JPS58191650U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58191650U
JPS58191650U JP6657282U JP6657282U JPS58191650U JP S58191650 U JPS58191650 U JP S58191650U JP 6657282 U JP6657282 U JP 6657282U JP 6657282 U JP6657282 U JP 6657282U JP S58191650 U JPS58191650 U JP S58191650U
Authority
JP
Japan
Prior art keywords
outer diameter
flange
semiconductor chip
semiconductor equipment
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6657282U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6334279Y2 (enrdf_load_stackoverflow
Inventor
佐藤　孝太郎
仙田　孝雄
小出　剛史
笹岡　誠一
Original Assignee
日本インター株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本インター株式会社 filed Critical 日本インター株式会社
Priority to JP6657282U priority Critical patent/JPS58191650U/ja
Publication of JPS58191650U publication Critical patent/JPS58191650U/ja
Application granted granted Critical
Publication of JPS6334279Y2 publication Critical patent/JPS6334279Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP6657282U 1982-05-10 1982-05-10 半導体装置 Granted JPS58191650U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6657282U JPS58191650U (ja) 1982-05-10 1982-05-10 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6657282U JPS58191650U (ja) 1982-05-10 1982-05-10 半導体装置

Publications (2)

Publication Number Publication Date
JPS58191650U true JPS58191650U (ja) 1983-12-20
JPS6334279Y2 JPS6334279Y2 (enrdf_load_stackoverflow) 1988-09-12

Family

ID=30076437

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6657282U Granted JPS58191650U (ja) 1982-05-10 1982-05-10 半導体装置

Country Status (1)

Country Link
JP (1) JPS58191650U (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS6334279Y2 (enrdf_load_stackoverflow) 1988-09-12

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