JPH1022620A - Soldering device - Google Patents
Soldering deviceInfo
- Publication number
- JPH1022620A JPH1022620A JP17313096A JP17313096A JPH1022620A JP H1022620 A JPH1022620 A JP H1022620A JP 17313096 A JP17313096 A JP 17313096A JP 17313096 A JP17313096 A JP 17313096A JP H1022620 A JPH1022620 A JP H1022620A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- jet
- soldering
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、プリント基板上に
実装された電子部品のリード線又は端子を自動的に半田
付する半田付装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering apparatus for automatically soldering leads or terminals of electronic components mounted on a printed circuit board.
【0002】[0002]
【従来の技術】溶融した半田を用いてプリント基板上に
実装された電子部品のリード線又は端子を半田付して電
子部品をプリント基板に電気的かつ機械的に接続,固定
する技術は、一般にフロー半田付として周知の技術であ
り、大別すると、溶融半田に浸して半田付する方法を一
般に「ディップ半田付」と称し、溶融した半田をポンプ
を用いて噴流させ、その噴流した半田に浸して半田付す
る方法を一般に「噴流半田付」と称している。2. Description of the Related Art A technique for electrically and mechanically connecting and fixing an electronic component to a printed circuit board by soldering lead wires or terminals of the electronic component mounted on the printed circuit board using molten solder is generally used. It is a well-known technique as flow soldering.Broadly speaking, the method of immersing in molten solder and soldering is generally called `` dip soldering '', and the molten solder is jetted using a pump and immersed in the jetted solder. The method of soldering by soldering is generally called "jet soldering".
【0003】プリント板の自動半田付装置は図4のよう
に、断熱,保温のためトンネル状の覆体1の中に、フラ
ックス塗布部2,プリヒータ部3,半田槽4を配設し、
プリント基板7を矢印A方向に流す。フラックス塗布部
2では、プリント板にフラックスを塗布してプリント基
板のハンダ付する部分の表面酸化物を除去し、フラック
スで覆い空気から遮断して半田とのなじみを良くする。
塗布方式には浸漬塗布,発泡塗布,スプレー塗布があ
る。As shown in FIG. 4, an automatic soldering apparatus for a printed board is provided with a flux coating section 2, a preheater section 3, and a solder tank 4 in a tunnel-like cover 1 for heat insulation and heat retention.
The printed circuit board 7 is caused to flow in the direction of arrow A. In the flux application section 2, a flux is applied to the printed board to remove the surface oxide on the soldered portion of the printed circuit board, covered with the flux and cut off from the air to improve the compatibility with the solder.
Coating methods include dip coating, foam coating, and spray coating.
【0004】プリヒータ部3では、塗布されたフラック
ス中の希釈剤を気化させ、かつ、半田槽4の温度に入る
前に予熱する。一般にヒータ管が使用される。[0004] In the preheater section 3, the diluent in the applied flux is vaporized and preheated before the temperature of the solder bath 4 is reached. Generally, a heater tube is used.
【0005】半田槽4には噴流半田槽が用いられる。こ
の半田槽は図5に示すように、内部に半田42を溶融す
るヒータ43と、上部にスリット状の噴流口46を有し
内部にポンプ45を有する半田噴流器44が設けられて
いる。噴流器44は噴流口46から半田の波を上方に噴
流させる。[0005] As the solder tank 4, a jet solder tank is used. As shown in FIG. 5, the solder tank is provided with a heater 43 for melting the solder 42 therein, and a solder jet 44 having a slit-shaped jet port 46 at the top and a pump 45 inside. The jet device 44 jets the solder wave upward from the jet port 46.
【0006】半田槽4は、図6(a),(b)に示すよ
うに、噴流口46を1つ又は2つ備え、噴流口46はプ
リント基板Pの流れ方向Aと直交する方向に配置されて
いる。半田付は、電子部品9が実装されたプリント板P
を配線面を下側として矢印Aで示すように少し上向き
(αP)に流し、噴流半田42′と接触させてつららが
発生しないように電子部品のリードを基板に半田付す
る。As shown in FIGS. 6A and 6B, the solder bath 4 has one or two jet ports 46, and the jet ports 46 are arranged in a direction orthogonal to the flow direction A of the printed circuit board P. Have been. Soldering is performed on the printed circuit board P on which the electronic components 9 are mounted.
Is flowed slightly upward (α P ) as shown by the arrow A with the wiring surface on the lower side, and is brought into contact with the jet solder 42 ′ to solder the leads of the electronic component to the board so that icicles do not occur.
【0007】[0007]
【発明が解決しようとする課題】ところで、図7に示す
ように、電子部品9が配線面に実装されたプリント基板
を半田付する場合、電子部品9の先端部が噴流半田4
2′の円弧状に流れている部分に差しかかった際、周囲
の空気が電子部品と基板及び噴流半田で囲まれる隙間に
閉じ込められ、空気溜まりが生じ、噴流半田が電子部品
の端子と接するのを防げる。このため空気溜まりのでき
た部分の半田付ができないか、又は半田付が不完全とな
る。As shown in FIG. 7, when soldering a printed circuit board on which an electronic component 9 is mounted on the wiring surface, the tip of the electronic component 9 is
When approaching the portion flowing in the arc of 2 ', the surrounding air is trapped in the gap surrounded by the electronic component, the substrate, and the jet solder, and the air pool is generated, and the jet solder contacts the terminals of the electronic component. Can be prevented. For this reason, the portion where the air pocket is formed cannot be soldered or the soldering is incomplete.
【0008】本発明は、従来のこのような問題点に鑑み
てなされたものであり、その目的とするところは、電子
部品の陰となる部分にも半田を供給して良質な半田付が
確保できるプリント板の自動半田付装置を提供すること
にある。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional problems, and has as its object to supply solder to a shadowed portion of an electronic component to ensure high-quality soldering. It is an object of the present invention to provide an automatic soldering apparatus for printed boards that can be used.
【0009】[0009]
【課題を解決するための手段】本発明は、スリット状の
噴流口から溶融半田を噴流させて移動するプリント基板
に実装された電子部品のリード線又は端子を半田付する
半田付装置において、前方及び後方に斜めに溶融半田を
噴流する一対の噴流口を有し、この一対の噴流口をプリ
ント基板の移動方向に対して斜め、又はくの字状に設け
る。SUMMARY OF THE INVENTION The present invention relates to a soldering apparatus for soldering a lead wire or a terminal of an electronic component mounted on a printed circuit board that moves by jetting molten solder from a slit-shaped jet port. In addition, a pair of jet ports for jetting the molten solder obliquely to the rear are provided, and the pair of jet ports are provided obliquely or in a V shape with respect to the moving direction of the printed circuit board.
【0010】噴流口がプリント基板の移動方向に対して
斜め、又はくの字状に設けられているので、電子部品と
噴流半田の間に空気溜まりができない。そして、噴流口
が前方又は後方に斜めに半田が噴流されるので、半田の
当たらない影ができない。Since the jet port is provided obliquely or in a V-shape with respect to the moving direction of the printed circuit board, air cannot be trapped between the electronic component and the jet solder. Then, since the jet outlet is obliquely jetted forward or backward, the shadow that does not hit the solder cannot be formed.
【0011】[0011]
【発明の実施の形態】図1に半田槽部の平面図を、図2
に噴流半田の側面図を示す。図1,図2について、1
1,12は第1の半田槽41に設けられた半田噴流器の
噴流口、13は第2の半田槽42に設けられた半田噴流
器の噴流口、a,b,cは噴流口11,12,13から
の噴流半田を示す。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a plan view of a solder bath portion, and FIG.
Figure 2 shows a side view of the jet solder. 1 and FIG.
1 and 12 the first solder bath 4 solder ejection device jet port provided in 1, 13 solder jet device of the jet port provided in a solder bath 4 2 of the second 2, a, b, c are the jet port 11 shows the solder jets from 11, 12, and 13.
【0012】噴流口11〜13はプリント基板7の流れ
の方向Aに対して斜め(α1)に設けられ、噴流口11
及び12は噴流半田a及びbがそれぞれ前方及び後方に
噴流するように傾斜(αa,αb)している。また噴流口
11,12のスリット幅は噴流口13のスリット幅より
狭くなっている。The jet ports 11 to 13 are provided obliquely (α 1 ) with respect to the direction A of the flow of the printed circuit board 7.
And 12 are inclined (α a , α b ) so that the jet solders a and b jet forward and backward, respectively. Further, the slit width of the jet ports 11 and 12 is smaller than the slit width of the jet port 13.
【0013】プリント基板Pは矢印A方向に傾斜
(αP)して移動するので、各噴流口から噴流する半田
の高さを基板の傾斜と一致するようにそれぞれ1つの噴
流口に対して複数台のポンプを用いるか、又は噴流口の
基部の形状を変えるなどしてある。Since the printed circuit board P moves while being inclined (α P ) in the direction of the arrow A, the height of the solder jetted from each of the jet ports is set to be plural for one jet port so as to match the inclination of the board. For example, a single pump is used, or the shape of the base of the jet port is changed.
【0014】以上のように、半田の噴流口11〜13が
それぞれ基板の流れに対して斜め(α1)に配置してあ
るので、図7に示すように電子部品9が基板Pの配線面
に実装されていても空気が電子部品と基板及び噴流半田
との間に閉じ込められることがない。そして、噴流口1
1,12はそれぞれ反対方向に傾斜(αa,αb)してい
るので、半田が電子部品の前面と基板の間及び後面と基
板の間にできる空間の隅々までよく入り込み、良質な半
田付ができる。As described above, since the solder jets 11 to 13 are arranged obliquely (α 1 ) with respect to the flow of the substrate, the electronic component 9 is connected to the wiring surface of the substrate P as shown in FIG. Air is not trapped between the electronic component and the substrate and the jet solder. And the spout 1
1 and 12 are inclined in the opposite directions (α a , α b ), so that the solder well penetrates into every corner of the space formed between the front surface and the substrate and between the rear surface and the substrate of the electronic component, and a high-quality solder Can be attached.
【0015】上記では、噴流口11〜13をプリント基
板Pの移動方向に対し斜めに設けているが、図3に示す
ようにそれぞれの両端部がプリント基板Pの移動方向下
流側を向くように傾斜したくの字状に設けてもよい。In the above description, the jet ports 11 to 13 are provided obliquely to the moving direction of the printed circuit board P. However, as shown in FIG. 3, both ends are directed to the downstream side in the moving direction of the printed circuit board P. It may be provided in the shape of a slanted letter.
【0016】なお、本発明は、プリント板を水平方向に
移動させて半田付をする場合にも適用できることはいう
までもない。It is needless to say that the present invention can be applied to the case where the printed board is moved in the horizontal direction to perform soldering.
【0017】[0017]
【発明の効果】本発明は、上述のとおり構成されている
ので、次に記載する効果を奏する。Since the present invention is configured as described above, the following effects can be obtained.
【0018】(1)半田の噴流口がプリント板の流れ方
向に対して斜めに設けられているので、電子部品と噴流
半田との間に空気溜まりが形成されることがない。(1) Since the jet port of the solder is provided obliquely with respect to the flow direction of the printed board, no air pocket is formed between the electronic component and the jet solder.
【0019】(2)互いに反対方向に傾斜した噴流口を
備えているので、半田がプリント基板に対して前方から
と後方から噴流され、従来半田の当たりにくい部分にも
半田を当てることができる。(2) Since the nozzles are provided with jet ports inclined in opposite directions, the solder is jetted from the front and the back of the printed circuit board, so that the solder can be applied also to a portion which is hardly hit by the conventional solder.
【0020】(3)上記(1),(2)により良質な半
田付が可能となり、半田付不良のプリント板が減少す
る。(3) By the above (1) and (2), high quality soldering becomes possible, and the number of printed boards having poor soldering is reduced.
【図1】実施の形態例にかかる半田噴流口の配置を示す
平面図。FIG. 1 is a plan view showing an arrangement of solder jet ports according to an embodiment.
【図2】噴流半田の流れを示す側面図。FIG. 2 is a side view showing the flow of the jet solder.
【図3】半田噴流口の形状を変えた場合のハンダ槽部を
示す平面図。FIG. 3 is a plan view showing a solder bath portion in a case where the shape of a solder jet is changed.
【図4】半田付装置の構成説明図。FIG. 4 is a configuration explanatory view of a soldering device.
【図5】半田槽1槽分を示す側断面図。FIG. 5 is a side sectional view showing one solder bath.
【図6】従来プリント板と半田の流れの関係を示す側面
図。FIG. 6 is a side view showing a relationship between a conventional printed board and a flow of solder.
【図7】従来、表面実装形プリント基板の半田付状態を
示す側面図。FIG. 7 is a side view showing a soldered state of a conventional surface mount type printed circuit board.
1…半田付装置のトンネル状覆体 2…フラックス塗布部 3…プリヒータ部 4,41,42…半田槽 91,92…電子部品 11,12,13…半田噴流口 41…噴流半田槽 42…半田 42′…噴流半田 43…ヒータ 44…半田噴流器 45…ポンプ 46…噴流口 a,b,c…噴流半田 P…プリント基板1 ... tunnel-like covering body 2 ... flux applying unit 3 ... preheater portions 4, 4 1 of the soldering apparatus, 4 2 ... solder tank 9 1, 9 2 ... electronic components 11, 12, 13 ... solder ejection port 41 ... jet solder Bath 42 ... Solder 42 '... Jet solder 43 ... Heater 44 ... Solder jet 45 ... Pump 46 ... Jet outlet a, b, c ... Jet solder P ... Printed circuit board
Claims (2)
させて移動するプリント基板に実装された電子部品のリ
ード線又は端子を半田付する半田付装置において、 前方及び後方に斜めに溶融半田を噴流する一対の噴流口
を有し、この一対の噴流口はプリント基板の移動方向に
対して斜めに設けられていることを特徴とした半田付装
置。1. A soldering apparatus for soldering a lead wire or a terminal of an electronic component mounted on a printed circuit board which is moved by jetting molten solder from a slit-shaped jet port, wherein the molten solder is slanted forward and rearward. A soldering apparatus comprising: a pair of jet ports for jetting, wherein the pair of jet ports are provided obliquely to a moving direction of a printed circuit board.
させて移動するプリント基板に実装された電子部品のリ
ード線又は端子を半田付する半田付装置において、 前方及び後方に斜めに溶融半田を噴流する一対の噴流口
を有し、この一対の噴流口はそれぞれ両端部がプリント
基板の移動方向下流側を向くように傾斜したくの字状に
設けられていることを特徴とした半田付装置。2. A soldering apparatus for soldering a lead wire or a terminal of an electronic component mounted on a printed circuit board which is moved by jetting molten solder from a slit-shaped jet port, wherein the molten solder is slanted forward and rearward. A soldering device having a pair of jet ports for jetting, each pair of jet ports being provided in a diagonal shape inclined such that both end portions thereof face the downstream side in the moving direction of the printed circuit board. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17313096A JPH1022620A (en) | 1996-07-03 | 1996-07-03 | Soldering device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17313096A JPH1022620A (en) | 1996-07-03 | 1996-07-03 | Soldering device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH1022620A true JPH1022620A (en) | 1998-01-23 |
Family
ID=15954686
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17313096A Pending JPH1022620A (en) | 1996-07-03 | 1996-07-03 | Soldering device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH1022620A (en) |
-
1996
- 1996-07-03 JP JP17313096A patent/JPH1022620A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3311547B2 (en) | Soldering equipment | |
JP3740041B2 (en) | Partial soldering method for printed circuit boards | |
JP3062330B2 (en) | Soldering method and apparatus for printed circuit board | |
JPH1022620A (en) | Soldering device | |
JP2008041854A (en) | Method of forming hybrid wave, and hybrid wave formation apparatus | |
JPS6257428B2 (en) | ||
JPS6051940B2 (en) | Printed circuit board soldering equipment | |
JPH04314389A (en) | Electric component soldering method | |
JP4568454B2 (en) | Partial jet solder bath and printed circuit board partial soldering method | |
JPS61281592A (en) | Soldering of electric part | |
JPH0846343A (en) | Method of soldering lead terminal and screen used for the method | |
JP2003331960A (en) | Electronic component with terminal | |
JPS5852899A (en) | Method and device for soldering to printed board | |
JP2767832B2 (en) | Printed circuit board soldering method | |
JPH11354915A (en) | Soldering of printed board and wave soldering bath | |
JPS6121170Y2 (en) | ||
JPH0715130A (en) | Soldering method | |
JPH01266792A (en) | Method and apparatus for soldering printed board | |
JPH04339563A (en) | Jetting solder vessel | |
JPH05226557A (en) | Parts for soldering | |
JP2003188520A (en) | Method and apparatus for soldering printed board | |
JPH10173327A (en) | Method and system for soldering surface-mounting printed board | |
JPS5933897A (en) | Soldering device | |
JPH05318100A (en) | Soldering device | |
JPH01132198A (en) | Soldering of printed-circuit board |