JPS58190047A - 樹脂モ−ルド型電子部品の製造方法 - Google Patents

樹脂モ−ルド型電子部品の製造方法

Info

Publication number
JPS58190047A
JPS58190047A JP57073550A JP7355082A JPS58190047A JP S58190047 A JPS58190047 A JP S58190047A JP 57073550 A JP57073550 A JP 57073550A JP 7355082 A JP7355082 A JP 7355082A JP S58190047 A JPS58190047 A JP S58190047A
Authority
JP
Japan
Prior art keywords
jig
resin
electrode
electronic parts
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57073550A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0230578B2 (enExample
Inventor
Toshiaki Moriyama
敏明 森山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP57073550A priority Critical patent/JPS58190047A/ja
Publication of JPS58190047A publication Critical patent/JPS58190047A/ja
Publication of JPH0230578B2 publication Critical patent/JPH0230578B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP57073550A 1982-04-30 1982-04-30 樹脂モ−ルド型電子部品の製造方法 Granted JPS58190047A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57073550A JPS58190047A (ja) 1982-04-30 1982-04-30 樹脂モ−ルド型電子部品の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57073550A JPS58190047A (ja) 1982-04-30 1982-04-30 樹脂モ−ルド型電子部品の製造方法

Publications (2)

Publication Number Publication Date
JPS58190047A true JPS58190047A (ja) 1983-11-05
JPH0230578B2 JPH0230578B2 (enExample) 1990-07-06

Family

ID=13521451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57073550A Granted JPS58190047A (ja) 1982-04-30 1982-04-30 樹脂モ−ルド型電子部品の製造方法

Country Status (1)

Country Link
JP (1) JPS58190047A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5049526A (en) * 1989-06-07 1991-09-17 Motorola, Inc. Method for fabricating semiconductor device including package

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0545333U (ja) * 1991-11-21 1993-06-18 エヌオーケー株式会社 オイルシール

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5049526A (en) * 1989-06-07 1991-09-17 Motorola, Inc. Method for fabricating semiconductor device including package

Also Published As

Publication number Publication date
JPH0230578B2 (enExample) 1990-07-06

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