JPH02153589A - Printed wiring board provided with thick film element - Google Patents
Printed wiring board provided with thick film elementInfo
- Publication number
- JPH02153589A JPH02153589A JP30851488A JP30851488A JPH02153589A JP H02153589 A JPH02153589 A JP H02153589A JP 30851488 A JP30851488 A JP 30851488A JP 30851488 A JP30851488 A JP 30851488A JP H02153589 A JPH02153589 A JP H02153589A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- thick film
- printed wiring
- resin
- conductor circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 claims abstract description 23
- 239000002184 metal Substances 0.000 claims abstract description 23
- 239000011347 resin Substances 0.000 claims abstract description 17
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 239000004020 conductor Substances 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 14
- 239000000919 ceramic Substances 0.000 claims abstract description 12
- 239000002131 composite material Substances 0.000 claims abstract description 7
- 239000003990 capacitor Substances 0.000 claims description 5
- 238000013461 design Methods 0.000 abstract description 2
- 239000011888 foil Substances 0.000 description 18
- 238000007639 printing Methods 0.000 description 12
- 239000012790 adhesive layer Substances 0.000 description 10
- 239000010410 layer Substances 0.000 description 8
- 238000010304 firing Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- -1 LaBt- Chemical compound 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、印刷等による厚膜素子付プリント配線板に関
するものである。この種のプリント配線板は、車載用、
コンピューター用、通信機器用あるいはＯＡａ器用混成
回路等エレクトロニクス産業の広範な分野において利用
されているものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a printed wiring board with thick film elements formed by printing or the like. This type of printed wiring board is for automotive use,
It is used in a wide range of fields in the electronics industry, such as hybrid circuits for computers, communication equipment, and OA equipment.
（従来の技術）
抵抗体あるいはコンデンサ等の厚膜素子を有するプリン
ト配線板は、素子の小型化、基板の限られたエリアの有
効利用化、および妻子と導体回路との電気的接続の容易
さ等数々の利点を有していることから多くの分野にてさ
かんに利用されている。(Prior art) Printed wiring boards with thick film elements such as resistors or capacitors are capable of miniaturizing the elements, making effective use of the limited area of the board, and facilitating electrical connections between wives and conductor circuits. It is widely used in many fields due to its many advantages.
この様な厚膜素子を有するプリント配線板の一般的な製
造方法は、第３図に示すように、あらかじめ絶縁層上に
形成された導体回路の所定位置に印刷ペーストをスクリ
ーン印刷法により塗布し、約９００°Ｃの温度にて焼成
して印刷素子を形成するものである。As shown in Figure 3, the general manufacturing method for printed wiring boards having such thick-film elements is to apply a printing paste to predetermined positions of a conductor circuit previously formed on an insulating layer using a screen printing method. , and is fired at a temperature of about 900° C. to form a printing element.
しかしながら、この製造方法においては、ベース材料や
絶縁層材料は前述した焼成温度に耐え得るものでなけれ
ばならないため、両材料ともにセラミックスを用いらざ
るを得なかった。このため、樹脂材料に比べて材料コス
トか高い、加工方法が複雑、電気特性か悪いあるいは高
密度配線化か難しい等の欠点を容認しなければならなか
った。また１例えば特開昭５９−１３８３０４号公報に
開示されているカーボンレジン系印刷ペーストを用いれ
ば、耐熱性の低い樹脂材料上に印刷素子を形成すること
が可能となる。しかしながら。However, in this manufacturing method, the base material and the insulating layer material must be able to withstand the above-mentioned firing temperature, so it is necessary to use ceramics for both materials. Therefore, compared to resin materials, they had to accept disadvantages such as higher material costs, complicated processing methods, poor electrical properties, and difficulty in high-density wiring. Furthermore, by using a carbon resin printing paste disclosed in, for example, Japanese Unexamined Patent Publication No. 59-138304, it becomes possible to form printing elements on a resin material with low heat resistance. however.
高温焼成型印刷ペーストのベース材料がセラミックスに
対し、前記カーボンレジン系印刷ペーストのベース材料
が樹脂であるため耐湿信頼性が低くＴＣＲの値が大きい
こと、線膨張係数か大きくなるため熱に対してドリフト
か大きくなること、放熱性が低下するため定格電力が小
さいこと、および外部からの衝撃に弱い等の欠点を有し
ていた。The base material of the high-temperature firing type printing paste is ceramic, whereas the base material of the carbon resin printing paste is resin, which has low moisture resistance reliability, a large TCR value, and a high coefficient of linear expansion, making it difficult to resist heat. It has disadvantages such as large drift, low rated power due to poor heat dissipation, and vulnerability to external shocks.
一方、導体回路と絶縁層間に素子を埋設する技術として
は、例えば特公昭５６−１１２０４号公報に開示された
ような製造方法が既に発明されている。かかる製造方法
は「厚さ２重−以下のＡｎ板の片側に熱硬化性樹脂接−
Ｒ層を形成し、前記接着層にに金属箔を重ね加熱加圧し
て１体化した後、前記金属箔を写真印刷あるいはスクリ
ーン印刷−エツチングの常法で所定の金属箔抵抗回路と
してアルミニウム板を基体とする金属箔抵抗回路板を得
、前記金属箔抵抗回路板の金属箔抵抗回路のない側に暖
機性を有するクツション材を重ねこれを当板にはさみ加
熱加圧して前記金属箔抵抗回路を前記熱硬化性接着層中
に沈入せしめた後、前記クツション材を除去する１程か
らなることを特徴とするアルミニウム板を基体とする平
面化金属箔抵抗回路板の製造方法１である。On the other hand, as a technique for embedding an element between a conductive circuit and an insulating layer, a manufacturing method such as that disclosed in Japanese Patent Publication No. 11204/1983 has already been invented. This manufacturing method involves bonding thermosetting resin to one side of an An plate with a thickness of 2 or less.
After forming the R layer and stacking the metal foil on the adhesive layer and integrating it by heating and pressing, the metal foil is printed on an aluminum plate as a predetermined metal foil resistance circuit by photo printing or screen printing-etching. A metal foil resistance circuit board is obtained as a base, and a cushioning material having warming properties is layered on the side of the metal foil resistance circuit board where there is no metal foil resistance circuit, and this is sandwiched between the backing plates and heated and pressurized to form the metal foil resistance circuit. 1 is a method for producing a planarized metal foil resistor circuit board having an aluminum plate as a substrate, the method comprising the step of depositing the cushioning material into the thermosetting adhesive layer and then removing the cushioning material.
この発明によれば従来の方法では難しかったコンパクト
な構造の基板を得ることが可能となる。According to the present invention, it is possible to obtain a substrate with a compact structure, which was difficult to achieve using conventional methods.
しかしながら、金属箔抵抗体は一般に高抵抗値を取り得
ることが難しくデジタル回路におけるプルアップ用高抵
抗には不向きである。また、導体金属材料と金属箔抵抗
材料の異種金属か存在するために熱が付加されると熱起
電力を生じアナログ開路においてオフセットのズレを招
く恐れが充分に考えられる。加えて、この従来の方法に
あっては、金属箔抵抗回路のない側が最終的に突出する
ため完全に平坦な基板を得るのか難しく、コストも高い
ものであった。However, it is generally difficult for metal foil resistors to have a high resistance value, making them unsuitable for high resistance pull-ups in digital circuits. Further, since there are dissimilar metals, ie, the conductor metal material and the metal foil resistance material, it is quite conceivable that when heat is applied, thermoelectromotive force is generated, causing an offset shift in the analog open circuit. In addition, in this conventional method, the side without the metal foil resistor circuit eventually protrudes, making it difficult to obtain a completely flat substrate and resulting in high costs.
（発明が解決しようとする課題）
本発明は１以上のような実状に鑑みてなされたものであ
り、その解決しようとする課題は、前述した従来技術の
不完全性を解消することであり、その目的とするところ
は高精゛度で高信頼性を有する厚ｍｌ子を内蔵した、コ
ンパクトなブ′リント配線板を提供することにある。(Problems to be Solved by the Invention) The present invention has been made in view of one or more actual situations, and the problem to be solved is to eliminate the incompleteness of the prior art described above. The purpose is to provide a compact printed circuit board with a built-in thick ml element having high precision and high reliability.
（課題を解決するための手段）
以上の問題点を解決するために本発明が採った手段は、
後述の実施例に対応する第１図および第２図を参照して
説明すると、
「金属、セラミックス、樹脂あるいはそれらの複合材料
からなるベース材料（１１）上にセラミックス、樹脂あ
るいはそれらの複合材料より構成された接着層（１２）
を有し、この接着層（１２）上に導体回路（１３）が形
成されたプリント配線板であって。(Means for Solving the Problems) The means taken by the present invention to solve the above problems are as follows:
Referring to FIG. 1 and FIG. 2, which correspond to the embodiments described below, it is explained that ``a base material (11) made of metal, ceramic, resin, or a composite material thereof is coated with ceramics, resin, or a composite material thereof. Structured adhesive layer (12)
A printed wiring board having a conductive circuit (13) formed on the adhesive layer (12).
前記導体回路（１：ｌ）と前記接着層（１２）との間厚
膜法で形成された抵抗素子あるいはコンデンサ素子を埋
め込んだことを特徴とする厚膜素子付プリント配線板。A printed wiring board with a thick film element, characterized in that a resistor element or a capacitor element formed by a thick film method is embedded between the conductor circuit (1:l) and the adhesive layer (12).
」
すなわち、本発明に係るプリント配線板（１０）は印刷
法やデイスペンサー法等による厚膜素子を有するものて
あワ、しかもこの素子（１４）がセラミックス基材に使
用されている高精度の高温焼成型素子であるため、カー
ボンレジン系印刷素子と比べて￥１性が高く、また絶縁
層内に埋設されているためコンパクトな設計が可能とな
るばかりか１機械的な強度も充分に向りする構造となる
。” That is, the printed wiring board (10) according to the present invention has a thick film element formed by a printing method, a dispenser method, etc., and this element (14) is a high-precision film element used for a ceramic base material. Because it is a high-temperature fired element, it is more cost-effective than carbon resin printed elements, and because it is embedded within an insulating layer, it not only allows for a compact design, but also has sufficient mechanical strength. It has a structure that allows for
もちろん、このようなプリント配線板は、スルーホール
により表裏を導通させることにより、所謂両面プリント
配線板として実施することも可能であり、さらに、複数
積層することによって所謂多層プリント配線板として実
施することも可能である。Of course, such a printed wiring board can be implemented as a so-called double-sided printed wiring board by making the front and back sides conductive through through holes, and can also be implemented as a so-called multilayer printed wiring board by laminating multiple layers. is also possible.
以下に１本発明について、さらに詳細に説明する。One aspect of the present invention will be explained in more detail below.
本発明に使用される高温焼成型厚膜ペーストとしては、
Ｒｕ Ｏ２、Ｌ ａ Ｂ ｔ−、Ｓ ｎ Ｏ２あるいは
ＴａＮ等の抵抗用ペーストおよびチタン酸バリウムある
いは酸化チタン等のコンデンサ用ペーストか可能である
。特に、金属箔−にに塗布し高温焼成することを考慮す
ると、金属酸化を防ぐためにチッソあるいはチッソ十水
素中にて焼成することが好ましく、ＬａＢ、系、５ｎＯ
ｚ系あるいはＴａＮ系を使用するのか９ましい９次に、
被塗布物の金属箔としてはＣｕ、Ａ文、Ｎｉ、Ｆｅ、あ
るいはそれらの合金等が使用でき、後工程における作業
性を考えるとＣｕの使用が１ましい。また、前記金属箔
の厚みは、塗布時の作業性と後工程の加り性を考えると
、０．Ｏ１〜Ｏ，１ｍｍの範囲内で選択されることが望
ましい。The high temperature firing type thick film paste used in the present invention includes:
Resistor pastes such as RuO2, LaBt-, SnO2 or TaN, and capacitor pastes such as barium titanate or titanium oxide are possible. In particular, considering that it is coated on metal foil and fired at a high temperature, it is preferable to perform the firing in nitrogen or nitrogen decahydride to prevent metal oxidation.
Is it 9th order to use z system or TaN system?
As the metal foil for the object to be coated, Cu, A-type, Ni, Fe, or alloys thereof can be used, and Cu is preferably used in view of workability in subsequent steps. Further, the thickness of the metal foil should be 0.000000000000000000000000000000000000,000. It is desirable to select within the range of O1 to O.1 mm.
ベース材料（１１）としては、Ａ ｌ 、Ｃｕ ＊ Ｎ
ｘ ＋Ｆｅあるいはそれらの合金またはＣｕ−１ｎ−
Ｃｕのようなりラウド材等の金属材料、アルミナ、Ａ、
ＩＮ、ＳｉＣあるいはＢｅＯ等のセラミックス材料およ
びエポキシ樹脂、ポリイミド樹脂、フェノール樹脂等の
樹脂材料が使用可能である。As the base material (11), Al, Cu*N
x +Fe or alloy thereof or Cu-1n-
Metal materials such as Cu and loud materials, alumina, A,
Ceramic materials such as IN, SiC, or BeO, and resin materials such as epoxy resin, polyimide resin, and phenol resin can be used.
各々のベース材料（１１）は放熱性が必要であれば金属
材料、耐熱性であればセラミック材料というように要求
される特性や用途によって使い分けることかできる。Each base material (11) can be selectively used depending on the required characteristics and purpose, such as a metal material if heat dissipation is required, and a ceramic material if heat resistance is required.
次に、接着！（１２）に用いられる接着材としては素子
（１４）が印刷された金属箔とベース材料（１１）とを
接着する一方、電気絶縁性を有しているものであること
が必要である。このような特性を満足する材料として最
も代表的なものにガラスエポキシがあり、その他ガラス
トリアジン、ガラスポリイミド等の樹脂系接着剤、ある
いはセラミック系接着剤が使用される。また、この接着
層（１２）の厚みは０．０５〜０．２ｍ−の間が望まし
い、当然ながら、この場合にあっても、使用される接着
剤は寸法、安定性、熱伝動率、比重、ｍ械的強度、コス
ト等の諸特性を総合的に考慮する必要かある。Next, glue! The adhesive used in (12) needs to be one that bonds the metal foil on which the element (14) is printed and the base material (11) and has electrical insulation properties. Glass epoxy is the most typical material that satisfies these characteristics, and resin adhesives such as glass triazine and glass polyimide, or ceramic adhesives are also used. In addition, the thickness of this adhesive layer (12) is preferably between 0.05 and 0.2 m. Naturally, even in this case, the adhesive used should be determined based on dimensions, stability, thermal conductivity, specific gravity, etc. , mechanical strength, cost, and other characteristics need to be comprehensively considered.
（発明の作用）
以上の様に構成した本発明に係るプリント配線板（１０
）においては、高温焼成型の厚膜素子（１４）を用いて
いるため抵抗値の範囲が低抵抗から高抵抗まで適時選択
でき、アナグロおよびデジタル回路の素子（１４）とし
て充分使用でき、しかも高精度な抵抗か得られる。さら
に、素子の電極となる金属箔上で厚膜ペーストを直接高
温焼成するため、電極と素子本体との接合は熱的にも電
気的にもさらに機械的にも安定したものとすることがで
きる。(Operation of the invention) The printed wiring board (10
) uses a high-temperature firing type thick film element (14), so the resistance value range can be selected from low resistance to high resistance at any time, and it can be fully used as an element (14) for analog and digital circuits. Accurate resistance can be obtained. Furthermore, because the thick film paste is fired at high temperature directly on the metal foil that will serve as the device's electrodes, the bond between the electrodes and the device body can be made thermally, electrically, and mechanically stable. .
特に、銅張積層板に使用される銅箔の裏面の如きアンカ
ー形状かある金属箔を使用することはＬ記接合の安定性
からも有効である。また、導体回路（１３）は金Ｉｉｇ
箔にて形成されているので電気特性も優れている。さら
に、前記厚膜素子（１４）は接着層（１２）内に埋設さ
れているため５このプリント配線板（１０）の表面は導
体回路（１３）の段部以外はモ面となっていて、前記プ
リント配線板（１０）ヒに電子部品を実装する際邪魔に
なるものか存在しないことより電子部品の高密度実装が
可能となる。In particular, it is effective to use a metal foil with an anchor shape, such as the back side of the copper foil used in copper-clad laminates, from the viewpoint of stability of the L-joint. Moreover, the conductor circuit (13) is made of gold Iig.
Since it is made of foil, it has excellent electrical properties. Furthermore, since the thick film element (14) is embedded in the adhesive layer (12), the surface of the printed wiring board (10) is flat except for the stepped portion of the conductor circuit (13). Since there is no obstacle to mounting electronic components on the printed wiring board (10), high-density mounting of electronic components is possible.
（実施例） 以下に、本発明の実施例を図に従って説１１５１する。(Example) Embodiments of the present invention will be explained below with reference to the drawings.
第１図に示す印刷素子（１４）を有するプリント配線板
（ｌＯ）は以下のよう装作した。A printed wiring board (10) having a printing element (14) shown in FIG. 1 was prepared as follows.
まず、１００Ω、ｌＯにΩ及び１００ＫΩの抵抗ペース
ト（ＤＵＰＯＮＴ社製、商品名ＱＰ−６０）を、各々厚
さ７０ＩＬｍの銅箔ヒにスクリーン印刷法により印刷後
、焼成温度が９００°Ｃで、焼成時間ｌＯ分、チッソ（
Ｎ２）雰囲気中にて焼成した０次に、厚さ１１００ｙＬ
のガラスエポキシ接着シート（所謂プリプレグといわれ
るもので、接着層（１２）に相当）を介して印刷素子（
１４）か接着層（１２）内に埋設するように、厚み１．
０＋−のアルミ板に積層接着して銅張積層板を得た０次
に、前記銅張積層板に対して通常じサブトラクティブ法
で加工を施すことにより、所望の導体回路（Ｉ３）を得
た。First, resistive pastes of 100Ω, 1O, Ω and 100KΩ (manufactured by DUPONT, product name QP-60) were printed on copper foil with a thickness of 70ILm by screen printing, and then fired at a firing temperature of 900°C. Time 10 minutes, Chisso (
N2) Zero-order fired in an atmosphere, thickness 1100yL
The printing element (
14) or embedded in the adhesive layer (12) with a thickness of 1.
A copper-clad laminate is obtained by laminating and adhering to an aluminum plate of 0+-. Next, the desired conductor circuit (I3) is obtained by processing the copper-clad laminate using the same subtractive method as usual. Ta.
比較例 第３図示す比較例の装作を以下に説明する。Comparative example The arrangement of the comparative example shown in FIG. 3 will be explained below.
まず、ｉｏｏΩ、ＩＯＫ及び１００ＫΩの抵抗ペースト
（アサと化学製）をスクリーン印刷法によりプリント配
線板（１０）の所定の位置に印刷した後、硬化温度１７
０℃、硬化時間６０分の条件にて硬化させ、所望の抵抗
印刷体付プリント配線板を得た。First, after printing iooΩ, IOK, and 100KΩ resistance pastes (manufactured by Asato Kagaku) at predetermined positions on a printed wiring board (10) using a screen printing method, a curing temperature of 17
It was cured at 0° C. for 60 minutes to obtain a desired printed wiring board with printed resistor.
以上のようにして製作した本発明の実施例と比較例を次
に示す方法により評価しその結果を次の表に示す、この
場合、表中の「抵抗変化率」及びｒＴＣＲ値」は次の条
件によって求めた。The Examples and Comparative Examples of the present invention manufactured as described above were evaluated by the following method and the results are shown in the following table. In this case, the "resistance change rate" and rTCR value in the table are as follows. Determined based on conditions.
■抵抗変化率
環境温度１５ｏ″Ｃの条件下にて１ｏｏｏ時間放置した
後の抵抗値をＬＣＲメーターて測定し、初期抵抗値から
の変化量より抵抗変化率を算出した。■Resistance change rate The resistance value after being left for 100 hours at an environmental temperature of 15°C was measured using an LCR meter, and the resistance change rate was calculated from the amount of change from the initial resistance value.
■ＴＣＲ
室温より昇温を開始し、２０”Ｃごとに抵抗値をＬＣＲ
メーターにてＪｌｌｌ定した結果からこのＴＣＲ，すな
わち傾きを求めた。■TCR Start heating up from room temperature and change the resistance value every 20"C
The TCR, that is, the slope, was determined from the results determined by a meter.
（以下余白）
表
（発明の効果）
以上詳述した通り、本発明に係る厚膜素子付プリント配
線板においては、上記実施例にて例示した如く、
「金属、セラミックス、樹脂あるいはそれらの複合材料
からなるベース材料上にセラミックス、樹脂あるいはそ
れらの複合材料より構成された絶縁層を有し、この絶縁
層とに導体回路が形成されたプリント配線板であって。(The following is a blank space) Table (Effects of the Invention) As detailed above, in the printed wiring board with a thick film element according to the present invention, as exemplified in the above embodiment, “metals, ceramics, resins, or composite materials thereof” are used. The printed wiring board has an insulating layer made of ceramics, resin, or a composite material thereof on a base material made of , and a conductor circuit is formed on this insulating layer.
前記導体回路と前記絶縁層との間に厚膜法で形成された
抵抗素子あるいはコンデンサ素子を工〒め込んだこと１
にその構成ヒの特徴があり、これにより、高精度で高信
頼性を有する厚膜素子を内蔵した、コンパクトなプリン
ト配線板を提供することかできるのである。The feature of the structure is that a resistive element or a capacitor element formed by a thick film method is embedded between the conductor circuit and the insulating layer. Therefore, it is possible to provide a compact printed wiring board that incorporates a thick film element having the following characteristics.
すなわち、本発明に係る厚膜素子（１４）を有するプリ
ント配線板（１０）においては、厚膜素子（１４）が高
精度の高温焼成型のものであることにより、高精度で信
頼性が高いことは勿論のこと、選択可能な抵抗値範囲が
広く、あらゆる回路に適したものである。加えて、ベー
ス材料（１１）の種類を選択することによって、要求さ
れる特性を満足することができ、コストパフォーマンス
に優れたプリント配線板（１０）を提供することかでき
るのである。That is, in the printed wiring board (10) having the thick film element (14) according to the present invention, since the thick film element (14) is of a high-precision, high-temperature firing type, the printed wiring board (10) has high precision and high reliability. Of course, there is a wide range of selectable resistance values, making it suitable for all kinds of circuits. In addition, by selecting the type of base material (11), it is possible to satisfy the required characteristics and provide a printed wiring board (10) with excellent cost performance.
さらに、本発明によれば、厚Ｖ！素子（１４）か接着層
（１２）内に埋設されているため、プリント配線板（１
υ）の表面か平坦となり、厚ｆｇ素子（目）ｌ：にも電
子部品の実装か可濠であるから、本発明に係るプリント
配線板（１０）は高密度化にも適しているものである。Furthermore, according to the present invention, the thickness V! Since the element (14) is embedded in the adhesive layer (12), the printed wiring board (1
The printed wiring board (10) according to the present invention is suitable for high density because the surface of υ) is flat and the thickness fg element (eye) l: can also be mounted with electronic components. be.
第１図は本文明に係る厚膜素子付プリント配線板の斜視
図、第２図はその部分拡大断面図、第３図は従来技術を
示す部分拡大断面図である。
符 号 の 説 明
ｌＯ・・・プリント配線板、１１・・・ベース材料、１
２・・・接着層、１３・・・導体回路、！４−・・厚膜
素子、１５・・・樹脂基材。FIG. 1 is a perspective view of a printed wiring board with a thick film element according to the present invention, FIG. 2 is a partially enlarged sectional view thereof, and FIG. 3 is a partially enlarged sectional view showing the prior art. Explanation of symbols 1O...Printed wiring board, 11...Base material, 1
2...adhesive layer, 13...conductor circuit,! 4-... Thick film element, 15... Resin base material.
Claims (1)
からなるベース材料上にセラミックス、樹脂あるいはそ
れらの複合材料より構成された絶縁層を有し、この絶縁
層上に導体回路が形成されたプリント配線板であって、 前記導体回路と前記絶縁層との間に厚膜法で形成された
抵抗素子あるいはコンデンサ素子を埋め込んだことを特
徴とする厚膜素子付プリント配線板。[Claims] An insulating layer made of ceramics, resin, or a composite material thereof is provided on a base material made of metal, ceramics, resin, or a composite material thereof, and a conductive circuit is formed on this insulating layer. 1. A printed wiring board with a thick film element, characterized in that a resistive element or a capacitor element formed by a thick film method is embedded between the conductor circuit and the insulating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30851488A JPH02153589A (en) | 1988-12-05 | 1988-12-05 | Printed wiring board provided with thick film element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30851488A JPH02153589A (en) | 1988-12-05 | 1988-12-05 | Printed wiring board provided with thick film element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02153589A true JPH02153589A (en) | 1990-06-13 |
Family
ID=17981943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30851488A Pending JPH02153589A (en) | 1988-12-05 | 1988-12-05 | Printed wiring board provided with thick film element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02153589A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6317023B1 (en) | 1999-10-15 | 2001-11-13 | E. I. Du Pont De Nemours And Company | Method to embed passive components |
| US6860000B2 (en) | 2002-02-15 | 2005-03-01 | E.I. Du Pont De Nemours And Company | Method to embed thick film components |
| US6872893B2 (en) | 2001-06-05 | 2005-03-29 | Dai Nippon Printing Co., Ltd. | Wiring board provided with passive element and cone shaped bumps |
| US6897761B2 (en) | 2002-12-04 | 2005-05-24 | Cts Corporation | Ball grid array resistor network |
| US7072167B2 (en) | 2002-10-11 | 2006-07-04 | E. I. Du Pont De Nemours And Company | Co-fired ceramic capacitor and method for forming ceramic capacitors for use in printed wiring boards |
| US7100277B2 (en) | 2004-07-01 | 2006-09-05 | E. I. Du Pont De Nemours And Company | Methods of forming printed circuit boards having embedded thick film capacitors |
| US7178229B2 (en) | 2003-11-20 | 2007-02-20 | E. I. Du Pont De Nemours And Company | Method of making interlayer panels |
| US7342804B2 (en) | 2004-08-09 | 2008-03-11 | Cts Corporation | Ball grid array resistor capacitor network |
| US7531416B2 (en) | 2005-12-21 | 2009-05-12 | E. I. Du Pont De Nemours And Company | Thick film capacitors on ceramic interconnect substrates |
| US7688569B2 (en) | 2004-03-16 | 2010-03-30 | E. I. Du Pont De Nemours And Company | Thick-film dielectric and conductive compositions |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54111670A (en) * | 1978-02-22 | 1979-09-01 | Alps Electric Co Ltd | Circuit board and method of forming same |
| JPS5856387A (en) * | 1981-09-08 | 1983-04-04 | プレ−・エレクトロフアインニカニツシエ・ウエルケ・ヤコブ・プレ−・ナツハフオ−ゲル・ゲゼルシヤフト・ミト・ベシユレンクテル・ハフツング・ウント・コンパニ− | Method of producing printed circuit board |
-
1988
- 1988-12-05 JP JP30851488A patent/JPH02153589A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54111670A (en) * | 1978-02-22 | 1979-09-01 | Alps Electric Co Ltd | Circuit board and method of forming same |
| JPS5856387A (en) * | 1981-09-08 | 1983-04-04 | プレ−・エレクトロフアインニカニツシエ・ウエルケ・ヤコブ・プレ−・ナツハフオ−ゲル・ゲゼルシヤフト・ミト・ベシユレンクテル・ハフツング・ウント・コンパニ− | Method of producing printed circuit board |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6317023B1 (en) | 1999-10-15 | 2001-11-13 | E. I. Du Pont De Nemours And Company | Method to embed passive components |
| US7100276B2 (en) | 2001-06-05 | 2006-09-05 | Dai Nippon Printing Co., Ltd. | Method for fabricating wiring board provided with passive element |
| US6872893B2 (en) | 2001-06-05 | 2005-03-29 | Dai Nippon Printing Co., Ltd. | Wiring board provided with passive element and cone shaped bumps |
| US7679925B2 (en) | 2001-06-05 | 2010-03-16 | Dai Nippon Printing Co., Ltd. | Method for fabricating wiring board provided with passive element, and wiring board provided with passive element |
| US6860000B2 (en) | 2002-02-15 | 2005-03-01 | E.I. Du Pont De Nemours And Company | Method to embed thick film components |
| US7072167B2 (en) | 2002-10-11 | 2006-07-04 | E. I. Du Pont De Nemours And Company | Co-fired ceramic capacitor and method for forming ceramic capacitors for use in printed wiring boards |
| US6897761B2 (en) | 2002-12-04 | 2005-05-24 | Cts Corporation | Ball grid array resistor network |
| US7178229B2 (en) | 2003-11-20 | 2007-02-20 | E. I. Du Pont De Nemours And Company | Method of making interlayer panels |
| US7586198B2 (en) | 2003-11-20 | 2009-09-08 | E. I. Du Pont De Nemours And Company | Innerlayer panels and printed wiring boards with embedded fiducials |
| US7688569B2 (en) | 2004-03-16 | 2010-03-30 | E. I. Du Pont De Nemours And Company | Thick-film dielectric and conductive compositions |
| US7100277B2 (en) | 2004-07-01 | 2006-09-05 | E. I. Du Pont De Nemours And Company | Methods of forming printed circuit boards having embedded thick film capacitors |
| US7342804B2 (en) | 2004-08-09 | 2008-03-11 | Cts Corporation | Ball grid array resistor capacitor network |
| US7531416B2 (en) | 2005-12-21 | 2009-05-12 | E. I. Du Pont De Nemours And Company | Thick film capacitors on ceramic interconnect substrates |
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