JPH1022620A - Soldering device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To remove the defective soldering of a printed board. SOLUTION: In a jet soldering system of printed board automatic solder, nozzles 11, 12, and 13 for fused solder are provided obliquely (α1 ) to the shifting direction A of the printed board, and also the jet directions of the nozzles 11 and 12 are inclined in opposite direction to each other. Since the nozzle is made slanting to the shifting direction of the board, when mounting electronic parts of the printed board come close to jet solder, the air in the while flows quickly, and an air bank which prevents the soldering does not occur between the part and the solder. Then, because the nozzles 11 and 12 facing up are inclined in opposite direction to each other, the solder can be applied to the mounted electronic parts from front and rear, so the shade part where the solder is not given is not made.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering apparatus for automatically soldering leads or terminals of electronic components mounted on a printed circuit board.

[0002]

2. Description of the Related Art A technique for electrically and mechanically connecting and fixing an electronic component to a printed circuit board by soldering lead wires or terminals of the electronic component mounted on the printed circuit board using molten solder is generally used. It is a well-known technique as flow soldering.Broadly speaking, the method of immersing in molten solder and soldering is generally called `` dip soldering '', and the molten solder is jetted using a pump and immersed in the jetted solder. The method of soldering by soldering is generally called "jet soldering".

As shown in FIG. 4, an automatic soldering apparatus for a printed board is provided with a flux coating section 2, a preheater section 3, and a solder tank 4 in a tunnel-like cover 1 for heat insulation and heat retention.
The printed circuit board 7 is caused to flow in the direction of arrow A. In the flux application section 2, a flux is applied to the printed board to remove the surface oxide on the soldered portion of the printed circuit board, covered with the flux and cut off from the air to improve the compatibility with the solder.
Coating methods include dip coating, foam coating, and spray coating.

[0004] In the preheater section 3, the diluent in the applied flux is vaporized and preheated before the temperature of the solder bath 4 is reached. Generally, a heater tube is used.

[0005] As the solder tank 4, a jet solder tank is used. As shown in FIG. 5, the solder tank is provided with a heater 43 for melting the solder 42 therein, and a solder jet 44 having a slit-shaped jet port 46 at the top and a pump 45 inside. The jet device 44 jets the solder wave upward from the jet port 46.

As shown in FIGS. 6A and 6B, the solder bath 4 has one or two jet ports 46, and the jet ports 46 are arranged in a direction orthogonal to the flow direction A of the printed circuit board P. Have been. Soldering is performed on the printed circuit board P on which the electronic components 9 are mounted.
Is flowed slightly upward (α _P ) as shown by the arrow A with the wiring surface on the lower side, and is brought into contact with the jet solder 42 ′ to solder the leads of the electronic component to the board so that icicles do not occur.

[0007]

As shown in FIG. 7, when soldering a printed circuit board on which an electronic component 9 is mounted on the wiring surface, the tip of the electronic component 9 is
When approaching the portion flowing in the arc of 2 ', the surrounding air is trapped in the gap surrounded by the electronic component, the substrate, and the jet solder, and the air pool is generated, and the jet solder contacts the terminals of the electronic component. Can be prevented. For this reason, the portion where the air pocket is formed cannot be soldered or the soldering is incomplete.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional problems, and has as its object to supply solder to a shadowed portion of an electronic component to ensure high-quality soldering. It is an object of the present invention to provide an automatic soldering apparatus for printed boards that can be used.

[0009]

SUMMARY OF THE INVENTION The present invention relates to a soldering apparatus for soldering a lead wire or a terminal of an electronic component mounted on a printed circuit board that moves by jetting molten solder from a slit-shaped jet port. In addition, a pair of jet ports for jetting the molten solder obliquely to the rear are provided, and the pair of jet ports are provided obliquely or in a V shape with respect to the moving direction of the printed circuit board.

Since the jet port is provided obliquely or in a V-shape with respect to the moving direction of the printed circuit board, air cannot be trapped between the electronic component and the jet solder. Then, since the jet outlet is obliquely jetted forward or backward, the shadow that does not hit the solder cannot be formed.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a plan view of a solder bath portion, and FIG.
Figure 2 shows a side view of the jet solder. 1 and FIG.
1 and 12 the first solder bath 4 solder ejection device jet port provided in _1, 13 solder jet device of the jet port provided in a solder bath 4 ₂ of the second 2, a, b, c are the jet port 11 shows the solder jets from 11, 12, and 13.

The jet ports 11 to 13 are provided obliquely (α ₁ ) with respect to the direction A of the flow of the printed circuit board 7.
And 12 are inclined (α _a , α _b ) so that the jet solders a and b jet forward and backward, respectively. Further, the slit width of the jet ports 11 and 12 is smaller than the slit width of the jet port 13.

Since the printed circuit board P moves while being inclined (α _P ) in the direction of the arrow A, the height of the solder jetted from each of the jet ports is set to be plural for one jet port so as to match the inclination of the board. For example, a single pump is used, or the shape of the base of the jet port is changed.

As described above, since the solder jets 11 to 13 are arranged obliquely (α ₁ ) with respect to the flow of the substrate, the electronic component 9 is connected to the wiring surface of the substrate P as shown in FIG. Air is not trapped between the electronic component and the substrate and the jet solder. And the spout 1
1 and 12 are inclined in the opposite directions (α _a , α _b ), so that the solder well penetrates into every corner of the space formed between the front surface and the substrate and between the rear surface and the substrate of the electronic component, and a high-quality solder Can be attached.

In the above description, the jet ports 11 to 13 are provided obliquely to the moving direction of the printed circuit board P. However, as shown in FIG. 3, both ends are directed to the downstream side in the moving direction of the printed circuit board P. It may be provided in the shape of a slanted letter.

It is needless to say that the present invention can be applied to the case where the printed board is moved in the horizontal direction to perform soldering.

[0017]

Since the present invention is configured as described above, the following effects can be obtained.

(1) Since the jet port of the solder is provided obliquely with respect to the flow direction of the printed board, no air pocket is formed between the electronic component and the jet solder.

(2) Since the nozzles are provided with jet ports inclined in opposite directions, the solder is jetted from the front and the back of the printed circuit board, so that the solder can be applied also to a portion which is hardly hit by the conventional solder.

(3) By the above (1) and (2), high quality soldering becomes possible, and the number of printed boards having poor soldering is reduced.

[Brief description of the drawings]

FIG. 1 is a plan view showing an arrangement of solder jet ports according to an embodiment.

FIG. 2 is a side view showing the flow of the jet solder.

FIG. 3 is a plan view showing a solder bath portion in a case where the shape of a solder jet is changed.

FIG. 4 is a configuration explanatory view of a soldering device.

FIG. 5 is a side sectional view showing one solder bath.

FIG. 6 is a side view showing a relationship between a conventional printed board and a flow of solder.

FIG. 7 is a side view showing a soldered state of a conventional surface mount type printed circuit board.

[Explanation of symbols]

1 ... tunnel-like covering body 2 ... flux applying unit 3 ... preheater portions 4, 4 ₁ of the soldering apparatus, 4 ₂ ... solder tank 9 _1, 9 ₂ ... electronic components 11, 12, 13 ... solder ejection port 41 ... jet solder Bath 42 ... Solder 42 '... Jet solder 43 ... Heater 44 ... Solder jet 45 ... Pump 46 ... Jet outlet a, b, c ... Jet solder P ... Printed circuit board

Claims (2)

[Claims] 1. A soldering apparatus for soldering a lead wire or a terminal of an electronic component mounted on a printed circuit board which is moved by jetting molten solder from a slit-shaped jet port, wherein the molten solder is slanted forward and rearward. A soldering apparatus comprising: a pair of jet ports for jetting, wherein the pair of jet ports are provided obliquely to a moving direction of a printed circuit board. 2. A soldering apparatus for soldering a lead wire or a terminal of an electronic component mounted on a printed circuit board which is moved by jetting molten solder from a slit-shaped jet port, wherein the molten solder is slanted forward and rearward. A soldering device having a pair of jet ports for jetting, each pair of jet ports being provided in a diagonal shape inclined such that both end portions thereof face the downstream side in the moving direction of the printed circuit board. .