JPS58195435U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58195435U
JPS58195435U JP9156082U JP9156082U JPS58195435U JP S58195435 U JPS58195435 U JP S58195435U JP 9156082 U JP9156082 U JP 9156082U JP 9156082 U JP9156082 U JP 9156082U JP S58195435 U JPS58195435 U JP S58195435U
Authority
JP
Japan
Prior art keywords
section
semiconductor chip
solder
semiconductor equipment
chip bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9156082U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0222989Y2 (cs
Inventor
田畑　東三郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindengen Electric Manufacturing Co Ltd
Original Assignee
Shindengen Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindengen Electric Manufacturing Co Ltd filed Critical Shindengen Electric Manufacturing Co Ltd
Priority to JP9156082U priority Critical patent/JPS58195435U/ja
Publication of JPS58195435U publication Critical patent/JPS58195435U/ja
Application granted granted Critical
Publication of JPH0222989Y2 publication Critical patent/JPH0222989Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP9156082U 1982-06-21 1982-06-21 半導体装置 Granted JPS58195435U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9156082U JPS58195435U (ja) 1982-06-21 1982-06-21 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9156082U JPS58195435U (ja) 1982-06-21 1982-06-21 半導体装置

Publications (2)

Publication Number Publication Date
JPS58195435U true JPS58195435U (ja) 1983-12-26
JPH0222989Y2 JPH0222989Y2 (cs) 1990-06-21

Family

ID=30221567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9156082U Granted JPS58195435U (ja) 1982-06-21 1982-06-21 半導体装置

Country Status (1)

Country Link
JP (1) JPS58195435U (cs)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS548462A (en) * 1977-06-21 1979-01-22 Nec Home Electronics Ltd Manufacture for semiconductor
JPS5517488A (en) * 1978-07-25 1980-02-06 Sharp Corp Electronic watch having another clock function
JPS5753948A (ja) * 1980-09-17 1982-03-31 Toshiba Corp Handotaisoshinomauntohoho

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS548462A (en) * 1977-06-21 1979-01-22 Nec Home Electronics Ltd Manufacture for semiconductor
JPS5517488A (en) * 1978-07-25 1980-02-06 Sharp Corp Electronic watch having another clock function
JPS5753948A (ja) * 1980-09-17 1982-03-31 Toshiba Corp Handotaisoshinomauntohoho

Also Published As

Publication number Publication date
JPH0222989Y2 (cs) 1990-06-21

Similar Documents

Publication Publication Date Title
JPS60116239U (ja) パワ−ｍｏｓｆｅｔの実装構造
JPS58195435U (ja) 半導体装置
JPS6237939U (cs)
JPS5889946U (ja) 半導体装置
JPS58159741U (ja) 半導体装置
JPS628641U (cs)
JPS60101743U (ja) 半導体装置
JPS60163738U (ja) 半導体装置
JPS61134039U (cs)
JPS60163740U (ja) 半導体装置
JPS6130252U (ja) 半導体装置
JPS60174244U (ja) 混成集積回路
JPS60176551U (ja) 半導体装置
JPS58168135U (ja) 半導体装置
JPS6153934U (cs)
JPS60129141U (ja) 半導体装置
JPS58147278U (ja) 混成集積回路装置
JPS5981044U (ja) 半導体装置
JPS60163739U (ja) 半導体装置
JPS5883148U (ja) 半導体装置
JPS6066040U (ja) ヒ−トシンク
JPS587338U (ja) 半導体装置用グランドチツプ
JPS60103860U (ja) 半導体レ−ザ装置
JPS5837152U (ja) 半導体装置
JPS62107445U (cs)