JPS62295161A - Compact electronic equipment - Google Patents

Abstract

PURPOSE:To attain a thin equipment while maintaining a strength completely by respectively laminating metal plates constituting an upper part and a lower part covers on both the upper and the lower surfaces of an electronic parts constituting body. CONSTITUTION:The case body of a computer is constituted of the upper part cover 2 formed by a metal sheet 16 of a main body and a metal frame body 19 bonded on the lower surface and the lower part cover 3 having a main body of a metallic sheet 20. Between the upper part cover 2 and the lower part cover 3, the electronic parts constituting body formed by connecting a display panel 14 an a solar cell to a wiring board 11 on which an integrated circuit element 12 and an electronic parts 13 are mounted is stored. On the upper surface of the wiring board 11 of the electronic parts constituting body, the metal sheet 16 constituting the upper part cover 2 is laminated through a spacer 17 bonded by an adhesive 43, and further, the metallic sheet 20 constituting the lower part cover 3 is laminated on the lower surface of the wiring board 11, the display panel 14 and the solar cell and adhered by a adhesive layer 4 and the adhesive 43.

Description

[Detailed description of the invention] 3. Detailed description of the invention [Industrial application field] The present invention relates to a thin and small electronic device.

[Conventional technology] Conventionally, small electronic devices such as small electronic calculators
2. Description of the Related Art A structure is known in which electronic device components, such as a wiring board with an integrated circuit element attached thereto, are housed in a device case that is a combination of a pair of upper and lower cases made of synthetic resin moldings.

[Problems to be solved by the invention]In recent years, small electronic devices such as small electronic calculators have been becoming thinner, and recently it has become possible to make small electronic devices as thin as credit cards. It is being considered.

However, in conventional small electronic devices, electronic device components are housed in a device case made of synthetic resin as mentioned above, so in order to make the device thinner, the walls of the upper and lower resin cases have to be thinned. This weakens the strength of the device, and for this reason, it is not possible to make the case wall thickness of conventional small electronic devices very thin.
It was not possible to make the device as thin as a credit card. Furthermore, in the above-mentioned small electronic devices, it is necessary to take electrostatic shielding measures to prevent the integrated circuit elements inside the device from malfunctioning due to the influence of external static electricity. Since the device case itself is made of synthetic resin, it is not possible to shield static electricity, so there is a problem in that a static electricity shielding member such as a metal plate must be provided separately within the device case.

The present invention has been made in view of the above-mentioned circumstances, and its purpose is to provide an electronic device that can be made significantly thinner while ensuring sufficient strength.

[Means for Solving the Problems] The small electronic device of the present invention includes a metal plate sheet member constituting an upper cover of the device on both upper and lower surfaces of an electronic component structure including at least an integrated circuit element and a wiring board; The present invention is characterized in that the metal plate sheet members constituting the lower cover of the device are laminated, and both of the metal plate sheet members are electrically connected.

[Operation] According to the small electronic device of the present invention, since there are metal plate sheet members constituting the upper cover and metal plate sheet members constituting the lower cover on the upper and lower surfaces of the device, the upper and lower metal The strength of the device can be ensured by the plate sheet member, and the upper and lower metal sheet members are laminated on both the upper and lower surfaces of the electronic component structure to form the device, so resin molded products Compared to conventional small electronic devices in which electronic device components are housed in a device case that is a combination of a pair of upper and lower cases, the thickness of the device can be made much thinner. Moreover, in the small electronic device of the present invention, since the metal plate sheet member constituting the upper cover and the metal plate sheet member constituting the lower cover are electrically connected, a separate static electricity shielding member is required unlike the conventional one. It is possible to shield static electricity from the outside by using the upper cover of the device.

[Embodiments of the invention] Embodiments of the present invention illustrated in the drawings will be described below.

A first embodiment of the present invention will be described with reference to a sheet-like small electronic calculator shown in FIGS. 1 to 11.

Figure 2 shows the external appearance of a sheet-like small electronic calculator;
The figure shows a disassembled state. In the figure, 1 is an electronic component structure, 2 is an upper cover, and 3 is a lower cover. The electronic component structure 1 is configured by combining a wiring board 11, a semiconductor integrated circuit element 12, an electronic component 13, a display panel 14, and a solar cell 15. The upper cover 2 consists of a metal sheet 16 as its main body, a top protection sheet 18, and a spacer 17.
, and a pair of frames 19 are stacked one on top of the other. The lower cover 3 is constructed by laminating a metal sheet 20, which is the main body thereof, and a lower surface protection sheet 21. Although not shown in FIG. 3, reference numeral 4 in FIG. 1 and FIGS. 4 to 6 indicates an adhesive layer made of an insulating adhesive 22. In FIG. Then, the upper cover 2 is closely laminated on the upper side of the electronic component structure 1, the adhesive layer 4 is provided on the lower side of the electronic component structure 1, and the lower cover 3 is closely laminated on the lower side of the adhesive layer 4. The whole thing is in the form of a thin sheet.

Next, the configuration of each part will be described with reference to Fig. m1 and Figs. 4 to 8. Figure 1 is a sectional view taken along line C-C in Figure 2;
FIG. 4 is a sectional view taken along the line C-C in FIG. 2, FIG. 5 is a sectional view taken along the line C-C in FIG. and FIG. 8 are drawings showing the switch portion, respectively.

The electronic component structure 1 will be described. The wiring board 11 is made of an insulating material and has a rectangular sheet shape with a thickness of about 220 μm, and has a plurality of fixed contacts 23 arranged in a grid pattern on the top surface, each consisting of a pair of contacts as switch contacts. A predetermined wiring pattern including fixed contacts 23 and terminals 24 and 28, which will be described later, is formed on the upper and lower surfaces. A semiconductor integrated circuit element 12 and electronic components 13 such as chip capacitors and diodes are attached to mounting holes 11a formed in the wiring board 11 by penetrating them from the upper and lower sides.
These are connected to the wiring pattern of the wiring board 11.

The display panel 14 is packaged with a liquid crystal film and has a thickness of 55 mm.
It consists of a liquid crystal display panel with a size of approximately 0 μm, in which liquid crystal is sealed between upper and lower films, which serve as upper and lower electrode substrates, and one end portion 14a of the film is sealed. The display panel 14 is disposed on one side of the wiring board 11 on the same plane. As shown in FIG. 1, terminals 24 formed on the lower surface of the wiring board 11 and terminals 25 formed on the lower surface of the upper electrode substrate of the display panel 14 are connected to a flexible film 27 having wiring 26 made of conductive adhesive. The terminals 24 and 25 and the wiring 26 are bonded together by heat and pressure.

The solar cell 15 has a thickness of approximately 180 μm and is made by forming an amorphous silicon thin film on the upper surface of a substrate made of stainless steel, and is arranged on the same plane on one side of the wiring board 11 along with the display panel 14. . As shown in FIG. 4, the terminals 28 formed on the lower surface of the wiring board 11 and the solar cell 15
The terminals 29 formed on the upper surface of the substrate are connected by a flexible film 31 having wiring 30 made of a conductive adhesive, and the wiring 30 and the terminals 28 and 29 are bonded by heating and pressing. In this case, the wiring 30 is formed on the opposite surface of the flexible film 31 so as not to short-circuit to the substrate side of the solar cell 15, and the wiring 30 is connected to the solar cell 15 through a through hole 31a at the terminal 29 portion of the solar cell 15.
It is led out to the side and electrically connected to the terminal 29. In this way, the electronic component structure 1 is constructed by arranging each component in a plane and electrically connecting them to each other, and the semiconductor integrated circuit element 12 operates using the solar cell 15 as a power source and the input signal from the fixed contact 23. A display signal is output to the display panel 14, and the calculation result is displayed.

The upper cover 2 will be described. The metal sheet 16, which is the main body of this upper cover, is made of a metal plate, for example, a stainless steel plate, with a thickness of about 100 μm! Moreover, it has a rectangular shape with a size corresponding to the entire frame body 19. This metal sheet 16
This metal sheet 16 also serves as a contact sheet, and a plurality of contact springs 32 having the shape shown in FIG. In addition, the display panel 1
A display window 33 and a battery window 34 are formed by etching to correspond to 4 and the solar cell 15, and a plurality of escape recesses 35 are formed by half-etching to correspond to the integrated circuit element 12 and electronic components 13 on the lower surface of 1. It is formed by A movable contact 36 is provided on the lower center surface of each contact spring 32 by printing carbon paint, respectively, as an operating section for inputting information to the fixed contact 23. Note that a flexible film 31 is provided on the battery window 34 of the metal sheet 16.
An escape recess 34a is formed to allow the wiring 30 to escape. The spacer 17 is the metal sheet 1 which also serves as a contact sheet.
6 and the wiring board 11, and has a thickness of 50 mm.
It is made of a transparent polyester film of approximately μ size, and has a rectangular shape corresponding to the size of the wiring board 11. A plurality of contact holes 37 are formed in the spacer 17 in a grid pattern at positions facing each of the seven rotation contacts 23 of the wiring board 11, and a plurality of relief holes are formed in the spacer 17 in correspondence with the integrated circuit element 12 and each electronic component 13. 38 is formed.

Note that a transparent insulating adhesive 43 having a thickness of approximately 25 μm is applied in advance to the upper and lower surfaces of the second spacer 17, respectively. The frame 19 is formed of a metal plate, for example, a stainless steel plate, with a thickness of about 400 μm, and has a size that surrounds the electronic component structure 1, and has a protrusion 19a that partitions the display panel 14 and the solar cell 15. The entire frame is rectangular. As shown in FIGS. 5 and 6, a contact piece 39a cut upward and a contact piece 39b cut downward are provided at appropriate locations on the frame 19 for electrostatic shielding. It is formed. The upper surface protection sheet 18 protects the upper surface of the metal sheet 16 and is made of a transparent polyester film with a thickness of approximately 50 μm.
It has a slightly larger rectangular shape. This protective sheet 1
8 shows the display transparent part 40 of the display panel 14 and the solar cell 15.
Opaque printing is applied to the entire lower surface of the metal sheet 16 except for the light receiving portion 41, and display printing 42 for displaying switch contact input items corresponding to each contact spring 32 of the metal sheet 16 is printed. Furthermore, a transparent insulating adhesive 43 having a thickness of about 25 μm is applied to the entire lower surface of the upper surface protection sheet 18 . Then, the spacer 17 is connected to the electronic component structure 1.
The wiring board 11 is placed on the upper surface of the wiring board 11, and the wiring board 1 is
1 and the metal sheet 16 is bonded to the spacer 17.
It is bonded to the spacer 17 by an insulating adhesive 43 placed on the upper surface and applied to the upper surface of the spacer 17 . Further, the upper protective sheet 18 is placed on the upper surface of the metal 16 and is bonded to the metal sheet 16 by a transparent insulating adhesive 43 applied to the lower surface of the upper protective sheet 18. Further, the frame 19 is arranged below the metal sheet 16 to surround the electronic component structure 1 and the spacer 17, and is bonded to the lower surface of the metal sheet 16 via an adhesive 43. As shown in FIG. It is located above and faces each fixed contact 23 of the wiring board 11 via the hole 37 . Each item of the display print 42 on the top protection sheet 18 is located above each contact spring 32. This constitutes a switch. The contact spring 32 of the metal sheet 16 is normally the fourth
As shown in the figure, since it is in a horizontal state due to the spring force, the movable contact 36 is spaced apart from the fixed contact 23, and the eighth
As shown in the figure, when the part of the display print 42 on the top protection sheet 18 is pressed down with a finger, the contact spring 32 of the metal sheet 16 also bends downward against the spring force and enters the contact hole 37 of the spacer 17. The movable contact 36 contacts the fixed contact 23 of the wiring board 11. Therefore, the pair of contacts of the fixed contact 23 are electrically connected to each other.

Further, as shown in FIG. 1, the display transparent portion 40 of the top protection sheet 18 and the display window 33 of the metal sheet 16 are vertically overlapped, and the upper part of the display panel 14 is fitted into the display window 33, so that the display surface faces the transparent display see-through section 40. Therefore, the display on the display panel 14 can be read from the outside via the display see-through section 40. In addition, display panel 1
The upper surface of 4 is adhered to the upper surface protection sheet 18 with a transparent insulating adhesive 43. Further, as shown in FIG. 4, the light receiving section 41 of the protective sheet 18 and the battery window 34 of the metal sheet 16 are vertically overlapped, and the solar cell 15 is fitted into the battery window 34, and the battery element is placed in the transparent light receiving section. I am facing 41. Therefore, the solar cell 15 can receive external light through the light receiving section 41.
It is adhered to the protective sheet 18 via. As shown in FIG.
The relief holes 38 overlap vertically, and the upper portions of the integrated circuit element 12 and each electronic component 13 mounted on the wiring board 11 fit into the opposing relief holes 38 and relief recesses 35. Note that the integrated circuit element 12 and the electronic component 13 are electrically insulated from the metal sheet 16 by a layer of insulating adhesive 43. In this way, the upper cover 2 is laminated in close contact with the entire upper surface of the electronic component structure 1. In this embodiment, a crushed body 19 is provided as a part of the upper cover 2, and this frame body 1
9 holds the electronic component structure 1 from the periphery.

The adhesive layer 4 will be described. The adhesive layer 4 is formed of an acrylic or epoxy two-component hot-melting insulating adhesive 22. The adhesive 22 is applied to the entire lower surface of the wiring board 11 in the electronic component assembly 1, and is filled to cover the integrated circuit element 12 protruding from the lower surface of the wiring board 11 and the lower part of each electronic component 13. 22
This fills the lower part of the display panel 14 and also fills the space below the solar cell 15.

Furthermore, the adhesive 22 surrounds the entire outer periphery of the frame 19 in the upper cover 2 and is filled between the protective sheet 18 of the upper cover 2 and the protective sheet 21 of the lower cover 3. In this way, the adhesive layer 4 is formed by filling the entire lower surface of the electronic component structure 1 with the adhesive 22 in a layered manner, and adheres and fixes each component of the electronic component structure 1 from the bottom side. The unevenness of each component on the lower side of the body 1, that is, the variation in height of each component, is absorbed.

If, instead of the adhesive layer 4, a case structure constituting the device case is provided below the electronic component structure 1, the structure will be complicated in order to fix the electronic component structure 1, and It is difficult to absorb the unevenness of each component of the electronic component structure 1, and it is especially difficult to absorb it when errors occur in the mounting dimensions of the components of the electronic component structure 1 or the thickness of the components themselves during assembly. be.

On the other hand, since the adhesive layer 4 of this embodiment has fluidity, it can absorb the unevenness of each component of the electronic component structure 1 while reliably fixing each component, especially when attaching each component during assembly. It can flexibly absorb errors in dimensions and thickness of the parts themselves. Further, in this embodiment, the adhesive 22 is applied to both protective sheets 18.2.
Since the outer periphery of the frame 19 is fixed with adhesive between 1 and 1, the strength of the sheet-like small electronic calculator can be increased. The appearance can be improved by concealing it.

The lower cover 3 will be described. The metal sheet 20, which is the main body of the lower cover 3, is formed of a metal plate, for example, a stainless steel plate, with a thickness of about 100 μm, and the frame 19 of the upper cover 2
It is a rectangle of the same size. Lower surface protection sheet 21
is made of a transparent polyester film with a thickness of about 25μ, and has a rectangular shape that is slightly larger than the metal sheet 20.
A transparent insulating adhesive 43 with a thickness of about 25μ is attached to the upper surface side.
is coated. The metal sheet 20 is placed overlappingly on the lower surface of the adhesive layer 4 and fixed by adhesive. The upper surface of the metal sheet 20 is coated with an insulating adhesive 43 on the portion facing each component of the electronic component structure 1 in order to insulate the metal sheet 20 from each component. The lower surface protection sheet 21 is overlaid and adhesively fixed to the lower surface of the metal sheet 20 via an adhesive 43.

In this case, the adhesive 22 flows and stops holding the lower cover 3, so the lower cover 3 can be set parallel to the upper cover 2 and at the required spacing position with high precision. (dimensions) can be freely adjusted at the manufacturing stage. The metal sheet 20 supports the adhesive layer 4 from below, and the lower surface protection sheet 21 protects the lower surface of the metal sheet 20.
The upper surface of 1 is printed, for example, for decoration.

In this sheet-like small electronic calculator, the contact sheet 16, the frame 19, and the support sheet 20 are made of metal plates, such as stainless steel plates, so that the entire computer has high mechanical strength and rigidity. The overall thickness of this sheet-like small electronic calculator is 800μ.

Furthermore, this sheet-like small electronic calculator uses the upper cover 2 and lower cover 3 to take electrostatic shielding measures. That is, as shown in FIG.
The upward contact piece 39a formed on the frame 19 contacts the lower surface of the metal sheet 16 of the upper cover 2, and the downward contact piece 39b formed on the frame 19 contacts the lower surface of the metal sheet 20 of the lower cover 3, as shown in FIG. It is touching the top surface. Therefore, the metal sheet 16 located on the upper side and the metal sheet 2 located on the lower side
0 are electrically connected at the same potential through the metal frame 19, so static electricity from the outside is transferred from one metal sheet 16 or 20 to the other metal sheet 20 or 16.
It is possible to reliably prevent the influence of static electricity from reaching the semiconductor integrated circuit element 12 of the wiring board 11 by Δ.

Next, a method of manufacturing a sheet-like small electronic calculator having the above-mentioned configuration will be explained. First, in the electronic component structure 1, the integrated circuit element 12 and each electronic component 13 are attached to the wiring board 11 with its surface (top surface) as a reference position, and the display panel 14 and the solar cell 15 are attached to the flexible film 27.31.
Connect it to the wiring board 11 and assemble it. Upper cover 2
The frame body 19 is adhesively fixed to the lower surface of the metal sheet 16 via the adhesive 43 by heating and pressing, and then the metal sheet 16 is
The upper surface protection sheet 18 is adhered and fixed to the upper surface of the substrate via the adhesive 43 by heating and pressing to assemble.

Then, the electronic component structure 1 and the laminate of the metal sheet 16 and the top protection sheet 18 are stacked with the spacer 17 in between, and these three are heated via the adhesive 43 applied to both sides of the spacer 17. Adhesive and fix by pressure method. In this case, the surface side of the upper surface protection sheet 18 is used as a reference surface for bonding. As a result, the upper cover 2 and the electronic component assembly 1 are assembled, and the upper surface side of the upper cover 2 becomes a flat surface. Note that the lower side of the electronic component structure 1 has an uneven state in which each component protrudes (see FIGS. 9 and 10).

Next, as shown in FIG. 9, the laminate of the upper cover 2 and the electronic component structure 1 is placed with the upper cover 2 facing downward (till), and the back of the electronic component structure 1 is positioned on the upper side. An adhesive 22 is filled in the upper part and outer periphery of the laminate including the back of the upper electronic component structure 1. Since the adhesive 22 has fluidity, the back surface of the electronic component structure 11 Since the adhesive layer 4 easily enters the recesses between the parts on the side and embeds the convex parts of each part, it absorbs the irregularities and dimensional variations of the parts on the back side of the electronic component structure 11. Next, the metal sheet 20 and the protective sheet 21 are bonded and fixed to each other via the adhesive 43 by heating and pressing to produce the lower cover 3.
As shown in Figure 0, this lower cover 3 is placed on the adhesive 22 and pressure is applied from above to adhere and fix it to the adhesive 22. The lower cover 3 is parallel to the upper cover 2 so that the total pressure is 80
Press down to the position where it becomes 0μ. In this case, since the adhesive 22 is pressed by the lower cover 3 and flows toward the outer circumference, the lower cover 3 can be lowered to a preset height position.

Therefore, the upper cover 2 and the lower cover 3 can be arranged in parallel with high precision, and the thickness between the upper cover 2 and the lower cover 3 can be set with high precision relative to the design value. In addition,
The remaining 1 part of the adhesive 22 is applied to the protective sheet 18 of the upper cover 2.
It flows between the protective sheet 21 of the lower sheet 3 and protrudes to the outer periphery. Next, as shown in FIGS. 10 and 11, both protective sheets 18.21 and this protective sheet 18.
The outer periphery of the adhesive 22 between the adhesive 21 is cut into the final shape shown by the broken line. For this cutting, both protective sheets 18.2
1 is previously formed larger than the final shape at the manufacturing stage. After cutting into the final shape, both protective sheets 18
, 21 hides the outer periphery of the upper and lower metal sheets 16° 20 and the frame 19, and the resin protective sheet 18° 21 covers the periphery of the sheet-like small electronic calculator.
Together with this, it is possible to create an appearance with resin spacing.

That is, the sheet-like small electronic calculator of the above embodiment is as follows:
The main body is a metal sheet 16, and the metal frame 1 is provided on the lower surface of the metal sheet 16.
The case body of the computer is constituted by an upper cover 2 to which a metal sheet 9 is glued and a lower cover 3 mainly made of a metal sheet 20. An integrated circuit element 12 and an electronic component 13 An electronic component assembly 1 is housed in which a display panel 14 and a solar cell 15 are connected to a wiring board 11 having a wiring board 11 attached thereto, and a metal sheet 1 constituting an upper cover 2 is placed on the upper surface of the wiring board 11 of this electronic component assembly 1.
6 are laminated with a spacer 17 interposed therebetween and bonded with an adhesive 43 applied to the upper and lower surfaces of the spacer 17, and a lower cover 3 is then attached to the lower surfaces of the wiring board 11, display panel 14, and solar cell 15 of the electronic component assembly 1. The metal sheets 20 constituting the metal sheets 20 are laminated and bonded by an adhesive layer 4 made of an insulating adhesive 22 and an insulating adhesive 43 applied to the upper surface of the metal sheets 20. According to this sheet-like small electronic calculator, , since there is a metal sheet 16 constituting the upper cover 2 and a metal sheet 20 constituting the lower cover 3 on the upper and lower surfaces, respectively, the upper and lower metal sheets 16.20
This ensures the strength of the upper and lower surfaces of the computer, and since the computer is constructed by laminating the upper and lower metal sheets 16 and 20 on both the upper and lower surfaces of the electronic component structure 1, the resin molded product Compared to conventional small-sized electronic devices in which electronic device components are housed in a device case that is a combination of a pair of upper and lower cases, the thickness of the device can be made much thinner. In addition, in the sheet-like small electronic calculator of the above embodiment, the metal sheet 16 constituting the upper cover 2 and the metal sheet 20 constituting the lower cover 3 are electrically connected, so a separate static electricity shield is provided as in the conventional case. The upper cover of the computer 2 eliminates static electricity from the outside without installing any parts.
And it can be shielded using the lower cover 3.

Next, a second embodiment of the present invention will be described with reference to FIG.

This second embodiment was applied to a sheet-like small electronic computer in the same way as the first embodiment described above. In FIG. 12, the same parts as in FIGS. 1 and 3 are designated by the same reference numerals, and their explanation will be omitted.

In this second embodiment, the adhesive 22 of the adhesive layer 4 is provided between the electronic component structure 1 and the lower cover 3, and the adhesive 22 of the adhesive layer 4 is provided between the metal sheet 16 of the upper cover 2 and the metal sheet 20 of the lower cover 3. The outer periphery of the frame 19 is surrounded and filled, and the upper and lower metal sheets 16.degree. 20 are electrically connected via the frame 19. In this case, the strength of the outer periphery is improved.

- In the above embodiment, the upper cover 2 has a structure in which the upper protective sheet 18, the spacer 17, and the frame 19 are adhered to the metal sheet 16, and the lower cover 3 has the structure in which the lower protective sheet 18 is adhered to the metal sheet 20. However, the upper cover 2 and the lower cover 3 are not limited to the above embodiment as long as they are made of a sheet member made of a metal plate, and the upper cover 2 is not limited to the sheet member made of a metal plate. The structure for electrically connecting the metal plate sheet member of the lower cover 3 and the lower cover 3 is not limited to the above embodiment. Further, the present invention is not limited to sheet-like small electronic calculators, but can be widely applied to other small electronic devices, and the electronic component structure may include at least an integrated circuit element and a wiring board.

[Effects of the Invention] According to the small electronic device of the present invention, the metal plate constituting the upper cover of the device and the metal plate constituting the lower cover of the device are laminated on both the upper and lower surfaces of the electronic component structure, respectively. , it is possible to achieve a large thickness reduction while ensuring sufficient strength, and the metal plate sheet member that makes up the upper cover and the metal plate sheet member that makes up the lower cover are electrically connected. Therefore, static electricity from the outside can be shielded using the upper cover and lower cover of the device without providing a separate static electricity shielding member as in the past.

[Brief explanation of drawings]

1 to 11 show a first embodiment of the present invention, in which FIG. 1 is a sectional view taken along the line C-C in FIG. 2, and FIG. 2 is an external view showing a sheet-like small electronic calculator. , FIG. 3 is an exploded perspective view, FIG. 4 is a sectional view taken along line C-C in FIG. 2, FIG. 5 is a sectional view taken along line C-C in FIG. 2, and FIG. 6 is a sectional view taken along line C-C in FIG. 7 is a plan view showing the contact spring of the contact sheet, FIG. 8 is a sectional view of the switch section showing the operating state of the switch, and FIGS. 9 and 10 are sheet-like compact FIG. 11 is a perspective view showing a semi-finished product of a sheet-like small electronic calculator. FIG. 12 is a sectional view of a sheet-like small electronic calculator showing a second embodiment of the present invention. 1...Electronic component construct, 2. ...Top cover, 3.
... lower cover, 4 ... adhesive layer, 11 ... wiring board, 12 ... integrated circuit element, 13 ... semiconductor component, 14 ... display panel, 15 ... solar cell, 16・
...Metal sheet, 17...Spacer, 18...Top protection sheet, 19...! Frame body, 20... Metal sheet, 21... Lower surface protection sheet, 22... Adhesive, 23... Fixed contact, 32...
・Contact spring, 33...Display window, 34...Battery window, 3
6... Movable contact, 40... Display transparent part, 41...
Light receiving part, 43... Insulating adhesive. Applicant's agent Patent attorney Takehiko Suzue Figure 2 Figure 4 Figure 5 Figure 3? a Figure 6 Figure 8 Figure 9 Figure 10 Figure 11

Claims (1)

[Claims] A metal plate sheet member constituting an upper cover of the device and a metal sheet member constituting a lower cover of the device are laminated on both upper and lower surfaces of an electronic component structure including at least an integrated circuit element and a wiring board, and, A small electronic device characterized in that both of the metal plate sheet members are electrically connected.