JPS58206132A - 搬送方式 - Google Patents

搬送方式

Info

Publication number
JPS58206132A
JPS58206132A JP8886582A JP8886582A JPS58206132A JP S58206132 A JPS58206132 A JP S58206132A JP 8886582 A JP8886582 A JP 8886582A JP 8886582 A JP8886582 A JP 8886582A JP S58206132 A JPS58206132 A JP S58206132A
Authority
JP
Japan
Prior art keywords
discharge
supply
bodies
processed
discharged
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8886582A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0131688B2 (enExample
Inventor
Takeo Muto
武藤　武雄
Takayoshi Saito
斉藤　嵩能
Masumi Masuda
益田　益美
Kiyoto Hirase
平瀬　清人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP8886582A priority Critical patent/JPS58206132A/ja
Publication of JPS58206132A publication Critical patent/JPS58206132A/ja
Publication of JPH0131688B2 publication Critical patent/JPH0131688B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
JP8886582A 1982-05-27 1982-05-27 搬送方式 Granted JPS58206132A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8886582A JPS58206132A (ja) 1982-05-27 1982-05-27 搬送方式

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8886582A JPS58206132A (ja) 1982-05-27 1982-05-27 搬送方式

Publications (2)

Publication Number Publication Date
JPS58206132A true JPS58206132A (ja) 1983-12-01
JPH0131688B2 JPH0131688B2 (enExample) 1989-06-27

Family

ID=13954897

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8886582A Granted JPS58206132A (ja) 1982-05-27 1982-05-27 搬送方式

Country Status (1)

Country Link
JP (1) JPS58206132A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6453554A (en) * 1987-08-25 1989-03-01 Sony Corp Assembly system for semiconductor device
JP2006041195A (ja) * 2004-07-27 2006-02-09 Matsushita Electric Ind Co Ltd 部品実装用装置及びその動作方法
JP2007103872A (ja) * 2005-10-07 2007-04-19 Ultrasonic Engineering Co Ltd ワイヤボンディング装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6453554A (en) * 1987-08-25 1989-03-01 Sony Corp Assembly system for semiconductor device
JP2006041195A (ja) * 2004-07-27 2006-02-09 Matsushita Electric Ind Co Ltd 部品実装用装置及びその動作方法
JP2007103872A (ja) * 2005-10-07 2007-04-19 Ultrasonic Engineering Co Ltd ワイヤボンディング装置

Also Published As

Publication number Publication date
JPH0131688B2 (enExample) 1989-06-27

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