JPS58197A - フレキシブル回路基板のハンダ処理法および装置 - Google Patents

フレキシブル回路基板のハンダ処理法および装置

Info

Publication number
JPS58197A
JPS58197A JP9882881A JP9882881A JPS58197A JP S58197 A JPS58197 A JP S58197A JP 9882881 A JP9882881 A JP 9882881A JP 9882881 A JP9882881 A JP 9882881A JP S58197 A JPS58197 A JP S58197A
Authority
JP
Japan
Prior art keywords
circuit board
flexible
solder
soldering
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9882881A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0123959B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
阿部　由貴彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
Original Assignee
Nippon Mektron KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron KK filed Critical Nippon Mektron KK
Priority to JP9882881A priority Critical patent/JPS58197A/ja
Publication of JPS58197A publication Critical patent/JPS58197A/ja
Publication of JPH0123959B2 publication Critical patent/JPH0123959B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Coating With Molten Metal (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP9882881A 1981-06-25 1981-06-25 フレキシブル回路基板のハンダ処理法および装置 Granted JPS58197A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9882881A JPS58197A (ja) 1981-06-25 1981-06-25 フレキシブル回路基板のハンダ処理法および装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9882881A JPS58197A (ja) 1981-06-25 1981-06-25 フレキシブル回路基板のハンダ処理法および装置

Publications (2)

Publication Number Publication Date
JPS58197A true JPS58197A (ja) 1983-01-05
JPH0123959B2 JPH0123959B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-05-09

Family

ID=14230143

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9882881A Granted JPS58197A (ja) 1981-06-25 1981-06-25 フレキシブル回路基板のハンダ処理法および装置

Country Status (1)

Country Link
JP (1) JPS58197A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01278097A (ja) * 1988-04-28 1989-11-08 Taiyo Yuden Co Ltd チップ状回路部品配置装置
JPH01278100A (ja) * 1988-04-28 1989-11-08 Taiyo Yuden Co Ltd チップ状回路部品マウント装置
US11453576B2 (en) 2017-12-13 2022-09-27 Enabl A/S System, device and method for lifting and controlling the horizontal orientation and/or position of components

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5418070A (en) * 1977-07-01 1979-02-09 Western Electric Co Method of restreaming solder on coated flexible circuit and device therefor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5418070A (en) * 1977-07-01 1979-02-09 Western Electric Co Method of restreaming solder on coated flexible circuit and device therefor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01278097A (ja) * 1988-04-28 1989-11-08 Taiyo Yuden Co Ltd チップ状回路部品配置装置
JPH01278100A (ja) * 1988-04-28 1989-11-08 Taiyo Yuden Co Ltd チップ状回路部品マウント装置
US11453576B2 (en) 2017-12-13 2022-09-27 Enabl A/S System, device and method for lifting and controlling the horizontal orientation and/or position of components

Also Published As

Publication number Publication date
JPH0123959B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-05-09

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