JPS58205673A - Soldering apparatus - Google Patents

Abstract

PURPOSE:To perform automatically soldering to an insulating substrate without giving any trouble to electric parts and improve the working property, by installing a means which supports the insulating substrate in correspondence to the ejecting hole of a solder tub and faces a support having a through-hole to the ejecting hole. CONSTITUTION:An ejection cover 16 is put on the opening 14 of an ejection cylinder 15 installed erectly in a solder tub 13 and an ejecting hole part 17 is projected from the upper surface of the cover 16. On the other hand, a groove 24 is formed in the lower surface of a support 20 made of a heat resistive material and a through-hole 25 is pierced through the rear wall 24a of the groove 24. An insulating substrate fitted with terminals 27a and 28a of electric parts 27 and 28 is put in the recessed part 22 of the support 20. Then, the support 20 is placed on rails 4 and moved to a soldering location and the groove 24 of the support 20 is allowed to correspond to the ejecting hole 17 of the solder tub 13. The molten solder 18 ejected from the hole 17 is controlled by the groove 24 and contacts the terminal 27a (28a) at the lower surface of the substrate 26 through the through-hole 25, and thus, soldering is performed.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a soldering device for automatically soldering the terminals of electrical components to four parts of a board.

This type of conventional soldering device attaches a terminal component of an electrical component to a printed circuit board, and the lower surface of the printed circuit board, which is the surface on which the conductor part is formed, is housed in a soldering bath.
Generally, it is immersed in hot solder at 0°C to 250°C. However, if electrical components are also attached to the bottom of the printed circuit board, or if electrical components that are sensitive to heat, such as resin molded parts, are attached to the bottom of the printed circuit board and the road surface, In such cases, it is not possible to use a soldering device such as the one described above because the electronic components are directly immersed in molten solder or the electrical components are adversely affected by the heat from the molten solder. There was a problem that soldering was required and the workability was poor.Also, when attaching a large number of magnetic components to a printed circuit board, the distance between the terminals of each electrical component becomes extremely small, so -h When soldering is performed using such a soldering device, there is a problem in that molten solder adheres between the terminals, resulting in a so-called bridge that shorts the terminals.

The present invention has been made in view of the above circumstances, and its purpose is to automatically perform soldering without causing any trouble to the electrical components, regardless of the state in which the electrical components are attached to the insulating substrate. It is an object of the present invention to provide a soldering device that can improve workability and prevent the formation of bridges between terminals of electrical components.

An embodiment of the present invention will be described below with reference to the drawings.

1 is a horizontal base, and at both left and right ends there are pillars 2,
2 and 3, 3 are erected, and rails 4, 4 are installed as a bridge between these supports 2.2 and 5, 3. In this case, the rails 4, 4 are set to have an inclination angle of approximately 6, for example, so that the rails 4, 4 rise one step higher toward the right in the direction indicated by the arrow with respect to the base 1 (horizontal surface). 6 is a transfer mechanism attached to a support member 5 erected on the base 1;
This includes a transfer motor 8 that is rotated forward or backward based on the operation of an operation switch 7, and an electric eyepiece for an automobile that is lengthened or shortened depending on the forward or reverse rotation of the transfer motor 8. The beak 1 is made up of a telescoping rod 9 and a transfer plate 10 that is connected to the tip of the telescoping rod 9 and is moved along the rail 4 in the direction of arrow A and in the direction of arrow A in response to the expansion and contraction of the telescoping rod 9. There is. The set position B is the left end of the rails 4, 4 where the transfer plate 10 is located when the telescopic rod 9 is shortened to the minimum. Reference numeral 11 denotes a preheater elongated from side to side, which is disposed at a set position B on the rails 4, 4 and supported by a support member 12 erected on the base 1. When these two sounds occur, the preheating heater 11 is connected to the rail 4.
, 4 near one of the rails 4 and the rail 4
It is set so that it is approximately parallel to the 13 is a solder beak placed on the board 1, and a rail 4 is placed on the top surface of the solder beak.
, 4, the soldering position lC is the right part of the set position IB.
A rectangular opening 14 is formed below. Further, a rectangular ejection tube 15 is provided upright in the solder tank 13, and a ejection cover 16 is attached and fixed to the upper end opening of the ejection tube 15 so as to protrude upward from the opening 14. ing. A substantially slit-shaped ejection hole 17 extending in the left-right direction and having an open upper end and both left and right ends is formed on the upper surface of the ejection cover 16 and protrudes upward. is set to be located near the bottom of one of the rails 4, 4.

Although not shown in the solder [13], the solder inside is melted and the molten solder 18 is heated to 230°C.
A heater is provided to maintain the temperature at ~250°C, and the molten solder 18 is ejected through the ejection tube 15 to the ejection hole portion 17.
A jet pump device is provided to stop jetting upward from the pump, and the transfer motor 8. Preheating heater 11. The heater, jet pump device, etc. are controlled by a 1rlJ control unit (not shown) as described later. Note that 19 is an exhaust hood.

Reference numeral 20 denotes a support member made of a heat-resistant material and formed into a substantially rectangular plate shape, and mounting protrusions 21 and 21 are provided at both front and rear ends of the support member 20 to project outward. Further, a substantially rectangular support recess 22 is formed in the upper surface of the support body 20, and a substantially rectangular relief recess 25 is formed in a portion of the crest support recess 22 excluding the rear end thereof. There is. Further, at the rear end of the lower surface of the support body 20, a groove 24 is formed, which is a recess opening at the lower end and both the left and right ends, and extends to both the left and right ends. A through hole 25 extending from side to side is formed in the wall portion 24a to vertically penetrate through the wall portion 24a. 26 is a printed circuit board which is a substantially rectangular insulating board, and a large number of electrical components 27. ...and 28
．． ... to its terminals 27a, ... and 2151Lf.
... are formed in the printed circuit board 26, and a large connection hole 26a,
. . , and 26b, . . . are inserted into the terminal 27a.

. . , and 28a, . . . project from the lower surface portion GIIJK on which the conductor portion (not shown) of the printed circuit board 26 is applied.Next, the operation of this embodiment having the top-bottom configuration will be described.

First, the operator operates the set switch on the control device to energize the heater in the solder tank 15 to generate heat, thereby heating and melting the solder in the solder tank 13 and melting the molten solder 18. The operating temperature is maintained at 230°C to 250°C, and further, by operating the preheating heater switch of the control device, the preheating heater 11 is energized to generate heat at approximately 300°C, for example, and the soldering is completed. Complete preparations for work.

Therefore, the operator selects the terminal 27a, which is the soldering part to be soldered to the conductor part on the lower surface of the printed circuit board 26.
... After spraying or applying flux to the parts, the printed circuit board 26 is fitted into the support recess 22 of the support body 20 to be supported, and the terminals 27a, ... are inserted into the holes 25.
At the same time, the terminals 28a, . . . are positioned inside the relief recess 23 (see FIG. 6). Further, the support body 20 supporting the printed circuit board 26 in this manner is set at the set position B of the rails 4.4 by placing its mounting protrusion 21°21 on the horizontal portion of the rails 4.4. C
(See Figure 4). In this case, the groove 2 on the lower surface of the support 20
4 faces the preheater 11. Therefore, when the operator operates the operation switch 7 from the neutral position to the raised position, the timer of the control device starts counting the set time (for example, 15 seconds), and the solder tank 1
The jet pump device 5 begins to operate and jets the molten solder 18 upward from the jet hole 17, and the molten solder 18 forms a jet that flows downward from the jet hole 17 in the front, rear, left, and right directions. It becomes 181L. After that, when the timer of the control device finishes counting the set time of 15 seconds, the transfer motor 8 is formed with a forward current conduction path, rotates in the normal direction, and extends the telescopic rod 9, and the transfer motor 8 starts to rotate in the forward direction to extend the telescopic rod 9. 10 is moved in the direction of arrow A, which is the transfer direction, and the support body 20 is accordingly transferred on the rails 4, 4 in the same direction. Then, when the support body 20 is transferred to the soldering position C of the rail 4.4 (see FIG. 5), the groove portion 24 of the support body 20' is aligned with the protruding strips 17a, 1 of the jet hole portion 17 of the jet cover 16.
7a, and corresponds to the rear wall portion 24a of the groove portion 24.
(See FIG. 6) in which the protruding strip 17a is very close to or substantially in contact with the upper end of the protruding strip 17a117a. As a result, the solder solution 18 spouted from the spout hole 17 is restricted from flowing forward and backward by the groove 24, and is rectified into a jet 181 that guides and flows downward to the left and right (Fig. 7). and Figure 8).

Therefore, the jet stream 18b in this case is narrowed into a band shape oriented in the left-right direction, and the jet height is also narrower than that of the jet stream 18& in the case shown in FIG. Then, this jet stream 1811) comes into contact with the terminals 27a, . . . on the lower surface of the printed circuit board 26 through the through hole 25, and the terminals 27a, . do. In this case, since the rails 4, 4 are set to make an oblique angle θ (for example, approximately 6°) with respect to the base 1, the support body 20 also makes an oblique angle θ with respect to the ejection hole portion 17. Therefore, the jet 18b is pre-y) substrate 2
Instead of coming into contact with the lower surface of 6 at a right angle, it comes into contact with a tangent/independent angle of (0 90-#) (for example, approximately 84) (see FIG. 8). Thereafter, when the support body 20 further moves in the direction of arrow A, passes through the soldering position C and reaches the stop position iD, which is the right end of the rails 4, 4, the rails 4,
An upper limit switch (not shown) provided on one of the rails 4 is actuated by the transfer plate 10 to cut off the normal rotation energization path of the transfer motor 8, and the support body 20 is stopped at the stop position DK. . When the operator operates the operation switch 7 from the raised position to the neutral position and then to the lowered position, the transfer motor 8 forms a reverse energization path and rotates in the opposite direction to shorten the extension rod 9. Along with this, the transfer plate 10 is moved in the opposite direction of arrow A, which is the return direction, while leaving the support body 20 at the stop position. after that,
When the transfer plate 10 is moved back to the set position FffiB, the lower mitt switch provided on one of the rails 4, 4 is activated by the transfer 'ff110, and the transfer motor 8 is activated. In this case, the operator operates the operation switch 7 from the lower position to the neutral position, and the soldering One cycle of is completed.

In the present description, the case with a preheater will be described, but even in the case without a preheater, parts with small heat capacity can be soldered well.

According to this embodiment of the above structure hood, the following effects can be obtained. That is, the printed circuit board 26 is supported on the support body 20 so that the terminals 27a, . The terminals 27a, . . .
Since the half FB is attached to the conductor part on the lower surface of the PC board 26, if electrical components are attached to the lower surface of the printed circuit board 26, or if the lower surface of the printed circuit board 26 is connected to the road surface, it may be difficult to heat. Even if electrical components are attached, these electrical components are isolated from the molten solder 18 by the support 2°, so that no matter what kind of screws are used to attach any electrical components to the printed circuit board 26, they will be isolated from the molten solder 18. ' can be automatically soldered while reliably preventing the gas components from being immersed in the molten solder 18 or being affected by the heat of the heavy solder 18, which is different from the conventional method. There is no need to perform soldering by different hands, and work efficiency can be improved. In addition, since the groove 24 on the lower surface of the support body 20 faces the spouting hole 17 that hangs over the solder tank 13 in an odd manner, the molten solder spouted from the spouting hole 17 can be avoided. 1
8 is a band-shaped jet 181) regulated by the groove 24 and guided in the left-right direction.
Since the terminals 27a, . . . are soldered with the conductor portions, it is possible to prevent the formation of a bridge where the sacrificial solder 18 adheres between the terminals 27a and causes a short circuit between the terminals 27a, 27a. I can do it. Moreover, since the support body 20 is set to form a predetermined tilt angle θ with respect to the ejection hole portion 17, the molten solder 1 from the ejection hole portion 17 is
8 is in contact with the back wall 24a of the front part 24 of the support body 20, that is, the bottom surface of the printed circuit board 26 at right angles (
[9O-6) appear in contact with a contact angle of 0,
Therefore, what about the lower surface of the printed circuit board 26? The lI solder 18 can be cut more easily, and the formation of bridges as described above can be more reliably prevented.

In the case of this embodiment, the experimental results show that the cutting of the molten solder 18 on the lower surface of the printed circuit board 26 is desirable when the inclination angle θ is 5° or more and 15° or less. When we did this, we obtained very good experimental results.

In the above embodiment, the support body 20 was set to form a predetermined inclination angle I with respect to the jet hole portion 17C (horizontal surface), but instead of setting the support body 20 horizontally, It is also possible to provide an ejection hole that is inclined so that the contact angle of the molten solder is not a right angle but has an inclination angle of (90-#).

In addition, the present invention is not limited to the embodiment described above and shown in the drawings, but it goes without saying that it can be implemented with appropriate modifications within the scope of the invention.

As described above, the present invention provides an insulating substrate having a through hole portion corresponding to the spouting hole portion above the solder bath having the spouting hole portion for spouting molten solder upward, and on which an electrical component is attached. Since the configuration includes a support that supports the insulating board and exposes the soldered part of the insulating board to the through hole, no matter what electrical component is attached to the insulating board in any state, it will not interfere with the electrical component. Soldering can be performed automatically without causing any problems, improving work efficiency.
Moreover, it has excellent effects such as being able to prevent the formation of bridges between the terminals of electrical components.

[Brief explanation of the drawing]

The drawings show an embodiment of the present invention, in which FIG. 1 is a perspective view of the whole, FIG. 2 is a perspective view of a support, FIG. 3 is a perspective view of a support and a printed circuit board, and FIGS. 1 is a partial perspective view of FIG. 1 for explaining the function, FIG. 6 is a longitudinal cross-sectional view of the main part, Wcz is a perspective view of a part of the jetting force bar, and FIG. 8 is a partial perspective view of the main part shown in FIG. 6. FIG. In the drawing, 4 is a rail, 6 is a transfer mechanism, 10 is a transfer plate, 1
1 is a preheating heater, 13 is a solder tank, 15 is an ejection pipe, 16 is an ejection cover, 17 is an ejection hole, 18 is melting, molten solder, 20
24 is a support body, 24 is a groove (C recess), 25 is a through hole, 26 is a printed circuit board (insulating board), 27 is an electric component, 27a,
... indicates a terminal (soldering part). Figure 1 jF! 2 Pictures 3 Figure 2 9IA6 Figure 27 Figure 7 Figure 8 (≦Sauce Nj Bi==; Sutatami-Nioseki Concubine Dekube 20A- θ −−−−−

Claims (1)

[Scope of Claims] 1゜ An electrical component having a solder bath having a spouting hole for spouting molten solder upward, and a through hole disposed above the solder bath and corresponding to the spouting hole. 1. A soldering device comprising: a support for supporting an insulating board to which an insulating board is attached, and allowing a contacting part of the insulating board to face the through-hole part. 2. The soldering device according to claim 1, wherein a recess is formed on the lower surface of the support to fit into the ejection hole, and a through hole is formed in the recess. . 8. The soldering device according to claim 2, wherein both ends of the recess are open. 4 Claim-A1, characterized in that the support body is set to be UN relative to the ejection hole portion.
] Soldering apparatus I described in any one of paragraphs 1 to 3.