JPS5818997A - Method of producing hybrid integrated circuit substrate - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] The present invention relates to a method of manufacturing a substrate for a hybrid integrated circuit.

Conventionally, as substrates for hybrid integrated circuits (HrC), Cera i,
A conductor is used by printing MugPd-based conductor yeast on a substrate and firing it at a high temperature of 700 to 800°C. Further, if necessary, resistors are also printed and fired using RuO2 paste. Therefore, if the semiconductor element to be mounted on the substrate is a power element with large heat loss, it is necessary to have a structure with excellent heat dissipation. This rounding usually consists of a Δwar element 1, a resistor 2, a conductor layer 1, as shown in FIG.
A metal heat dissipating plate 6 is attached to the back surface of the substrate 4 on which the heat dissipation plate 4 is formed, with an adhesive resin layer 5 interposed therebetween. However, such a hybrid integrated circuit! In this case, sufficient surface heat dissipation effect cannot be obtained, and furthermore, it is difficult to form a conductive layer or to
Due to the use of precious metals such as Pd and the preparation of the ceramic substrate 4 and metal heat sink 6 separately, the number of Kl1 items is large.
There was a problem of high manufacturing costs.

In order to solve this problem, as shown in Fig. 2, for example, a 100 to 500 μm thick ceramic layer 9 was directly formed on the metal heat sink I by thermal spraying to improve the heat dissipation effect. A hybrid integrated circuit substrate 10 is manufactured.

The smaller the value, the better the heat conduction. For example, the ceramic construction base 4 of the hybrid integrated circuit board shown in FIG. 1 is Aj, 0. The thickness was 0.63 m, and the adhesive resin layer was 5/3? The Rth calculated when the resin is used and the thickness is set to 0.020 is as follows.

Furthermore, Rth when the ceramic layer 9 of the hybrid integrated circuit board shown in FIG. 2 is formed of Aj, O, with a thickness of 0.1
The calculation is as follows.

That is, the hybrid integrated circuit board shown in FIG.

It can be seen that the thermal resistance of the substrate is 5/100 K compared to that of the hybrid integrated circuit board shown in FIG.

Kokote, hl, O, (D thermal conductivity is 0.26 aW/y
The thermal conductivity of Mlc, x/A & C resin is 0.00
It is 35W/m°C. In addition, in the formula, Q is the amount of heat transferred,
K is the thermal conductivity, A is the area of the part where heat moves, ΔX is the thickness of the material, and 7th is the temperature difference at both ends of the thickness.

Because of this heat dissipation effect, the hybrid integrated circuit board-L! As a method of forming a conductor layer on ■Resin paste OCm A
There are two methods: (1) electroless plating of Cm, Ni, etc., and (2) thermal spraying of Cm, Ni. ■Resin paste C1 (-st) can be baked in air at a relatively low temperature of 11J (120~ISO℃) and can be soldered, reducing manufacturing costs, but has the disadvantage of being weak against mechanical shock. There is a method using electroless plating (■), which increases the manufacturing cost.
Since there are holes in the form of connected pores in the 9-layer Z layer formed by thermal spraying, the 9-layer layer is formed by thermal spraying. ! Long-term practical test, for example, 60℃, 90%-
When heat is dissipated into humidity, the insulation resistance becomes extremely low. Therefore, it cannot be used in this state and must be completely hermetically sealed. This would not only make airtightness difficult, but also increase production costs.

The present invention has been made in view of the above points, and provides a method for manufacturing a substrate for a hybrid integrated circuit, which improves heat dissipation characteristics and makes it possible to easily manufacture a highly reliable hybrid integrated circuit at a low manufacturing cost. This is what I found.

The method of the present invention will be explained below.

In the method of the present invention, first, as shown in FIGS.
1 is formed by thermal spraying with a thickness of 100 to 500μ. Next, a thermosetting resin layer 22 is formed to fill the defective portions of the surface area of the ceramic layer 21. Next, this is placed in an atmosphere made of an organic solvent such as trichlene suitable for the material of the thermosetting resin layer 22, and the surface area of the thermosetting resin layer 220 is removed to a predetermined depth. (See figure (B)) Here, as the thermosetting resin for forming the thermosetting resin layer 22, a resin with low curing temperature, short curing time, and low viscosity and good workability is used. Examples of products that meet this condition include epoxy resins, acrylic resins, polyurethane resins, diallyl phthalate resins, thermosetting fs urethane resins, silicone resins, and monomers. .

Next, heat treatment is performed at a predetermined temperature to form the thermosetting resin layer 22'.
After curing, a resist film 23 having a predetermined pattern is printed on the surface of the thermosetting resin layer 22', as shown in FIG.

Next, as shown in )K in the same figure, a conductive layer forming member 14 is deposited on the exposed surface of the thermosetting resin layer 12' partitioned by the resist film 21, and is coated with a cinder solution in a predetermined manner as shown in the figure @. , the resist film 21 is removed to form a conductor layer 2j in a predetermined pattern.
get.

#') #! cAs shown, /example power element s
r, a resistor 21, etc. are formed to obtain a hybrid integrated circuit 2#.

In the hybrid integrated circuit 2# manufactured in this way, the hybrid integrated circuit board 26 is formed on the thin ceramic layer 11 formed on the metal substrate zo, and on the surface area of this ceramic layer 21. Since it is composed of a thin thermosetting resin layer jj', it has extremely high heat dissipation characteristics, and as a result, it has high reliability. Further, since the conductor layer 15 on the thermosetting resin layer 22' can be easily formed with a predetermined thickness and strong adhesive strength, the manufacturing process can be simplified and manufacturing costs can be reduced.

The ceramic layer 2 may be formed of a material containing at least one of magnesia, beryllia, aluminum nitride, and aluminum nitride in addition to Aj and O.

Next, an example of the method of the present invention will be described.

As shown in FIG. 3(G), the surface of a metal substrate 20 made of pure aluminum having a thickness of 2 cm is roughened by spraying coarse powder of Al, O, to a depth of 20 to 30 degrees. 1 to this
Particle size lO~40 by 11Cf plasma spraying within 2 hours
μ's 1,0. The powder is deposited to a thickness of 100 to 150 microns to form the warping electrical layer 21. Next, place this on a 60℃ hot plate and heat it. A thermosetting resin layer j2 made of polyurethane resin is formed on the surface of the layer 21.Next, after being left for 3 minutes, it is exposed to triclene vapor to remove the polyurethane resin remaining on the surface. (See side of the figure) Thereafter, this was left in an atmosphere at 160° C. for 1 hour to harden the thermosetting resin layer 21. Next, as shown in FIG. 4(e)K, a predetermined pattern of res)l[j J is formed on the surface of the thermosetting resin layer 210 in an atmosphere at 120° C. and dried for 10 minutes. Next, as shown in the same figure @, IIs~40
The thermosetting resin layer 2 is coated with a conductor layer forming member 24 made of C11 powder with a particle size of μ by thermal spraying and covered with a resist film 23.
A thickness of 30 to 50 layers is deposited on the surface of 1. Next, the same figure (6
), the resist film 23 was removed using a trichloride solvent to obtain a hybrid integrated circuit substrate 26 on which a conductor layer 25 with a predetermined number of turns was formed.

After that, Ushida cream is selectively printed on the surface of the conductor layer 250, and the power element 21, resistor 21, etc. are placed on the surface of the conductor layer 250, and
After preheating at 0°C for 1 second, the solder was melted at 230°C for 15 seconds to obtain a hybrid integrated circuit 2# as shown in FIG.

By applying pressure in this way, the hybrid integrated circuit board 2d was manufactured through a simple manufacturing process and at low cost, and a hybrid integrated circuit with high thermal conductivity, heat resistance, and reliability could be easily manufactured.

As explained above, according to the method for manufacturing a hybrid integrated circuit board according to the present invention, it is possible to easily manufacture a highly reliable hybrid integrated circuit at a low manufacturing cost by improving heat dissipation characteristics. A substrate for an integrated circuit can be provided.

[Brief explanation of the drawing]

FIG. 1 is a front view showing the configuration of a conventional hybrid integrated circuit, FIG. 2 is a front view of a conventional hybrid integrated circuit board, and FIG.
4) to (G) are explanatory diagrams showing step 1 [K] of the method for manufacturing a hybrid integrated circuit board according to the present invention. 20... Metal substrate, 21... Serafy layer, 22°22'... Thermosetting resin layer, 21... Resist film,
24... Conductive layer forming member, 26... Conductive layer, 26.
...Mixed integrated circuit board, IF...14 power elements, 2
8...Resistor, 2g--hybrid integrated circuit.

Claims (1)

[Claims] After forming a ceramic layer on the surface of a metal substrate, the ceramic layer is impregnated with a crystal hardening resin layer, and then the surface layer of the thermosetting resin layer is removed with an organic solvent, and then 1. 1. A method for manufacturing a hybrid integrated circuit board, which comprises forming a conductor layer with a predetermined number of four turns on a thermosetting resin layer.