JPS58205674A - Soldering apparatus - Google Patents

Abstract

PURPOSE:To perform automatically soldering without giving any trouble to electric parts and to improve the working property, by installing a through-hole in the support of insulating substrate and a means which moves the substrate to a preheated soldering position through the through-hole. CONSTITUTION:An insulating substrate 26 equipped with terminals 27a and 28a of electric parts 27 and 28 is put in the recessed part 22 of a support 20. The support is placed on rails 4 and a groove 24 at the lower surface of the support 20 is faced to a preheating heater 11 and the soldering part at the lower surface of the substrate 26 is preheated through a through-hole 25 formed in the groove 24. Then, the support 20 is transferred by using a transferring plate 10 and the groove 24 is allowed to correspond to an ejecting hole 17 installed in a solder tub 13. The molten solder 18 ejected from the ejecting hole 17 is controlled by the groove 24 and contacts the terminal 27a (28a) at the lower surface of the substrate 26 through the through-hole 25 formed in the groove 24, and thus, the soldering is performed.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a soldering device that automatically solders terminals of metal components to conductor portions of insulating crosspieces.

This type of conventional soldering device attaches the electrical components to the printed circuit board by passing the terminals of the electrical components through the upper and lower KINs into the printed circuit board, which is an insulating substrate, and forming connection holes (from above). The lower surface of the printed circuit board, which is the surface on which the conductor portion is formed, is placed in the solder bath.
It is common to have a configuration in which it is immersed in molten solder at 50°C to 250°C. However, if electrical components are also attached to the bottom surface of the printed circuit board, or if electrical components that are sensitive to heat, such as resin molded components, are attached flush to the bottom surface of the printed circuit board, the electrical components Since the soldering device is directly immersed in the molten solder, or the electrical components are exposed to the adverse effects of heat from the molten solder, it is not possible to use the above-mentioned soldering equipment, and in such cases manual soldering is necessary. It was necessary to perform soldering, which resulted in poor workability. Furthermore, when a large number of electrical components are attached to a printed circuit board, the distance between the terminals of each electrical component becomes extremely small, so if all soldering is done using the soldering device described above, melting may occur between the terminals. There is a problem in that solder adheres to the terminals, causing a short circuit between the terminals, a so-called bridge.

The present invention has been made in view of the above circumstances, and its purpose is to automatically and reliably solder any N gas components mounted on an insulating board without causing any trouble to the components. It is an object of the present invention to provide a soldering device that can improve workability and prevent the formation of bridges between terminals of electrical and electrical parts.

An embodiment of the present invention will be described below with reference to the drawings.

1 is a horizontal base, and at both left and right ends there are pillars 2.
2 and 3.3 are erected, and rails 4, 4 are installed as a bridge between these supports 2.2 and 5.6. In this case, the rail 4.4 is set to have an inclination angle θ of approximately 6°, for example, I:Jn, as it goes in the direction of arrow A, which is the right direction with respect to the base g1 (horizontal surface). Reference numeral 6 denotes a transfer mechanism attached to a support member 5 erected on the base 1.
A transfer motor 8 that rotates in the opposite direction, a telescoping rod 9 such as an electric antenna of an automobile that extends and shortens in accordance with the forward and reverse rotations of the transport motor 8, and a telescoping rod 9 connected to the tip of the telescoping rod 9. The transfer plate 1 is moved along the rail 4 in the direction of the arrow and in the direction of the arrow A in response to the expansion and contraction of the telescopic rod 9.
It is composed of o. Then, when the telescopic rod 9 is shortened to the minimum, the race s where the transfer plate 1o is located is
' 4 The left end of s 4 is the set position [B. 1
1 is a preheating heater that is long on the left and right.
is placed in position B with Sera in rail 4.4 and base 1
It is erected and supported by nine support members 12.

In this case, the preheater 11 is located near one of the rails 4, 4, and is set to be substantially parallel to the rail 4. Reference numeral 15 denotes a semicircular tank installed on the base 1, with a rectangular opening located below the soldering position C, which is the right side of the soldering position B in the upper surface of the tank 1. A portion 14 is formed.In addition, a rectangular ejection tube 15 is erected within the solder 13;
An ejection cover 16 is attached and fixed to the upper end opening of the ejection tube 15 so as to protrude upward from the opening 14 . A substantially slit-shaped ejection hole 17 is formed on the upper surface of the ejection cover 16 and extends in the left-right direction and is open at the upper end and both left and right ends, and projects upward.
This ejection hole portion 17 is connected to one of the rails 4.
It is set to be located near the bottom of . Although not shown in the drawings, inside the semicircular tank 13, the solder inside is melted and the molten solder 18 is heated to 230°C to 250°C.
A heater is provided to maintain the temperature at the temperature of 0.5C, and a jet pump device is provided which jets the molten solder 18 upward through the jet port 17 through the jet tube 15, and the transfer motor 8. The preheater 11, heating heater, jet pump device, etc. are controlled by a control device (not shown) as described above. Note that 19 is an exhaust hood.

Now, 20 is a support made of heat-resistant material formed in a substantially rectangular carved disk shape, and its P'Q and rear end portions have mounting protrusions PflS.
21.21 is provided to protrude outward. Further, four substantially rectangular support portions 22 are formed on the upper surface of the support body 20, and a substantially rectangular escape recess 25 is formed in the portion of the four support portions 22 excluding the rear end portion. There is. Furthermore, at the rear end of the lower surface of the support body 20, there is a groove 24, which is a recessed part, which is open at the lower end and at both the left and right ends.
It is formed by grinding at both right end portions, and a through hole portion 25 extending from side to side is formed in the top and bottom walls 24a of the groove portion 24. 26 is a printed circuit board which is a substantially rectangular insulating board, and a large number of electrical and electrical components 27.・
...and 28. ....... to its terminal 27a
+... and 28a,... are formed on the KM printed jinne board 26 and the connection holes 26a,...
and 26b.

It is attached by inserting it into terminals 27a, 28a9, and 28a9.
* indicates a conductor part (not shown) of the M plate 26 protrudes from the lower surface side.

Next, the operation of the leprosy case with the above configuration will be explained.

First, the operator operates the set switch on the control device to energize the heater for the solder 13 to generate heat, thereby heating and melting the solder in the solder tank 13 and discharging the molten solder 18. In addition, by operating the preheating heater switch of the control device, the preheating heater 11 is energized to generate heat at approximately 500°C, for example, and thereby the soldering process is performed. Complete preparations for Sakashiba.

Therefore, the operator selects the terminal 27a, which is the soldering part to be soldered to the conductor part on the lower surface of the printed circuit board 26.
After spraying or applying flux to the part, the printed circuit board 26 is placed in the support recess 422 of the support body 20.
The terminal 27a,...
facing into the through hole 25, and the terminals 28a,...
... is located in the escape recess 23 (see Fig. 6).
. Furthermore, by mounting the supporting body 20 supporting the printed circuit board 26 in this way with its mounting protrusion 21.21 on the horizontal part of the rail 4.4, the setting position of the rail 4.4 [jlB] (See Figure 4). In this case, the groove 24 on the lower surface of the support body 20 faces the preheater 11.
The preheating heater 11 is connected to the terminal 27 which is a soldering part on the lower surface of the printed circuit board 26 through the through hole 25.
Start preheating the a,... section.

Therefore, when the operator operates the operation switch 7 from the neutral position to the raised position, the timer of the control device starts counting the set time (for example, 15 seconds), and the jet pump device of the solder bath 15 starts operating. Start melting solder 18
is ejected upward from the ejection hole 17,
The molten solder 18 becomes a jet flow 18a flowing down from the jet hole portion 17 in the front-back and left-right directions. At this time, the transfer motor 8
is still cut off, so the support 20 is stopped at the set position B and the terminals 27a and 27a of the printed circuit board 26 are
・・・・・・Preheating of the area continues. Thereafter, when the timer of the control device finishes counting the set time of 15 seconds, the transfer motor 8 is formed with, for example, a normal rotation energization path and rotates in the normal direction to extend the telescopic rod 9, and the transfer plate 10 is moved in the predetermined direction of transfer in the direction indicated by the notched mark A, and in conjunction with this, the support body 20 is transferred from one side to the other on the rails 4, 4. And support body 2075; Ray V4
, 4 to the soldering position C (see Fig. 5),
The groove portion 24 of the support body 20 corresponds to the protruding strips 17a, 17a of the ejection hole portion 17 at the ejection cup (-16), and the inner wall portion 24a of the groove portion 24 (the protruding strips 17a, 1
QIJ very close to or almost in contact with the end of 7& (see Figure 6). Therefore, the molten solder 18 that is ejected from the ui outlet hole "FF1175) is 1" by the groove part 24.

The jet flow 18b is restricted from flowing backward and is rectified into a jet flow 18b that is guided downward to the left and right (see FIGS. 7 and 8). Therefore, compared to the jet flow 113a in the case shown in FIG. 5, the jet flow 18b in this case has a belt-like state oriented in the left and right directions [^1], and its flow rate is also larger. be. Then, this υλ flow 18b comes into contact with the terminals 27a, . ...and conductor i'l
and solder. In this case, rail 4.4 (Sat ¥;,
Since the support body 20 is also set to form an inclination angle θ (for example, approximately 6°) with respect to 411, the support body 20 also makes an inclination angle θ?
1) comes into contact with the lower surface of the printed circuit board 26 not at a right angle but at a contact angle of (90-θ)0 (for example, approximately 84°) (see FIG. 8). Thereafter, the support body 20 is moved east in the direction of the arrow Ell A to the stop position DKt, which is the right end of the stamp date position clura j14 sill 4°4! Then, one of the rays A/4°4
An upper limit switch (not shown) provided at I/4 is activated by the transfer J1/10 to cut off the normal rotation energization path of the transfer motor 8, and the support body 20 is stopped at J:1.
〆l I) is stopped 1-. Then, the worker raises the operation switch 7 to the neutral position If 'k 1
4, when the transfer sweater 8 is operated to the lowered position side, a reverse energization path is formed and the transfer sweater 8 rotates in the opposite direction to shorten the dough rod 9. Stop 1\γli<l Leave it at D and move in the opposite direction of arrow A.

Thereafter, when the transfer plate 10 returns to the set position, the lower limit switch provided on one of the rails 4.4 is activated by the transfer plate 10, and the Reversal X[fI is now disconnected, and the transfer plate 10 is brought to the set position 1i1B. After this, the fY trader operates the operating switch 7 from the lowered position 1dj to the neutral position, thereby completing one soldering cycle.

According to this embodiment of the configuration of +;LI:, the following effects can be obtained. That is, the printed circuit board 26 is supported on the support body 20 in such a way that the terminals 27 & . By spouting the bath melted solder 18 from the hole 1 bore 17, the terminals 27a,...
...Since the conductor part on the bottom surface of the purple printed circuit board 260 is attached half 1 μm, if electrical components are attached to the bottom surface of the printed circuit board 26, or if there are electrical components attached to the bottom surface of the printed circuit board 26, 6...In a piece of wood to which heat-sensitive t4X parts are attached 7', these electrical parts can be melted by the support 20.
Even if the electrical parts are attached in such a state that they are isolated from the heat source 18, the electrical components may be immersed in the solder solder 18 or be affected by the heat of the solder solder 18. It is possible to automatically solder while reliably preventing this, and unlike conventional methods, there is no need to perform manual soldering, making it possible to improve the work efficiency. The groove part 24 in the semi-circular tank 13 is fitted in such a way that it straddles the groove part 24 in the spouting hole part 17 in the semicircular tank 13, so that the molten solder 1 tilting out from the spouting hole part 17
Reference numeral 8 denotes a belt-shaped l material t18b that is regulated by the groove 24 and guided in the left-right direction, and this jet flow 1B'
Since the soldering between the terminals 27a, . Moreover, the support body 20 can be prevented from occurring at a predetermined oblique angle θ with respect to the outlet hole 417.
Since the dimensions are set as follows, the melt from the outlet hole 417 is 1-tl118 against the back wall 24a of the horizontal part 24 of the support body 20, that is, the bottom surface of the printed circuit board 26. Instead of contacting with a square angle, the contact is made with a contact angle of (90-θ)0. Therefore, the solder 18 on the lower part of the printed circuit board 26 can be easily cut, and the bridge as described above is formed. This can definitely be prevented from occurring. ＠(C1'%: In the case of the example, an experimental result was obtained in which the inclination angle θ was 5 degrees or more when the molten solder 18 broke on the bottom surface of the printed circuit board 26. Terminal 27a in the section,...
. . . The terminal 27a, . The molten duck solder 18 easily adheres to the terminals 27a, . . . . by simply spouting molten solder 18 onto the terminals 27a, . Moreover, with the support body 20 stopped at the set position B, two terminals 27a are connected to the lower surface of the printed circuit board 26 by the preheating heater 11 with a wire.
Since the parts are preheated, compared to the case where, for example, the terminals 27a of the printed circuit board 26, the parts are preheated while the 20 supports are moved in the direction of arrow A. There is no need to increase the length of the trays v4, 4 in the left-right direction, and the length of the preheater 11 in the left-right direction only needs to be approximately equal to the length of the support 20 in the left-right direction. Therefore, it is possible to reduce the size of the entire device.However, for parts with small heat capacity, the preheater 1
1, it is possible to perform good soldering without preheating, but in such a case, in this embodiment, the preheating heater 11 is turned off without operating the preheating heater switch on the control device. It is also possible to use the two-crop method.

In the above embodiment, the support body 20 was set to form a predetermined inclination angle θ with respect to the overnight outlet hole 417 (horizontal surface).
Instead of setting the support 20 horizontally, the contact angle of the molten solder to the lower surface of the support 20 is not at right angles (90-θ).
The ejection hole portion may be provided so as to have an inclination angle of 0 or an inclination angle of θ.

In addition, the present invention is not limited to the dormitory embodiment described above and shown in the drawings, and it goes without saying that the present invention can be modified as appropriate and implemented in a dormitory without departing from the scope of the invention.

As explained above, the present invention provides a support that supports an insulating substrate having a through hole and on which an electrical component is attached, and makes the soldering portion of the insulating substrate face the through hole. A preheating device is provided for preheating the soldering portion of the -1 grade board through the through hole of the support body, and after preheating by the preheating device, the transfer mechanism Since the structure is such that a solder tank is provided in the through-hole part of the transferred support body to which the ejection orifice for ejecting molten solder sounds, no matter what kind of electrical component is attached to the insulating board in any condition, the electrical component will not be affected. Soldering can be performed automatically without any problems, and it can be soldered reliably. Therefore, manual soldering is not required, improving work efficiency. This has excellent effects such as being able to prevent pudding from forming in between.

[Brief explanation of the drawing]

The drawings show one embodiment of the present invention, and FIG. 1 is a perspective view of the whole, FIG. 2 is a perspective view of a support, FIG. 3 is a perspective view of a support and a printed circuit board, and FIGS. 4 and 5. 1 is a partial perspective view of FIG. 1 for explaining the action, FIG. 6 is a vertical sectional view of the main part, FIG. 7 is a perspective view of a part of the ejection cover, and FIG. 8 is a partial perspective view of the main part shown in FIG. 6. FIG.

Claims (1)

[Scope of Claims] 1. A support having a through hole and supporting an insulating paper board to which parts are attached, and allowing the semi-attached portion of the insulating substrate to fit into the through hole, and this support. a transfer mechanism for transferring in a predetermined direction; A soldering device comprising a soldering tank having a spouting hole for spouting molten solder into the through-hole of the transferred support; The soldering part (d) according to claim 1, characterized in that the support is held in a stopped state during preheating of the soldering part (d).