JPH06164123A - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPH06164123A JPH06164123A JP31820392A JP31820392A JPH06164123A JP H06164123 A JPH06164123 A JP H06164123A JP 31820392 A JP31820392 A JP 31820392A JP 31820392 A JP31820392 A JP 31820392A JP H06164123 A JPH06164123 A JP H06164123A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- land
- lead
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はプリント基板に係り、詳
しくは、電子部品のリードが搭載される半田プリコート
部の高さを部分的に高くできるランドを有するプリント
基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board, and more particularly, it relates to a printed circuit board having lands capable of partially increasing the height of a solder precoat portion on which a lead of an electronic component is mounted.
【０００２】[0002]
【従来の技術】電子部品のリードをプリント基板（以
下、「基板」という。）に半田付けする半田部の形成方
法は、スクリーン印刷機によりクリーム半田を基板のラ
ンド（電極）に塗布する方法と、半田レベラや半田メッ
キなどのコーティング手段によりランドに半田プリコー
ト部を形成する方法に大別される。2. Description of the Related Art A method of forming a solder portion for soldering leads of an electronic component to a printed circuit board (hereinafter referred to as a "substrate") is a method of applying cream solder to a land (electrode) of the substrate by a screen printing machine. , The solder precoat portion is formed on the land by a coating means such as solder leveler or solder plating.
【０００３】前者は、コストが安価という長所を有して
いるが、クリーム半田の塗布量が適量となるように管理
することが困難であって、塗布量がばらつきやすいとい
う短所がある。因みに塗布量が過多であると、回路の短
絡の原因となる半田ブリッジや半田ボールが生じやす
く、また塗布量が過少であると、リードをランドにしっ
かり接着できないこととなる。更には、近年、リードは
益々狭ピッチ化しており、これに応じてランドも益々極
細化しているが、スクリーン印刷機によっては、極細の
ランドに適量のクリーム半田を塗布することは次第に困
難になってきている。The former has the advantage that the cost is low, but it has the drawback that it is difficult to control the application amount of cream solder to an appropriate amount and the application amount tends to vary. By the way, if the coating amount is too large, solder bridges or solder balls that cause a short circuit of the circuit are likely to occur, and if the coating amount is too small, the leads cannot be firmly bonded to the land. Furthermore, in recent years, the lead pitch has become narrower and narrower, and the land has become finer accordingly. However, depending on the screen printing machine, it becomes gradually difficult to apply an appropriate amount of cream solder to the fine land. Is coming.
【０００４】これに対して後者、すなわち半田プリコー
ト部を形成すれば、半田の塗布量の管理を正確に行いや
すく、またリードの狭ピッチ化に対応して半田部を小形
化することも比較的容易であることから、近年は半田プ
リコート部により半田部を形成することが次第に多くな
ってきている。On the other hand, if the latter, that is, the solder precoat portion is formed, it is easy to accurately control the amount of solder applied, and it is relatively possible to downsize the solder portion in response to the narrow lead pitch. Since it is easy, the solder portion is increasingly formed by the solder precoat portion in recent years.
【０００５】[0005]
【発明が解決しようとする課題】ところで電子部品のリ
ードには、成形上の誤差や、保管運搬時の変形等のため
に、浮き（リードが上方へ屈曲すること）が生じやす
い。一方、上述のように近年は、リードの狭ピッチ化の
ために、半田プリコート部の大きさは次第に小さくな
り、その厚さも薄くなってきている。このため、図１１
に示すように、電子部品Ｐのモールド体Ｍから延出する
リードＬに僅かな浮きがある場合でも、リードＬは半田
プリコート部３に接地できず、半田プリコート部３をリ
フロー手段などにより加熱溶融させてもリードＬは基板
１のランド２に半田付けされにくいという問題点があっ
た。By the way, the lead of the electronic component is liable to be lifted (the lead is bent upward) due to an error in molding, deformation during storage and transportation, and the like. On the other hand, as described above, in recent years, the size of the solder precoat portion has gradually become smaller and the thickness thereof has also become thinner due to the narrower pitch of the leads. Therefore, FIG.
As shown in, even if the lead L extending from the mold body M of the electronic component P has a slight floating, the lead L cannot be grounded to the solder precoat portion 3, and the solder precoat portion 3 is heated and melted by a reflow means or the like. However, there is a problem that the lead L is difficult to be soldered to the land 2 of the substrate 1.
【０００６】したがって、本発明は狭ピッチ化されたリ
ードに浮きがあっても、リードを半田プリコート部によ
り確実に半田付けできるプリント基板を提供することを
目的とする。Therefore, it is an object of the present invention to provide a printed circuit board which can reliably solder the leads by the solder precoat portion even if the leads having a narrow pitch are floated.
【０００７】[0007]
【課題を解決するための手段】このために本発明は、プ
リント基板のランドの表面のヌレ性に部分的に差異を付
与したものである。For this reason, the present invention partially provides the wetting property of the surface of the land of the printed circuit board.
【０００８】[0008]
【作用】上記構成によれば、半田プリコート部を加熱溶
融させると、溶融した半田の内圧は、ヌレ性の低い箇所
の方が高い箇所よりも大きくなる。したがって溶融した
半田は内圧の高い部分から低い部分へ吸い寄せられて、
ヌレ性の高い箇所に局所的に盛上り部が生じる。したが
ってリードに多少の浮きがあっても、リードを盛り上り
部に接地させて確実に半田付けできる。According to the above construction, when the solder precoat portion is heated and melted, the internal pressure of the melted solder becomes higher at a portion having low wetting property than at a portion having high wetting property. Therefore, the melted solder is drawn from the part with high internal pressure to the part with low internal pressure,
A raised portion is locally generated in a highly wetted portion. Therefore, even if there is some floating in the lead, the lead can be grounded to the raised portion and reliably soldered.
【０００９】[0009]
【実施例】次に、図面を参照しながら本発明の実施例を
説明する。Embodiments of the present invention will now be described with reference to the drawings.
【００１０】図１は、本発明の第１の実施例係わるプリ
ント基板のランドに形成された半田プリコート部を酸化
処理するためのレーザ照射装置の斜視図である。基板１
の上面に形成された回路パターン５の先端部にはランド
２が形成されている。FIG. 1 is a perspective view of a laser irradiation apparatus for oxidizing a solder precoat portion formed on a land of a printed circuit board according to the first embodiment of the present invention. Board 1
The land 2 is formed at the tip of the circuit pattern 5 formed on the upper surface of the.
【００１１】プリント基板１はコンベア１１により搬送
される。コンベア１１の側部には固定クランパ１２と可
動クランパ１３が設けられている。可動クランパ１３は
シリンダ１４のロッド１５に結合されており、ロッド１
５が突出すると、プリント基板１はクランパ１２、１３
によりクランプされて固定される。またロッド１５が引
き込むと、クランプ状態は解除されて、プリント基板１
はコンベア１１により搬送可能となる。The printed circuit board 1 is conveyed by a conveyor 11. A fixed clamper 12 and a movable clamper 13 are provided on the side of the conveyor 11. The movable clamper 13 is connected to the rod 15 of the cylinder 14, and the rod 1
When 5 is projected, the printed circuit board 1 is clamped by the clampers 12, 13
It is clamped and fixed by. When the rod 15 is retracted, the clamped state is released and the printed circuit board 1
Can be conveyed by the conveyor 11.
【００１２】クランパ１２、１３の上方には、Ｘテーブ
ル２１とＹテーブル２２が設けられている。Ｙテーブル
２２の先端部にはレーザ照射器２３が取り付けられてい
る。図２に示すように、Ｘテーブル２１とＹテーブル２
２と駆動してレーザ照射器２３をＸ方向やＹ方向に移動
させながら、レーザ光Ｒをランド２に照射して、ランド
２を部分的に酸化させる。An X table 21 and a Y table 22 are provided above the clampers 12 and 13. A laser irradiator 23 is attached to the tip of the Y table 22. As shown in FIG. 2, the X table 21 and the Y table 2
The laser light R is irradiated to the land 2 while driving the laser irradiation device 23 in the X direction and the Y direction by driving the laser irradiation device 2 to partially oxidize the land 2.
【００１３】図３は、本発明の第１の実施例に係わるプ
リント基板の平面図である。レーザ光ＲはＸ１，Ｘ２，
Ｙ１，Ｙ２，Ｘ３，Ｘ４，Ｙ３，Ｙ４方向に照射され
る。ここで、ランド２の長さＤは１ｍｍ，レーザ光Ｒの
直径πは０．３ｍｍ，その温度は３００℃であり、した
がってレーザ光Ｒが照射された箇所は部分的に酸化さ
れ、ヌレ性が低下する。図３において、２ａはレーザ光
Ｒが照射され、酸化したランド２の表面、２ｂはレーザ
光Ｒが照射されず酸化されなかった表面である。FIG. 3 is a plan view of a printed circuit board according to the first embodiment of the present invention. Laser light R is X1, X2
Irradiation is performed in the Y1, Y2, X3, X4, Y3, and Y4 directions. Here, the length D of the land 2 is 1 mm, the diameter π of the laser beam R is 0.3 mm, and the temperature thereof is 300 ° C. Therefore, the portion irradiated with the laser beam R is partially oxidized and has a wetting property. descend. In FIG. 3, 2a is the surface of the land 2 which is irradiated with the laser beam R and is oxidized, and 2b is the surface which is not irradiated with the laser beam R and is not oxidized.
【００１４】図４は、本発明の第１の実施例に係わるプ
リント基板の断面図であり、ランド２上にメッキ手段や
半田レベラ手段に形成された半田プリコート部３を示し
ている。半田プリコート部３の融点は１８３℃である。
このプリント基板１を加熱炉で２２３℃程度までさせて
加熱させて半田プリコート部３を溶融させると、レーザ
光Ｒにより酸化されなかった箇所（表面２ｂ）において
は溶融半田の内圧差により盛上り、盛上り部３ａが生じ
る。次に図５（ａ）（ｂ）を参照しながら、盛上り部３
ａが生じる理由を説明する。図５（ａ）は本発明の第１
の実施例に係わるプリント基板の酸化された半田プリコ
ート部の断面図であり、レーザ光Ｒが照射されなかった
ランド２の表面２ｂに形成された半田プリコート部３が
加熱されて溶融した状態を示している。表面２ｂは酸化
されていないのでヌレ性が高く、半田３の表面の曲率Ｒ
１は大きい。溶融した半田３の内圧△Ｐ１は次式であ
る。FIG. 4 is a sectional view of a printed circuit board according to the first embodiment of the present invention, showing a solder precoat portion 3 formed on a land 2 by a plating means and a solder leveler means. The melting point of the solder precoat portion 3 is 183 ° C.
When the printed board 1 is heated to about 223 ° C. in a heating furnace to melt the solder precoat portion 3, the solder precoat portion 3 rises due to a difference in internal pressure of the molten solder at a portion (surface 2b) not oxidized by the laser light R, The raised portion 3a is generated. Next, referring to FIGS. 5A and 5B, the rising portion 3
The reason why a occurs will be described. FIG. 5A shows the first of the present invention.
FIG. 6 is a cross-sectional view of an oxidized solder precoat portion of the printed circuit board according to the embodiment of the present invention, showing a state where the solder precoat portion 3 formed on the surface 2b of the land 2 which is not irradiated with the laser beam R is heated and melted. ing. Since the surface 2b is not oxidized, the wetting property is high, and the curvature R of the surface of the solder 3 is
1 is big. The internal pressure ΔP1 of the melted solder 3 is given by the following equation.
【００１５】△Ｐ１＝２γ／Ｒ１ 但し、γは半田３の表面張力である。ΔP1 = 2γ / R1 where γ is the surface tension of the solder 3.
【００１６】また図５（ｂ）本発明の第１の実施例に係
わるプリント基板の酸化されなかった半田プリコート部
の断面図であり、レーザ光Ｒが照射されて酸化されたラ
ンド２の表面２ａに形成された半田プリコート部３が加
熱されて溶融した状態を示している。この表面２ａは酸
化されたためヌレ性が低く、半田３の表面の曲率Ｒ２は
小さい。溶融した半田３の内圧△Ｐ２は次式である。FIG. 5 (b) is a sectional view of the solder precoat portion of the printed circuit board according to the first embodiment of the present invention which has not been oxidized, and shows the surface 2a of the land 2 which is oxidized by being irradiated with the laser beam R. The solder precoat portion 3 formed in FIG. Since the surface 2a has been oxidized, the wetting property is low, and the curvature R2 of the surface of the solder 3 is small. The internal pressure ΔP2 of the molten solder 3 is given by the following equation.
【００１７】△Ｐ２＝２γ／Ｒ２ ここでＲ１＞Ｒ２であり、したがって△Ｐ１＜△Ｐ２で
ある。すなわち、レーザ光Ｒが照射されて酸化された表
面２ａで溶融した半田３の内圧△Ｐ２は、レーザ光Ｒが
照射されなかった表面２ｂで溶融した半田３の内圧△Ｐ
１よりも大きい。したがって溶融した半田３は、内圧△
Ｐ２の大きい表面２ａから内圧△Ｐ１の小さい表面２ｂ
へ吸い寄せられ、図４に示すような盛上り部３ａが生じ
ることとなる。ΔP2 = 2γ / R2 where R1> R2 and therefore ΔP1 <ΔP2. That is, the internal pressure ΔP2 of the solder 3 melted on the surface 2a irradiated with the laser light R and oxidized is equal to the internal pressure ΔP2 of the solder 3 melted on the surface 2b not irradiated with the laser light R.
Greater than 1. Therefore, the molten solder 3 has an internal pressure Δ
Surface 2a with a large P2 to surface 2b with a small internal pressure ΔP1
As a result, the rising portion 3a as shown in FIG. 4 is generated.
【００１８】図６は、基板１に電子部品Ｐを搭載した状
態を示している。電子部品Ｐのモールド体Ｍから延出す
るリードＬ（Ｌ１，Ｌ２）は、スクリーン印刷手段など
により形成された半田部３上に搭載されている。図示す
るように、右方のリードＬ２は半田部３に着地している
が、左方のリードＬ１は上方へ屈曲変形しているため、
半田部３から浮いている。この基板１を加熱炉で加熱す
ると、半田部３は溶融する。この場合、図４および図５
（ａ）（ｂ）を参照しながら説明したように、レーザ光
Ｒが照射されてヌレ性が低下した表面２ａで溶融した半
田３は、レーザ光Ｒが照射されなかった表面２ｂへ内圧
の差により吸い寄せられ、局部的な盛上り部３ａが生じ
る。したがって、浮きのあるリードＬ１は盛上り部３ａ
に接地し、更に溶融した半田３はこの接地部分からリー
ドＬ１に更に吸い上げられて、リフロー終了後には、図
７に示すようにリードＬ１はしっかり半田付けされる。FIG. 6 shows a state in which the electronic component P is mounted on the substrate 1. The leads L (L1, L2) extending from the mold body M of the electronic component P are mounted on the solder portion 3 formed by screen printing means or the like. As shown in the figure, the lead L2 on the right side is landed on the solder portion 3, but the lead L1 on the left side is bent and deformed upward,
Floating from the solder part 3. When the board 1 is heated in a heating furnace, the solder portion 3 melts. In this case, FIG. 4 and FIG.
As described with reference to (a) and (b), the solder 3 melted on the surface 2a whose laser light R has been irradiated and whose wettability has deteriorated has a difference in internal pressure to the surface 2b which is not irradiated with the laser light R. Are sucked up by, and a local raised portion 3a is generated. Therefore, the lead L1 having a lift is formed on the raised portion 3a.
The grounded and further melted solder 3 is further sucked up from this grounded portion to the lead L1, and after the reflow, the lead L1 is firmly soldered as shown in FIG.
【００１９】図８及び図９は他の実施例を示している。
マスクプレート３１には、スポット的に孔部３２が形成
されている。このマスクプレート３１で基板１を覆い、
ヒータ３３により熱を加える。すると孔部３２に露呈す
る部分が酸化され、ヌレ性が低下する。図８において符
号２ｂは酸化された表面を示している。したがってこの
ものも、第１実施例と同様の作用効果が得られる。8 and 9 show another embodiment.
Holes 32 are formed in spots on the mask plate 31. Cover the substrate 1 with this mask plate 31,
Heat is applied by the heater 33. Then, the portion exposed to the hole 32 is oxidized and the wettability is reduced. In FIG. 8, reference numeral 2b indicates an oxidized surface. Therefore, also in this case, the same effect as that of the first embodiment can be obtained.
【００２０】図１０は更に他の実施例を示している。マ
スクプレート３１で基板を覆い、ディスペンサ４１から
酸化液４２を吐出し、孔部３２に露呈する部分を酸化さ
せて局部的にヌレ性を低下させる。FIG. 10 shows still another embodiment. The substrate is covered with the mask plate 31, and the oxidizing liquid 42 is discharged from the dispenser 41 to oxidize the portion exposed in the hole 32 to locally reduce the wetting property.
【００２１】このようにランドの表面のヌレ性を部分的
に低下させる方法は種々考えられるのであって、ランド
の表面のヌレ性に部分的に差異を付与して、溶融した半
田がヌレ性の低い部分から高い部分へ吸い寄せられて、
部分的な盛り上り部が生じるようにすればよい。There are various possible methods for partially reducing the wetting property of the land surface as described above. The molten solder has a wetting property by partially making the wetting property of the land surface partially different. It is drawn from the lower part to the higher part,
It suffices that a partial bulge is generated.
【００２２】[0022]
【発明の効果】以上説明したように本発明は、プリント
基板のランドの表面のヌレ性に部分的に差異を付与する
ので、溶融した半田はヌレ性の低い表面から高い表面へ
吸い寄せられて局所的な盛上り部が生じることになり、
したがってリードに多少の浮きがあっても、リードはこ
の盛上り部に接地してしっかり半田付けされる。As described above, according to the present invention, since the wettability of the surface of the land of the printed circuit board is partially different, the melted solder is locally attracted to the high wettability surface from the low wettability surface. A climax part will occur,
Therefore, even if the lead has some floating, the lead is grounded to this raised portion and soldered firmly.
【図１】本発明の一実施例に係るプリント基板のランド
に形成された半田プリコート部を酸化処理するためのレ
ーザ光照射装置の斜視図FIG. 1 is a perspective view of a laser light irradiation apparatus for oxidizing a solder precoat portion formed on a land of a printed circuit board according to an embodiment of the present invention.
【図２】本発明の一実施例に係るプリント基板のランド
に形成された半田プリコート部を酸化処理するためのレ
ーザ光照射装置の正面図FIG. 2 is a front view of a laser light irradiation apparatus for oxidizing a solder precoat portion formed on a land of a printed circuit board according to an embodiment of the present invention.
【図３】本発明の一実施例に係るプリント基板の平面図FIG. 3 is a plan view of a printed circuit board according to an embodiment of the present invention.
【図４】本発明の一実施例に係るプリント基板の側面図FIG. 4 is a side view of a printed circuit board according to an embodiment of the present invention.
【図５】（ａ）本発明の第１の実施例に係るプリント基
板の酸化された半田プリコート部の断面図 （ｂ）本発明の第１の実施例に係るプリント基板の酸化
されなかった半田プリコート部の断面図5A is a cross-sectional view of an oxidized solder precoat portion of a printed circuit board according to a first embodiment of the present invention. FIG. 5B is a non-oxidized solder of a printed circuit board according to the first embodiment of the present invention. Cross-section of the precoat section
【図６】本発明の第１の実施例に係るプリント基板に電
子部品を半田付けする前の状態の説明図FIG. 6 is an explanatory view of a state before soldering an electronic component to the printed board according to the first embodiment of the present invention.
【図７】本発明の第１の実施例に係るプリント基板に電
子部品を半田付けした後の状態の説明図FIG. 7 is an explanatory diagram of a state after the electronic component is soldered to the printed board according to the first embodiment of the present invention.
【図８】本発明の第２の実施例に係るプリント基板の斜
視図FIG. 8 is a perspective view of a printed circuit board according to a second embodiment of the present invention.
【図９】本発明の第２の実施例に係るプリント基板の断
面図FIG. 9 is a sectional view of a printed circuit board according to a second embodiment of the present invention.
【図１０】本発明の第３の実施例に係るプリント基板の
断面図FIG. 10 is a sectional view of a printed circuit board according to a third embodiment of the present invention.
【図１１】従来のプリント基板の側面図FIG. 11 is a side view of a conventional printed circuit board.
１ プリント基板 ２ ランド ２ａ ヌレ性の低い表面 ２ｂ ヌレ性の高い表面 1 Printed circuit board 2 Land 2a Surface with low wetting property 2b Surface with high wetting property
Claims (1)
分的に差異を付与したことを特徴とするプリント基板。1. A printed circuit board in which a wetting property of a surface of a land of the printed circuit board is partially different.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31820392A JP3259374B2 (en) | 1992-11-27 | 1992-11-27 | Electronic component soldering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31820392A JP3259374B2 (en) | 1992-11-27 | 1992-11-27 | Electronic component soldering method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06164123A true JPH06164123A (en) | 1994-06-10 |
| JP3259374B2 JP3259374B2 (en) | 2002-02-25 |
Family
ID=18096590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31820392A Expired - Fee Related JP3259374B2 (en) | 1992-11-27 | 1992-11-27 | Electronic component soldering method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3259374B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5801350A (en) * | 1995-03-23 | 1998-09-01 | Hitachi, Ltd. | Surface reformation method of high polymer material |
| JP2013093538A (en) * | 2011-10-04 | 2013-05-16 | Ngk Spark Plug Co Ltd | Wiring board and manufacturing method of the same |
| WO2013153673A1 (en) * | 2012-04-14 | 2013-10-17 | 新電元工業株式会社 | Wiring base material for mounting electronic component thereon, method for manufacturing wiring base material for mounting electronic component thereon, electronic circuit module, and land forming apparatus |
| JP2014167983A (en) * | 2013-02-28 | 2014-09-11 | Mitsubishi Materials Corp | Circuit board for semiconductor device |
| JPWO2013153673A1 (en) * | 2012-04-14 | 2015-12-17 | 新電元工業株式会社 | Wiring substrate for mounting electronic components, method for manufacturing wiring substrate for mounting electronic components, and electronic circuit module |
-
1992
- 1992-11-27 JP JP31820392A patent/JP3259374B2/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5801350A (en) * | 1995-03-23 | 1998-09-01 | Hitachi, Ltd. | Surface reformation method of high polymer material |
| US6017424A (en) * | 1995-03-23 | 2000-01-25 | Hitachi, Ltd. | Laser assisted surface reformation method of high polymer material |
| US6423405B1 (en) | 1995-03-23 | 2002-07-23 | Hitachi, Ltd. | Surface reformation method of high polymer material |
| JP2013093538A (en) * | 2011-10-04 | 2013-05-16 | Ngk Spark Plug Co Ltd | Wiring board and manufacturing method of the same |
| WO2013153673A1 (en) * | 2012-04-14 | 2013-10-17 | 新電元工業株式会社 | Wiring base material for mounting electronic component thereon, method for manufacturing wiring base material for mounting electronic component thereon, electronic circuit module, and land forming apparatus |
| JPWO2013153673A1 (en) * | 2012-04-14 | 2015-12-17 | 新電元工業株式会社 | Wiring substrate for mounting electronic components, method for manufacturing wiring substrate for mounting electronic components, and electronic circuit module |
| JP2014167983A (en) * | 2013-02-28 | 2014-09-11 | Mitsubishi Materials Corp | Circuit board for semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3259374B2 (en) | 2002-02-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6586685B2 (en) | Bump electrode and printed circuit board | |
| US5534127A (en) | Method of forming solder bumps on electrodes of electronic component | |
| US8273644B2 (en) | Soldering method and method of manufacturing semiconductor device including soldering method | |
| JP2007281134A (en) | Chip-type electronic component, and mounting substrate and mounting method therefor | |
| JPH06164123A (en) | Printed board | |
| CN107466163A (en) | A kind of high-reliability new pattern laser etch process | |
| US5868302A (en) | Method and apparatus for mounting electronic component | |
| JP4181236B2 (en) | Intaglio printing method, bump forming method, wiring pattern forming method, and bump and wiring pattern forming method | |
| JPH0846349A (en) | Soldering | |
| JP3186350B2 (en) | Solder bump forming method and bumped electronic component | |
| JPH05258986A (en) | Electronic component provided with solder chip, device and method of providing solder chip to component lead | |
| JPH0677635A (en) | Manufacture of soldering pad part for printed circuit board | |
| JPH04293297A (en) | Printed wiring board and soldering method therefor | |
| JP2004096042A (en) | Supply method of connection material onto circuit board and supply device thereof | |
| JP3344049B2 (en) | Electronic components | |
| JPH09214115A (en) | Solder coating method for fine-pitch component | |
| JPH0823189A (en) | Electronic part mounting film, soldering material feeding method and electronic part mounting method | |
| JPH05206629A (en) | Method of forming solder part of substrate | |
| JP3629646B2 (en) | Mask used for solder printing and solder printing apparatus | |
| JPH07170049A (en) | Mounting structure of surface mounting component and method thereof | |
| JPH05283587A (en) | Soldering method of multiple-lead element | |
| JPH02262396A (en) | Bridge removal device for soldering machine | |
| JPH07176859A (en) | Printed board and method for mounting electronic component on it | |
| JPH0750480A (en) | Soldering method for electronic component | |
| JP3241525B2 (en) | Surface mounting method of printed wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |