項１記載の発明によれば、信頼性が高く、か
つ低価格化を図ることができる回路基板を得ることがで
きる。As described in detail above, the present invention has the following effects. (1) According to the first aspect of the invention, it is possible to obtain a circuit board which is highly reliable and can be manufactured at low cost.
【００２３】（２）請求項２記載の発明によれば、基板
と、太陽電池と、太陽電池接続用ヒートシールが一体化
されたことにより、ＩＣカードを構成する部品点数が大
幅に削減され、組立プロセスも単純化され、かつ機械的
接続ポイントも大幅に削減される。これによりＩＣカー
ドが安価に製造可能となり、かつ信頼性の向上が実現で
きる。(2) According to the second aspect of the present invention, since the substrate, the solar cell, and the heat seal for connecting the solar cell are integrated, the number of parts constituting the IC card is greatly reduced. The assembly process is also simplified and the mechanical connection points are significantly reduced. As a result, the IC card can be manufactured at low cost and the reliability can be improved.
【図１】本発明の実施例を示すＩＣカードの基本となる
太陽電池付回路基板の構成図である。FIG. 1 is a configuration diagram of a circuit board with a solar cell, which is a base of an IC card showing an embodiment of the present invention.
【図２】本発明の実施例のＩＣカードの構造を示す断面
図である。FIG. 2 is a sectional view showing a structure of an IC card according to an embodiment of the present invention.
【図３】従来のＩＣカードの構造を示す断面図である。FIG. 3 is a sectional view showing the structure of a conventional IC card.
【図４】従来のＩＣカードの斜視図である。FIG. 4 is a perspective view of a conventional IC card.
【符号の説明】 ２０ 太陽電池付回路基板 ２１ プラスチックフィルム基板 ２２ 表側金属電極 ２３ アモルファスシリコン層 ２４ 透明電極 ２５ 保護フィルム ２６ 裏側金属電極 ２７ スルーホール ２８ レジスト ２９ 基板側キー電極 ３１ 表面フィルム ３２ フィルム側キー電極 ３３ 液晶表示装置（上フィルム） ３４ 液晶表示装置（下フィルム） ３５ 接続部透明電極 ３６ ヒートシール ４７ ＩＣチップ ４８ バンプ ４９ 樹脂フレーム[Explanation of Codes] 20 Circuit Board with Solar Cell 21 Plastic Film Substrate 22 Front Side Metal Electrode 23 Amorphous Silicon Layer 24 Transparent Electrode 25 Protective Film 26 Back Side Metal Electrode 27 Through Hole 28 Resist 29 Board Side Key Electrode 31 Surface Film 32 Film Side Key Electrode 33 Liquid crystal display device (upper film) 34 Liquid crystal display device (lower film) 35 Connection part transparent electrode 36 Heat seal 47 IC chip 48 Bump 49 Resin frame
Claims (2)
アモルファスシリコン層を形成した太陽電池を一体に設
けたことを特徴とする回路基板。1. A circuit board integrally provided with a solar cell having an amorphous silicon layer formed adjacent to an operation region having a key electrode portion.
してアモルファスシリコン層を形成した太陽電池を一体
に設けた回路基板と、（ｂ）前記太陽電池と操作領域と
を接続する領域に設けられるＩＣチップと、（ｃ）前記
操作領域とヒートシールにより接続される液晶表示装置
と、（ｄ）上記（ａ）〜（ｃ）を搭載する樹脂フレーム
と、（ｅ）該樹脂フレームを覆う表面フィルムとを具備
するＩＣカード。2. A circuit board integrally provided with (a) a solar cell having an amorphous silicon layer formed adjacent to an operation area having a key electrode portion, and (b) an area connecting the solar cell and the operation area. An IC chip provided on the device, (c) a liquid crystal display device connected to the operation area by heat sealing, (d) a resin frame on which (a) to (c) are mounted, and (e) the resin frame. An IC card having a surface film for covering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8126013A JPH09311921A (en) | 1996-05-21 | 1996-05-21 | Circuit board and ic card using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8126013A JPH09311921A (en) | 1996-05-21 | 1996-05-21 | Circuit board and ic card using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09311921A true JPH09311921A (en) | 1997-12-02 |
Family
ID=14924575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8126013A Withdrawn JPH09311921A (en) | 1996-05-21 | 1996-05-21 | Circuit board and ic card using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09311921A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7652359B2 (en) | 2002-12-27 | 2010-01-26 | Semiconductor Energy Laboratory Co., Ltd. | Article having display device |
| JP2012053610A (en) * | 2010-08-31 | 2012-03-15 | Toppan Forms Co Ltd | Information medium and its manufacturing method |
| JP2020533680A (en) * | 2017-09-07 | 2020-11-19 | コンポセキュア，リミティド ライアビリティ カンパニー | Trading cards and manufacturing processes with embedded electronic components |
| US11461608B2 (en) | 2016-07-27 | 2022-10-04 | Composecure, Llc | RFID device |
| US11669708B2 (en) | 2017-09-07 | 2023-06-06 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
| US11710024B2 (en) | 2018-01-30 | 2023-07-25 | Composecure, Llc | Di capacitive embedded metal card |
| US12086669B2 (en) | 2017-10-18 | 2024-09-10 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
-
1996
- 1996-05-21 JP JP8126013A patent/JPH09311921A/en not_active Withdrawn
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7652359B2 (en) | 2002-12-27 | 2010-01-26 | Semiconductor Energy Laboratory Co., Ltd. | Article having display device |
| US8268702B2 (en) | 2002-12-27 | 2012-09-18 | Semiconductor Energy Laboratory Co., Ltd. | IC card and booking-account system using the IC card |
| JP2012053610A (en) * | 2010-08-31 | 2012-03-15 | Toppan Forms Co Ltd | Information medium and its manufacturing method |
| US11461608B2 (en) | 2016-07-27 | 2022-10-04 | Composecure, Llc | RFID device |
| US12079681B2 (en) | 2016-07-27 | 2024-09-03 | Composecure, Llc | RFID device |
| JP2020533680A (en) * | 2017-09-07 | 2020-11-19 | コンポセキュア，リミティド ライアビリティ カンパニー | Trading cards and manufacturing processes with embedded electronic components |
| US11501128B2 (en) | 2017-09-07 | 2022-11-15 | Composecure, Llc | Transaction card with embedded electronic components and process for manufacture |
| US11669708B2 (en) | 2017-09-07 | 2023-06-06 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
| US12086669B2 (en) | 2017-10-18 | 2024-09-10 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
| US11710024B2 (en) | 2018-01-30 | 2023-07-25 | Composecure, Llc | Di capacitive embedded metal card |
| US12093772B2 (en) | 2018-01-30 | 2024-09-17 | Composecure, Llc | DI capacitive embedded metal card |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20030805 |