JP2001077290A - Module for three-dimensional electronic part, three- dimensional electronic part module, and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a high-density three-dimensional electronic part module which is enhanced in density without deteriorating semiconductor parts in cooling efficiency by a method wherein the module is a solid structure provided with a flat outer surface as prescribed and equipped with electrodes formed on its flat outer surface and connected to a metal wiring patterned on a board. SOLUTION: A solid electronic part module 1 has such a structure where six glass ceramic boards 4 each provided with silver wirings 2 patterned on both their surfaces and through-holes 3 bored in them penetrating through the silver wirings 2 are laminated, and an uppermost glass board 4a and a lowermost glass board 4b where through-holes 3 are bored are each stacked up on the upper side and lower side of the above laminate for the formation of a rectangular parallelepiped as a whole. Therefore, the glass ceramic boards 4, 4a, and 4b are internally wired with silver wirings 2, the silver wirings 2 are connected through the through-holes 3, and furthermore semiconductor bare chips or the like are connected to outer electrodes 6, 7, and 8. Therefore, electronic parts can be enhanced in mounting density.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a module for three-dimensional electronic components, a three-dimensional electronic component module, and a method for manufacturing the same, and a high-density three-dimensional electronic component without impairing the cooling efficiency of semiconductor components. The present invention relates to a module for use, a three-dimensional electronic component module, and a method for manufacturing them.

[0002]

2. Description of the Related Art In recent years, in addition to passive components such as resistors and capacitors, small semiconductor packages, semiconductor bare chips, and FBGAs (fine pitch ba) have been formed on substrates such as printed laminates and ceramic laminates.
2. Description of the Related Art A surface mounting method has been put to practical use in which a small active component such as an ll grid array is mounted to increase the mounting density of components on a substrate and to reduce the size, weight, and thickness of an electronic device.

Further, in order to further increase the component mounting density, a three-dimensional electronic component module using a three-dimensional mounting method of three-dimensionally stacking semiconductor components has been developed.

The former is intended to reduce the size of each component, and the latter is to arrange components which cannot be arranged even by the surface mounting method, especially semiconductor components having a large component size in three dimensions, or In order to increase the mounting density, it is inserted into the substrate.

For example, Japanese Patent Application Laid-Open No. 9-232503 discloses a three-dimensional structure in which a pair of a semiconductor chip and a thin wiring film is used as a layer forming unit, and a plurality of layer forming units and a wiring board are sandwiched between thin adhesive films. By connecting the via holes formed in the wiring film and the via holes formed in the adhesive film, a three-dimensional laminated module in which the layer configuration units and the layer configuration units and the wiring board are connected to each other is connected. Has been disclosed.

[0006] Also, Japanese Patent Application Laid-Open No. H6-120671 discloses that
A multilayer wiring board is disclosed in which an IC chip or a chip component is embedded in a substrate, and the IC chip or the chip component is protected by a coat resin.

[0007]

As described above, as the mounting density of three-dimensional electronic component modules increases,
Without a good heat dissipation mechanism, the heat generated by the semiconductor component itself increases
There is a problem that semiconductor components are broken.

In order to cool the semiconductor component, it is necessary to increase the cooling area of the semiconductor component and efficiently release the heat to the outside, but the tertiary type disclosed in Japanese Patent Application Laid-Open No. 9-232503 is disclosed. In the original stacked module, since the semiconductor chips stacked vertically are close to each other, it is difficult for heat to be radiated to the outside, and the IC chip or chip component disclosed in Japanese Patent Application Laid-Open No. H6-120671 is used. In a buried multilayer wiring board, since the semiconductor component is covered with a resin having a low thermal conductivity, there is a problem that heat is confined inside the board and is hardly dissipated.

If a special heat radiating mechanism such as a heat radiating plate or a heat pipe is provided, it is possible to efficiently cool the semiconductor component module. This has hindered the densification of modules, and it has not been possible to solve the problem of heat generation of semiconductor components by such a method.

Accordingly, an object of the present invention is to provide a high-density module for a three-dimensional electronic component, a three-dimensional electronic component module, and a method for manufacturing the same, without impairing the cooling efficiency of the semiconductor component. .

[0011]

SUMMARY OF THE INVENTION The object of the present invention is as follows.
A three-dimensional structure having three or more flat outer surfaces formed by laminating a plurality of substrates on each of which a metal wiring is patterned and a plurality of via holes and / or through holes penetrating the metal wiring are formed. This is achieved by a three-dimensional electronic component module in which external electrodes connected to the metal wiring are formed on the outer surface.

According to the present invention, the three-dimensional electronic component module has a three-dimensional structure having three or more flat outer surfaces, and has three or more external electrodes connected to the metal wiring patterned on the substrate. Because it is formed on the flat outer surface of the semiconductor component, a semiconductor component can be connected to each outer surface to form a three-dimensional electronic component module. The semiconductor component is exposed on the surface, so that heat generated from the semiconductor component can be efficiently dissipated, and a high-density three-dimensional electronic component module that does not impair the cooling efficiency of the semiconductor component is provided. It becomes possible.

In a preferred embodiment of the present invention, the three-dimensional structure has a prismatic structure. According to a preferred embodiment of the present invention, it is possible to provide a module for a three-dimensional electronic component in which the cross-section is formed into a honeycomb structure or the like without significantly impairing the cooling efficiency of the semiconductor component, and the mounting density is significantly improved. Becomes

In a further preferred aspect of the present invention, the three-dimensional structure is a hexahedron.

[0015] In a further preferred aspect of the present invention, the three-dimensional structure is a rectangular parallelepiped. According to a further preferred embodiment of the present invention, since the semiconductor component can be connected to the six surfaces of the rectangular parallelepiped, it is possible to greatly increase the mounting density of the electronic component, and the semiconductor component that generates heat is: Since they are arranged 90 degrees apart from each other, mutual thermal interference due to heat generation can be suppressed,
Further, since the semiconductor component is mounted on each outer surface of the three-dimensional electronic component module, it is possible to efficiently radiate heat generated from the semiconductor component.

The object of the present invention is also to provide a semiconductor device comprising: a plurality of substrates on each of which a metal wiring is patterned and a plurality of via holes and / or through holes penetrating the metal wiring are formed; A semiconductor component was connected to the external electrode of the module for a three-dimensional electronic component in which a three-dimensional structure having a flat outer surface was formed, and on the outer surface, an external electrode connected to the metal wiring was formed. This is achieved by a three-dimensional electronic component module.

According to the present invention, since the three-dimensional electronic component module includes the semiconductor components connected to the external electrodes formed on three or more flat outer surfaces, the semiconductor components can be mounted at a high density. And a semiconductor component is exposed on the surface, so that heat generated from the semiconductor component can be efficiently radiated, and a high-density three-dimensional electronic component module that does not impair the cooling efficiency of the semiconductor component. Can be provided.

In a further preferred aspect of the present invention, the substrate is constituted by a glass-ceramic substrate. According to a further preferred embodiment of the present invention,
The glass-ceramic substrate has excellent flatness and a low coefficient of thermal expansion, so that stress can be reduced even when semiconductor components are mounted.

In a further preferred aspect of the present invention, the metal wiring is formed of a metal selected from the group consisting of silver-palladium and silver. In a further preferred embodiment of the present invention, the metal wiring,
It is formed by silver.

[0020] In a further preferred embodiment of the present invention, the metal terminal is formed of a metal selected from the group consisting of silver-palladium and silver. In a further preferred embodiment of the present invention, the metal terminal is:
It is formed by silver-palladium.

In a further preferred embodiment of the present invention, the via hole and / or the through hole is filled with a paste selected from the group consisting of a silver paste, a silver-palladium paste and a gold paste. In a further preferred embodiment of the present invention, the via holes and / or the through holes are filled with a silver paste.

In still another preferred embodiment of the present invention, the substrate comprises an organic substrate. According to a further preferred embodiment of the present invention, since the substrate is formed of an organic substrate, a module for a high-density three-dimensional electronic component and a three-dimensional electronic component at low cost without impairing the cooling efficiency of a semiconductor component Modules can be provided.

In a further preferred embodiment of the present invention, the organic substrate is a glass-based epoxy substrate, a glass-based bismaleimide triazine substrate, a glass-based polyimide substrate, a glass-based polyphenylene ether substrate, and a glass-based fluorine substrate. And a substrate selected from the group consisting of:

In a further preferred embodiment of the present invention, metal plating is applied to an inner surface of the via hole and / or the through hole, and a part of the via hole and / or the through hole is cut vertically to form the outer plate. The plurality of metal terminals are exposed on the surface.

In a further preferred embodiment of the present invention, the metal plating is formed by copper plating.

In a further preferred embodiment of the present invention, the copper plating is further plated with a metal selected from the group consisting of gold plating, silver plating, nickel plating and gold plating. According to a further preferred embodiment of the present invention, oxidation of the electrode can be prevented.

In a further preferred aspect of the present invention, the metal wiring is formed of a metal selected from copper, aluminum, silver, gold, platinum and palladium.

[0028] In a further preferred aspect of the present invention, the semiconductor component is connected to the plurality of metal terminals by solder.

In a further preferred embodiment of the present invention, the semiconductor component is formed by a eutectic cream solder.
It is connected to the plurality of metal terminals.

In a further preferred aspect of the present invention, the semiconductor component is constituted by a semiconductor component selected from the group consisting of a semiconductor bare chip, an FBGA, and a semiconductor substrate on which electronic components are mounted.

In a further preferred aspect of the present invention, a printed wiring board is connected to the external electrodes formed on at least one of the three or more flat outer surfaces.

The object of the present invention is also to form at least one through hole in each of the plurality of sheets, to form a metal pattern on both sides of the plurality of sheets,
At least one through hole is formed in each of the two sheets, and a metal pattern is formed on both sides of one surface of the two sheets, and the plurality of sheets and the two sheets are formed into one of the two sheets. Is located at the top, the surface on which the metal pattern is formed faces downward, the other of the two sheets is located at the bottom, and the surface on which the metal pattern is formed faces upward. Laminating to form a laminated sheet, forming external electrodes on one upper surface and the lower surface of the other of the two sheets so as to be connected to the metal pattern, and forming at least one side surface of the laminated sheet. Polishing and flattening, exposing a plurality of metal terminals connected to the metal pattern,
This is achieved by a method of manufacturing a module for a three-dimensional electronic component, wherein an external electrode is formed so as to be connected to the metal pattern.

According to the present invention, the obtained module for a three-dimensional electronic component includes a metal pattern formed on the upper surface of the uppermost sheet, the lower surface of the lowermost sheet, and at least one side sheet. By connecting a semiconductor component to the connected external electrode, a three-dimensional electronic component module can be configured, the semiconductor component can be mounted at a high density, and the semiconductor component is exposed on the outer surface,
Therefore, it is possible to efficiently dissipate heat generated from the semiconductor component, and to provide a high-density three-dimensional electronic component module that does not impair the cooling efficiency of the semiconductor component.

[0034] In a preferred embodiment of the present invention, the side faces of the laminated sheet are polished and flattened, and a plurality of metal terminals are exposed to form a laminated sheet having a prismatic structure.

According to a preferred embodiment of the present invention, there is provided a three-dimensional electronic component module in which the cross-section has a honeycomb structure or the like so that the cooling efficiency of semiconductor components is not impaired and the mounting density is greatly improved. It becomes possible.

In a further preferred embodiment of the present invention, the side surfaces of the laminated sheet are polished and flattened, and a plurality of metal terminals are exposed to form a hexahedral laminated sheet. .

In a further preferred embodiment of the present invention, the side surfaces of the laminated sheet are polished and flattened, and a plurality of metal terminals are exposed to form a laminated sheet having a rectangular parallelepiped structure. .

According to a further preferred embodiment of the present invention, since the semiconductor component can be connected to the six faces of the rectangular parallelepiped,
It is possible to greatly improve the mounting density of electronic components, and since the semiconductor components that generate heat are arranged at a distance of 90 degrees from each other, it is possible to suppress mutual thermal interference due to heat generation. Yes, furthermore, since the semiconductor components are mounted on each outer surface of the three-dimensional electronic component module,
The heat generated from the semiconductor component can be efficiently radiated.

In a further preferred embodiment of the present invention, the sheet is constituted by a green sheet containing alumina powder, glass powder and an organic binder.

According to a further preferred embodiment of the present invention, it is possible to obtain a three-dimensional electronic component module having a glass-ceramic substrate having excellent flatness and a low coefficient of thermal expansion. In addition, the stress can be reduced.

In a preferred embodiment of the present invention, the green sheets are laminated, pressed, baked, and turned into glass ceramic to form the laminated sheet.

In a further preferred embodiment of the present invention, the metal pattern is formed by printing, sputtering, plating and etching a metal selected from the group consisting of silver-palladium and silver on the green sheet. It is configured to be formed by means selected from the group consisting of:

In a further preferred embodiment of the present invention, the metal pattern is formed by printing a metal selected from the group consisting of silver-palladium and silver on the green sheet. . According to a further preferred embodiment of the present invention, at low cost,
It is possible to manufacture a module for a three-dimensional electronic component.

In a further preferred aspect of the present invention, the metal pattern is formed such that silver is formed on the green sheet by means selected from the group consisting of printing, sputtering, plating and etching. I have.

In a further preferred aspect of the present invention, the metal pattern is formed by printing silver on the green sheet. According to a further preferred embodiment of the present invention, a module for a three-dimensional electronic component can be manufactured at low cost.

In a further preferred embodiment of the present invention, the external electrode is made of a metal selected from the group consisting of silver-palladium and silver, on one upper surface and the other lower surface of the two green sheets, and on the laminated sheet. Is formed on the at least one polished side by means selected from the group consisting of printing, sputtering, plating and etching.

[0047] In a further preferred aspect of the present invention, the external electrode is made of a metal selected from the group consisting of silver-palladium and silver, on one upper surface and the other lower surface of the two green sheets, and on the laminated sheet. Is formed by printing on the at least one polished side of the slab. According to a further preferred embodiment of the present invention, a module for a three-dimensional electronic component can be manufactured at low cost.

In a further preferred embodiment of the present invention, the external electrode is provided with silver-palladium on one upper surface and the other lower surface of the two green sheets and on the at least one polished side surface of the laminated sheet. Further, it is configured to be formed by means selected from the group consisting of printing, sputtering, plating and etching.

In a further preferred embodiment of the present invention, the external electrode is provided with silver-palladium on one upper surface and the other lower surface of the two green sheets and on the at least one polished side surface of the laminated sheet. It is configured to be formed by printing. According to a further preferred embodiment of the present invention, a module for a three-dimensional electronic component can be manufactured at low cost.

In a further preferred embodiment of the present invention, the through hole is filled with a paste selected from the group consisting of silver paste, silver-palladium and gold paste.

In a further preferred embodiment of the present invention, the through holes are filled with a silver paste.

[0052] In still another preferred embodiment of the present invention, the sheet is constituted by an organic substrate. According to still another preferred embodiment of the present invention, a module for a three-dimensional electronic component can be manufactured at low cost.

In a further preferred embodiment of the present invention, the organic substrate is a glass-based epoxy substrate, a glass-based bismaleimide triazine substrate, a glass-based polyimide substrate, a glass-based polyphenylene ether substrate, and a glass-based fluorine substrate. And a substrate selected from the group consisting of:

In a further preferred aspect of the present invention, the organic substrate is bonded with a prepreg resin to form the laminated sheet.

[0055] In a further preferred aspect of the present invention, metal plating is applied to an inner surface of the through hole, at least one side surface of the laminated sheet is polished, and the through hole is vertically cut. An inner surface is exposed on the at least one side surface to form the external electrode.

According to a further preferred embodiment of the present invention, even if an organic substrate cannot be formed by printing silver-palladium, silver or the like due to a low melting point and forming an external electrode, at least one side surface has a desired shape. As described above, the external electrodes can be formed.

In a further preferred aspect of the present invention, the through hole exposed on the at least one side surface is filled with a eutectic solder.

[0058] In a further preferred aspect of the present invention, the metal plating is formed by copper plating.

In a further preferred embodiment of the present invention, the copper plating is further plated with a metal selected from the group consisting of gold plating, silver plating, nickel plating and gold plating. According to a further preferred embodiment of the present invention, oxidation of the electrode can be prevented.

In a further preferred embodiment of the present invention, the metal wiring is formed of a metal selected from copper, aluminum, silver, gold, platinum and palladium.

In a further preferred aspect of the present invention, the metal wiring is formed by plating copper.

The object of the present invention is also a method for manufacturing a three-dimensional electronic component module, wherein a semiconductor component is connected to the external electrode of the three-dimensional electronic component module manufactured by the manufacturing method. Achieved.

According to the present invention, the obtained three-dimensional electronic component module is connected to a metal pattern formed on the upper surface of the uppermost sheet, the lower surface of the lowermost sheet, and at least one side sheet. Since the semiconductor component is connected to the external electrode formed, the semiconductor component can be mounted at a high density, and the semiconductor component is exposed on the outer surface, so that heat generated from the semiconductor component is efficiently radiated. This makes it possible to provide a high-density three-dimensional electronic component module that does not impair the cooling efficiency of the semiconductor component.

In a preferred embodiment of the present invention, a eutectic cream solder is screen-printed on at least one side of the polished and flattened laminated sheet of the three-dimensional electronic component module, and the semiconductor component is mounted. Melting the eutectic cream solder in a reflow furnace, connecting the semiconductor component to an external electrode formed on the at least one side surface, and firing in a firing furnace to obtain a three-dimensional electron beam. The component module is manufactured.

In another preferred embodiment of the present invention, a flux is provided at a position corresponding to the external electrode on at least one side surface of the polished and flattened laminated sheet of the three-dimensional electronic component module. Screen printing, at a position corresponding to the external electrode, transferred a solder ball, mounted on the solder ball transferred the semiconductor component, heated in a reflow furnace, melted the solder ball, The three-dimensional electronic component module is manufactured by connecting the semiconductor component and the external electrode formed on the at least one side surface and firing in a firing furnace.

In still another preferred embodiment of the present invention, the three-dimensional electronic component module is polished,
At a position corresponding to the external electrode on at least one side surface of the flattened laminated sheet, a flux is screen-printed, a solder ball is transferred to a position corresponding to the flux of the semiconductor component, and the semiconductor component is transferred. Mounted on the external electrode so as to match the position of the external electrode formed on the at least one side surface, heated in a reflow furnace, and formed on the semiconductor component and the at least one side surface. The three-dimensional electronic component module is manufactured by connecting the external electrodes and firing in a firing furnace.

In still another preferred embodiment of the present invention, the three-dimensional electronic component module is polished,
A flux is screen-printed at a position corresponding to the external electrode on at least one side surface of the flattened laminated sheet, and the semiconductor component is attached to the at least one side by using a solder ball provided in the semiconductor component. To match the position of the external electrode formed on one side,
By mounting on the external electrode and heating in a reflow furnace to connect the semiconductor component and the external electrode formed on the at least one side surface, and firing in a firing furnace, the three-dimensional electron The component module is manufactured.

In a further preferred embodiment of the present invention, in the reflow furnace, a reflow peak temperature of 2
It is configured to be heated at 00 to 250 ° C. for 30 to 90 seconds.

In a further preferred aspect of the present invention, after the semiconductor component and the external electrode formed on the at least one side surface are connected, an epoxy sealing resin is further added to the semiconductor component and the at least one side. Filled between the external electrodes formed on the side surfaces, heated in a curing furnace to cure the epoxy sealing resin, the semiconductor component and the external electrodes formed on the at least one side surface By fixing, a three-dimensional electronic component module is manufactured.

According to a further preferred embodiment of the present invention, it is possible to improve the reliability of fixing and connecting semiconductor components.

In a further preferred aspect of the present invention, the epoxy sealing resin contains a filler.

According to a further preferred embodiment of the present invention, the moisture resistance of the epoxy sealing resin can be improved, and the hardness of the epoxy sealing resin can be adjusted as desired.

In a further preferred embodiment of the present invention, the filler is constituted by a silica filler.

In a further preferred embodiment of the present invention, the epoxy sealing resin is cured in the curing furnace at 130 to 180 ° C. for 1 to 4 hours.

In a further preferred embodiment of the present invention, in the firing furnace, at 550 to 650 ° C., 1.5 times
It is configured to heat for from 3 to 3 hours and then calcinate at 800 to 880 ° C. for 5 to 15 minutes.

In a further preferred embodiment of the present invention, the semiconductor component is constituted by a semiconductor component selected from the group consisting of a semiconductor bare chip, an FBGA and a semiconductor substrate on which electronic components are mounted.

In a further preferred aspect of the present invention, a printed wiring board is connected to the external electrodes.

[0078]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings.

FIG. 1 is a schematic exploded perspective view of a module for a three-dimensional electronic component according to a preferred embodiment of the present invention.
FIG. 2 is a schematic perspective view thereof.

As shown in FIG. 1, the module 1 for a three-dimensional electronic component has six glass plates having silver wirings 2 patterned on both sides and a plurality of through holes 3 penetrating the silver wirings 2. A ceramic substrate 4 is laminated, and further, on both sides thereof, silver wiring 2 is patterned on an inner surface,
The uppermost glass / ceramic substrate 4a and the lowermost glass / ceramic substrate 4b, in each of which a plurality of through holes 3 penetrating the silver wiring 2 are formed, are laminated to form a rectangular parallelepiped structure as a whole. In the through hole 3,
The silver paste 2a is filled. On the upper surface of the uppermost glass / ceramic substrate 4a, an external electrode 6 composed of silver-palladium wiring 5 is patterned by screen printing, and on the lower surface of the lowermost glass / ceramic substrate 4b, silver-palladium wiring 5 is formed by screen printing. External electrodes 7 are patterned. The external electrode 6 formed on the top surface of the three-dimensional electronic component module 1 is connected to the silver wiring 2 formed on the internal glass / ceramic substrate 4 via the via hole 3, and the three-dimensional electronic component module The external electrode 7 formed on the bottom surface of the substrate 1 is connected to the silver wiring 2 formed on the internal glass / ceramic substrate 4 via the via hole 3.

The four side surfaces of the three-dimensional electronic component module 1 are polished, and as shown in FIGS. 1 and 2, the external electrodes 8, 8, 8 composed of silver-palladium wirings 5 are patterned by screen printing. Silver wirings 2 patterned on both sides of each glass-ceramic substrate 4,
Silver wiring 2 patterned on the lower surface of uppermost glass / ceramic substrate 4a and lowermost glass / ceramic substrate 4b
Is connected to the end of the silver wiring 2 patterned on the upper surface of.

The external electrodes 6, 7, and 8 provide a plurality of terminals for connecting a package such as a semiconductor bare chip and FBGA, a printed wiring board, and the like.

According to this embodiment, the inside of each glass / ceramic substrate 4, 4a, 4b is wired by the silver wiring 2,
The silver wirings 2 formed on the plurality of glass-ceramic substrates 4, 4a, 4b are connected by through holes 3 formed on the respective glass-ceramic substrates 4, 4a, 4b, and further formed on six surfaces of a rectangular parallelepiped. External electrodes 6, 7, 8
In addition, since a package such as a semiconductor bare chip and a FBGA, a printed wiring board, and the like can be connected, the mounting density of electronic components can be greatly improved. In addition, semiconductor bare chips that generate heat, printed wiring boards on which packages such as FBGA and semiconductor components are mounted, and the like are arranged at 90 degrees from each other,
Mutual thermal interference due to heat generation can be suppressed, and furthermore, a package such as a semiconductor bare chip or FBGA or a printed wiring board on which a semiconductor component is mounted is mounted on each outer surface of the three-dimensional electronic component module 1. , Heat generated from printed wiring boards on which packages and semiconductor components such as semiconductor bare chips and FBGAs are mounted,
Heat can be efficiently dissipated. Also, on the board,
Since the glass-ceramic substrates 4, 4a and 4b are used, the flatness is excellent, the thermal expansion coefficient is low, and even if a package such as a semiconductor bare chip or FBGA or a printed wiring board on which a semiconductor component is mounted is used, the stress is reduced. Can be alleviated. Therefore, according to the present embodiment, it is possible to provide the three-dimensional electronic component module 1 having excellent heat dissipation efficiency while significantly increasing the mounting density.

FIG. 3 is a schematic exploded perspective view of a module for a three-dimensional electronic component according to another preferred embodiment of the present invention.

As shown in FIG. 3, the three-dimensional electronic component module 10 has six glass substrates in which copper wirings 11 are patterned on both sides and a plurality of through holes 12 penetrating the copper wirings 11 are formed. The uppermost glass substrate epoxy substrate 13a in which a material epoxy substrate 13 is laminated, and on both sides thereof, a copper wiring 11 is patterned on an inner surface and a plurality of through holes 3 penetrating the copper wiring 11 are formed, and a lowermost glass The base epoxy substrate 13b is laminated and adhered by the prepreg resin 14, and is configured to have a rectangular parallelepiped structure as a whole. External electrodes 15 are patterned on the upper surface of the uppermost glass substrate epoxy substrate 13a by copper wiring 11, and external electrodes 16 are patterned on the lower surface of the lowermost glass substrate epoxy substrate 13b by copper wiring 11. . The external electrode 15 formed on the top surface of the three-dimensional electronic component module 10 is connected to the internal glass substrate epoxy substrate 1 via the via hole 12.
The external electrodes 16 connected to the copper wirings 11 formed on the bases 3, 13 a and 13 b and formed on the bottom surface of the three-dimensional electronic component module 1 are connected via the via holes 12 to the internal glass base epoxy substrate 13, It is connected to the copper wiring 11 formed on 13a, 13b.

The four side surfaces of the three-dimensional electronic component module 10 are polished until the via holes 12 each having a shape obtained by cutting the cylindrical via holes 12 in half are exposed, as shown in FIG. A eutectic solder 18 is filled in the copper-plated via hole 12 to form the external electrode 1.
7, 17, 17 are formed.

The glass-based epoxy substrate 13 has a via hole 12 for forming the external electrodes 17, 17 and 17, and a glass substrate epoxy substrate 13 which does not have the via hole 12. External electrodes 1 at intervals
The external electrodes 1, 17, 17 are aligned so that
The thickness of the glass substrate epoxy substrate 13 having no via hole 12 for forming 7, 17, 17 and the thickness of the copper wiring 11 and the thickness of the prepreg resin 14 are selected.

The external electrodes 15, 16 and 17 provide a plurality of terminals for connecting packages such as semiconductor bare chips and FBGAs, printed wiring boards and the like.

According to this embodiment, the inside of each glass base epoxy board 13, 13a, 13b is wired by the copper wiring 11, and each glass base epoxy board 13, 13a, 13b
b, connecting between the copper wirings 11 formed on the plurality of glass base epoxy substrates 13, 13a, 13b, and further, external electrodes 15, 16 formed on six surfaces of the hexahedron. , 17 can be connected to a package such as a semiconductor bare chip or FBGA or a printed wiring board on which a semiconductor component is mounted, so that the mounting density of electronic components can be greatly improved. In addition, semiconductor bare chips that generate heat, printed wiring boards on which packages such as FBGA and semiconductor components are mounted, and the like are arranged at 90 degrees from each other, so that mutual thermal interference due to heat generation can be suppressed. At the same time, a semiconductor bare chip, a package such as FBGA, a printed wiring board, and the like are mounted on each outer surface of the three-dimensional electronic component module 10.
It is possible to efficiently radiate heat generated from a package such as a BGA or a printed wiring board on which semiconductor components are mounted. Further, since the glass base epoxy substrates 13, 13a and 13b are used as the substrates, the three-dimensional electronic component module 10 can be obtained at low cost. Therefore, according to the present embodiment, it is possible to provide the three-dimensional electronic component module 10 having excellent heat dissipation efficiency while significantly increasing the mounting density. In addition, it is possible to connect to a printed wiring board without using a connector.

FIG. 4 is a schematic perspective view of a three-dimensional electronic component module according to a preferred embodiment of the present invention.

As shown in FIG. 4, a three-dimensional electronic component module 20 according to a preferred embodiment of the present invention includes printed wiring on external electrodes 7 formed on the bottom surface of a rectangular parallelepiped three-dimensional electronic component module 1. The substrate 21 is connected, and the external electrode 8 formed on one side surface has an FBGA
22 is provided on the external electrode 8 formed on the other one side surface,
The semiconductor bare chip 23 has an external electrode 6 formed on the top surface.
In this example, a small substrate 25 on which a semiconductor component 24 is mounted is connected and configured by eutectic solder, and an electronic component is connected to external electrodes 8 formed on the other two side surfaces. Not.

The three-dimensional electronic component module 20 according to this embodiment has a rectangular parallelepiped shape, and the inside of each substrate 4 constituting the three-dimensional electronic component module 1 is wired by the silver-palladium wiring 2 and formed on each substrate 4. The silver-palladium wirings 2 of the plurality of substrates 4 are connected by through holes 3 filled with silver paste 2a, and the FBGA 22 and the semiconductor bare chip 23 are connected to the external electrodes 8 formed on the two side surfaces of the hexahedron. A small substrate 25 connected and having a semiconductor component 24 mounted on an external electrode 6 formed on the top surface
And the printed wiring board 21 is connected to the external electrodes 7 formed on the bottom surface, so that the mounting density can be greatly improved.
The printed wiring board 21 on which the semiconductor chip A22, the semiconductor bare chip 23, the small board 25, and the semiconductor components are mounted is arranged 90 degrees apart from each other, so that mutual thermal interference due to heat generation can be suppressed and the FBGA2
2. The small substrate 25 on which the semiconductor bare chip 23 and the semiconductor component 24 are mounted is a three-dimensional electronic component module 1, 10
, The heat generated from the printed wiring board 21 on which the FBGA 22, the semiconductor bare chip 23, the small board 25, and the semiconductor components are mounted can be efficiently radiated. Further, since the glass / ceramic substrates 4, 4a, 4b are used as the substrates,
Excellent flatness, low coefficient of thermal expansion, semiconductor bare chip,
Even when a package such as FBGA or a printed wiring board on which a semiconductor component is mounted is mounted, the stress can be reduced. Further, according to the present embodiment, it is possible to connect to the printed wiring board 21 without using a connector.

FIG. 5 is a schematic perspective view of a three-dimensional electronic component module according to another preferred embodiment of the present invention. As shown in FIG. 5, a three-dimensional electronic component module 30 according to a preferred embodiment of the present invention includes a printed wiring board 31 on external electrodes 16 formed on the bottom surface of a rectangular parallelepiped three-dimensional electronic component module 10. The FBGA 32 is connected to the external electrode 15 formed on the top surface and the external electrode 17 formed on the side surface.

The three-dimensional electronic component module 30 according to the present embodiment has a rectangular parallelepiped shape, and the inside of each substrate 13 constituting the three-dimensional electronic component module 10 is wired by the copper wiring 11 and formed on each substrate 13. The plated through-holes 12 allow the copper wiring 11 of the plurality of substrates 13 to be formed.
The FBGA 32 is connected to the external electrode 15 formed on the top surface of the hexahedron and the external electrode 17 formed on the side surface, and the external electrode 1 formed on the bottom surface is connected.
6, the printed wiring board 31 is connected, so that the mounting density can be greatly improved. On the other hand, the five FBGAs 32 that generate heat and the printed wiring board 31 on which the semiconductor components are mounted are at 90 degrees to each other. , The mutual thermal interference due to heat generation can be suppressed, and the FBGA 32 and the printed wiring board 31 are mounted on the outer surfaces of the three-dimensional electronic component modules 1 and 10, respectively. The heat generated from the printed wiring board 31 on which the FBGA 32 and the semiconductor components are mounted can be efficiently radiated. Further, as a substrate, a glass base epoxy substrate 13, 13a, 13
Since b is used, the three-dimensional electronic component module 10 can be obtained at low cost. Further, according to the present embodiment, it is possible to connect to the printed wiring board 21 without using a connector.

FIG. 6 is a schematic perspective view showing an example of an electronic component using the three-dimensional electronic component module according to the embodiment of the present invention.

As shown in FIG. 6, the electronic component includes four three-dimensional electronic component modules 40, 41, and 42 (one is not shown).
Printed circuit boards 43 and 44 are connected to external electrodes (not shown) formed on the top surfaces of 0, 41 and 42 and external electrodes (not shown) formed on the lower part, respectively. The three-dimensional electronic component module 40 has FBGAs 45 on four sides, and the three-dimensional electronic component module 41,
42 each have an FBGA 45 on only one side.
It has.

As in the electronic component shown in FIG. 6, according to the present invention, the three-dimensional electronic component modules 40, 41, 42
Even when the amount of heat generated from the semiconductor components mounted on the printed wiring board is large and sufficient heat cannot be dissipated by natural cooling, the four three-dimensional electronic component modules 40 and 41 are located between the printed wiring boards 43 and 44. , 42 are present at an interval, and thus, using a fan (not shown),
Cooling air is forcibly supplied between the printed wiring boards 43 and 44 to cool the three-dimensional electronic component modules 40, 41 and 4.
2 and the printed wiring boards 43 and 44 on which the semiconductor components are mounted can be cooled as desired.

FIG. 7 is a schematic perspective view showing another example of an electronic component using the three-dimensional electronic component module according to the embodiment of the present invention.

As shown in FIG. 7, the electronic component is composed of two three-dimensional electronic component modules 50, 5 connected to each other by external electrodes 8, 17 formed on the respective side surfaces.
1, two three-dimensional electronic component modules 50, 51
An external electrode (not shown) formed on the bottom surface of the printed wiring board 52 is connected to the printed wiring board 52. Further, FBGA 53 is connected to external electrodes (not shown) formed on the three side surfaces of the three-dimensional electronic component module 50 and the two side surfaces of the three-dimensional electronic component module 51. External substrates (not shown) formed on the top surface are connected to small substrates 55 on which semiconductor components 54 are mounted, respectively.

In the electronic component shown in FIG. 7, since the two three-dimensional electronic component modules 50 and 51 are connected to each other by external electrodes (not shown) formed on the side surfaces, the density is increased. On the other hand, the five FBGAs 53 that generate heat, the two small substrates 55, and the printed wiring board 52 on which the semiconductor components (not shown) are mounted are arranged at a distance of 90 degrees from each other. Can suppress mutual thermal interference by
FBGA 53, small board 55 and printed wiring board 5
2 is mounted on each outer surface of the three-dimensional electronic component modules 1 and 10, so that heat generated from the FBGA 32, the small substrate 55, and the printed wiring board 31 on which the semiconductor components are mounted is efficiently radiated. It becomes possible.
Therefore, according to the present invention, the mounting density of electronic components can be improved without impairing the cooling efficiency.

FIG. 8 is a schematic perspective view showing an example of use of a three-dimensional electronic component module according to a preferred embodiment of the present invention.

As shown in FIG. 8, a three-dimensional electronic component module 60 according to a preferred embodiment of the present invention has a flexible wiring board 61 connected to one of the external electrodes 8 and 17 formed on the side surface thereof. I have. As described above, in the three-dimensional electronic component module 60 according to the preferred embodiment of the present invention, the flexible wiring board 61 can be extended in a total of 12 directions, two on each surface, so that the external terminals can be drawn out. Flexible wiring board 61 in only one direction
As a result, the degree of freedom of wiring can be greatly improved as compared with a conventional laminated wiring board from which external terminals cannot be drawn out.

FIG. 9 is a schematic perspective view showing a method for inspecting a three-dimensional electronic component module according to a preferred embodiment of the present invention. As shown in FIG. 9, in the three-dimensional electronic component module 65, external electrodes (not shown) formed on the bottom surface are connected to the printed wiring board 66, and external electrodes (not shown) formed on the side surfaces. One of them is FBGA67,
The two are connected to the semiconductor bare chip 68, respectively, but the electronic components are not connected to the external electrodes 6, 15 formed on the top surface.

As the mounting density of the electronic components increases, it becomes more difficult to secure a space for connecting the probe for electrical inspection to the electronic components. However, in the three-dimensional electronic component module according to the present invention, as shown in FIG. In a state where the three-dimensional electronic component module 65 is mounted on the printed wiring board 66, the external electrodes 6, 15 formed on the top surface are
Then, by bringing the test probe 69 into contact, the operating state of not only the three-dimensional electronic component module 65 but also the peripheral circuits in the printed wiring board 66 can be inspected using a method such as a boundary scan. Become.
Therefore, according to the three-dimensional electronic component module of the present invention, it is possible to provide terminals for electrical inspection while enabling high-density mounting of electronic components.

The three-dimensional electronic component module 1 according to a preferred embodiment of the present invention can be manufactured as follows, similarly to a conventional glass / ceramic laminated substrate.

First, through holes 3 are formed in a green sheet containing alumina powder, glass powder and an organic binder by punching. Next, a silver paste is printed on the green sheet to form the silver wiring 2, and the silver paste 2 a is filled in the through hole 3.

Further, the green sheets thus obtained are stacked, and the green sheets are heated at 60 to 90 ° C. for 3 to 15 minutes, preferably at about 70 ° C. for about 10 minutes, for 5 to 1 minute.
Pressurize at a pressure of 0 kg / cm 2.

Then, it is placed in a firing furnace at 550 to 650 ° C. for 1.5 to 3 hours, preferably 600 to 650 ° C.
At 120 ° C. for about 120 minutes, the laminated green sheets are fired to obtain green sheets and silver pastes 2, 2.
a) decompose the binder contained therein and then at 800 to 880 ° C. for 5 to 15 minutes, preferably about 85
By firing at 0 ° C. for about 10 minutes, the green sheet is sintered to obtain a substantially rectangular parallelepiped ceramic structure.

Further, the side surface of the obtained ceramic structure is polished so as to be flat until the silver wiring 2 is exposed. Next, silver-palladium paste is screen-printed on the exposed side of the silver wiring 2 on one side surface of the ceramic structure to form the external electrode 8.

Further, drying is performed at 80 to 150 ° C. for 1 to 15 minutes, preferably at about 120 ° C. for about 5 minutes. Then, on another side of the ceramic structure,
The silver-palladium paste is screen-printed to form the external electrodes 6, 7, 8 and dried under the above conditions.

The steps of screen printing and drying the silver-palladium paste are repeated until the external electrodes 6, 7, 8 are formed on the desired surfaces of the ceramic structure, and finally, at 550 to 650 ° C. in a firing furnace. The ceramic structure is heated for 1.5 to 3 hours, preferably at about 600 ° C. for about 2 hours to decompose the binder,
5 to 15 minutes at 0 to 880 ° C., preferably 87
Firing at 5 ° C. for 10 minutes, FIG. 1 and FIG.
To obtain the three-dimensional electronic component module 1 shown in FIG.

By using the three-dimensional electronic component module 1 thus obtained, the following process is performed as shown in FIG.
Can be manufactured.

First, eutectic cream solder is screen-printed on the surface of the three-dimensional electronic component module 1 on which the FBGA 22 as a semiconductor component is mounted.

Next, the FBGA 22 was mounted and placed in a reflow furnace, and the reflow peak temperature was 200 to 250.
C. for 30 to 90 seconds, preferably at a reflow peak temperature of 210 to 230.degree. C. for 30 to 60 seconds to melt the eutectic cream solder 70,
The BGA 22 and the external electrodes 8 of the three-dimensional electronic component module 1 are connected by eutectic cream solder.

Thereafter, an epoxy sealing resin containing a silica filler is filled between the FBGA 22 and the external electrodes 8 of the three-dimensional electronic component module 1 in order to secure the reliability of the FBGA 22 and the solder connection. 1 in the curing oven
At 30 to 180 ° C. for 1 to 4 hours, preferably
By heating at about 150 ° C. for about 2 hours to cure the epoxy sealing resin, the FBGA 22 is fixed to the external electrodes 8 of the three-dimensional electronic component module 1.

Here, the epoxy sealing resin containing a silica filler is used because by filling the epoxy sealing resin with the silica filler, the moisture resistance of the epoxy sealing resin can be improved and the epoxy sealing resin can be used. This is for adjusting the hardness of the resin as desired.

Next, the eutectic cream solder 70 is screen-printed on the surface of the three-dimensional electronic component module 1 on which the semiconductor bare chip 23 as a semiconductor component is mounted, and the eutectic cream solder is heated and melted. Then, the semiconductor bare chip 23 and the external electrode 8 of the three-dimensional electronic component module 1 are connected by eutectic cream solder, and an epoxy sealing resin containing silica filler is applied to the outside of the semiconductor bare chip 23 and the three-dimensional electronic component module 1. The semiconductor bare chip 23 is fixed to the external electrodes 8 of the three-dimensional electronic component module 1 by filling the space between the electrodes 8 and the epoxy sealing resin by heating to cure the epoxy sealing resin.

Further, the semiconductor component 24
A eutectic cream solder is screen-printed on the surface of the three-dimensional electronic component module 1 on which the small substrate 25 on which the small substrate 25 is mounted is mounted, and the eutectic cream solder is heated and melted. 1 is connected to the external electrode 6 by eutectic cream solder, and an epoxy sealing resin containing silica filler is filled between the small substrate 25 and the external electrode 6 of the three-dimensional electronic component module 1 and heated. Curing the epoxy sealing resin,
Is fixed to the external electrodes 8 of the three-dimensional electronic component module 1.

Thereafter, the three-dimensional electronic component module 1 to which the FBGA 22, the semiconductor bare chip 23 and the small substrate 25 are fixed is placed in a firing furnace, and the temperature is set at 550 to 650 ° C.
1.5 hours to 3 hours, preferably at about 600 ° C.
After heating for 2 hours to decompose the binder,
Firing at 800-880 ° C. for 5-15 minutes, preferably at 875 ° C. for 10 minutes.

Thus, the three-dimensional electronic component module 20 on which the small board 25 on which the FBGA 22, the semiconductor bare chip 23 and the semiconductor component 24 are mounted is manufactured.

Also, using the three-dimensional electronic component module 1 shown in FIGS. 1 and 2, the three-dimensional electronic component module 20 shown in FIG. 4 can be manufactured as follows.

First, a flux is printed at a position corresponding to the external electrode 8 of the three-dimensional electronic component module 1 by a screen printing method.

Next, a tin-lead solder ball having a eutectic composition is transferred to a position corresponding to the external electrode 8 using a hole transfer machine. As a result, the solder ball adheres to the flux printed in advance at the position corresponding to the external electrode 8, and the solder ball is transferred. A solder ball having an appropriate ball diameter is selected according to the pitch of the external electrodes 8. For example, when the pitch of the external electrodes 8 is 0.5 mm, the ball diameter is 0.05 to 0.5 mm.
It is desirable to transfer a 35 mmφ solder ball.
Solder balls having a thickness of 0.05 mm or less are difficult to manufacture.
When a solder ball having a length of 35 mm or more is transferred, a bridge easily occurs between the transferred solder balls, which is not preferable.

Next, the FBGA 22 was mounted on the transferred solder ball and placed in a reflow furnace at a reflow peak temperature of 200 to 250 ° C. for 30 to 90 seconds.
Preferably, at a reflow peak temperature of 210 to 230 ° C,
The solder ball is melted by heating for 30 to 60 seconds, and the FBGA 22 and the external electrode 8 of the three-dimensional electronic component module 1 are connected by the solder ball.

Thereafter, in the same manner as in the first embodiment, the epoxy sealing resin containing the silica filler was replaced with FB.
GA22 and external electrode 8 of three-dimensional electronic component module 1
Between 130 and 180 ° C. in a curing oven
Heating for 1 to 4 hours, preferably at about 150 ° C. for about 2 hours, to cure the epoxy encapsulating resin,
The FBGA 22 is fixed to the external electrodes 8 of the three-dimensional electronic component module 1.

Similarly, a flux is printed at a position corresponding to the external electrode 8 of the three-dimensional electronic component module 1 on which the semiconductor bare chip 23 as a semiconductor component is mounted, and a solder ball is bonded to the flux. After transferring the solder ball, the semiconductor bare chip 23 is mounted on the surface of the transferred solder ball, placed in a reflow furnace, heated to melt the solder ball, and the semiconductor bare chip 23 and the module for three-dimensional electronic components are transferred. One external electrode 8
And are connected by solder balls. Further, in the same manner as in the first embodiment, an epoxy sealing resin containing a silica filler is filled between the semiconductor bare chip 23 and the external electrode 8 of the three-dimensional electronic component module 1, and the mixture is placed in a curing furnace. At 130 to 180 ° C. for 1 to 4 hours,
Preferably, heating is performed at about 150 ° C. for about 2 hours to cure the epoxy sealing resin,
3 is fixed to the external electrode 8 of the three-dimensional electronic component module 1.

Further, the FBGA 22 and the semiconductor bare chip 23 are connected to the external electrodes 8 of the three-dimensional electronic component module 1.
The small substrate 25 on which the semiconductor components 24 are mounted is fixed to the external electrodes 8 formed on the other surface of the module for three-dimensional electronic components 1 in exactly the same manner as that for fixing the three-dimensional electronic components.

Thereafter, the FBGA 22, the semiconductor bare chip 23 and the small substrate 25 are fixed to the three-dimensional electronic component module 1 in a firing furnace in exactly the same manner as in the first embodiment shown in FIG. , 1.5
After heating for about 3 hours, preferably about 600 ° C. for 2 hours to decompose the binder, at 800-880 ° C. for 5-15 minutes, preferably 875 ° C.
Bake for 10 minutes.

Thus, the three-dimensional electronic component module 20 on which the small board 25 on which the FBGA 22, the semiconductor bare chip 23, and the semiconductor component 24 are mounted is manufactured.

Further, using the three-dimensional electronic component module 1 shown in FIG. 1 and FIG.
The three-dimensional electronic component module 20 shown in FIG. 4 can also be manufactured.

First, a flux is printed at a position corresponding to the external electrode 8 of the three-dimensional electronic component module 1 of the FBGA 22 by a screen printing method. Then, FBG
A22 is mounted on the external electrode 8 of the three-dimensional electronic component module 1 so as to match the position of the external electrode.
The solder balls formed on the GA 22 are bonded to the flux.

Thereafter, the module 1 for a three-dimensional electronic component on which the FBGA 22 is mounted is placed in a reflow furnace at a reflow peak temperature of 200 to 250.degree. At a reflow peak temperature of 210 to 230 ° C. for 3 seconds
The solder ball is melted by heating for 0 to 60 seconds, and the FBGA 22 and the external electrode 8 of the three-dimensional electronic component module 1 are connected by the solder ball.

Next, in the same manner as in the first embodiment, the epoxy sealing resin containing the silica filler was
GA22 and external electrode 8 of three-dimensional electronic component module 1
Between 130 and 180 ° C. in a curing oven
Heating for 1 to 4 hours, preferably at about 150 ° C. for about 2 hours, to cure the epoxy encapsulating resin,
The FBGA 22 is fixed to the external electrodes 8 of the three-dimensional electronic component module 1.

When the semiconductor bare chip 23 is mounted, since no solder ball is provided, the three-dimensional electronic component module 1 on which the semiconductor bare chip 23 is to be mounted is mounted.
Flux is printed by a screen printing method at a position corresponding to the external electrode 8 of the semiconductor bare chip 2.
The solder ball is transferred to a position corresponding to the flux No. 3. After that, the semiconductor bare chip 23 is mounted at a position corresponding to the external electrode 8 of the three-dimensional electronic component module 1, placed in a reflow furnace, heated to melt the solder balls, and the semiconductor bare chip 23 and the three-dimensional electronic component are mounted. The external electrodes 8 of the module 1 are connected by solder balls.

As in the case of the semiconductor bare chip 23, the small substrate 25 on which the semiconductor components 24 are mounted is fixed to the external electrodes 8 formed on the other surface of the three-dimensional electronic component module 1.

Then, the FBGA 22, the semiconductor bare chip 23, and the module 1 for a three-dimensional electronic component to which the small substrate 25 is fixed are placed in a firing furnace at 550 to 650 ° C. in exactly the same manner as the first embodiment. , 1.5
After heating for about 3 hours, preferably about 600 ° C. for 2 hours to decompose the binder, at 800-880 ° C. for 5-15 minutes, preferably 875 ° C.
Bake for 10 minutes.

Thus, the three-dimensional electronic component module 20 on which the small board 25 on which the FBGA 22, the semiconductor bare chip 23 and the semiconductor component 24 are mounted is manufactured.

A three-dimensional electronic component module 10 according to another preferred embodiment of the present invention can be manufactured as follows, similarly to a conventional organic laminated substrate.

First, the glass base epoxy substrates 13 and 13
Through holes 12 are formed in a and 13b, and copper plating 12a is applied to the inner surfaces of the through holes 12. Further, copper wirings 11 are formed on both surfaces of the glass base epoxy substrate 13 by plating.

Next, a glass base epoxy substrate 13a,
13b, copper wiring 11 is formed on one surface by plating, and copper is plated on the other surface, and external electrodes 15, 16 are formed.
To form

Further, a plurality of glass-based epoxy substrates 1
3, the glass-based epoxy substrates 13a and 13b, the glass-based epoxy substrate 13a is at the top, the glass-based epoxy substrate 13b is at the bottom, and a plurality of glass-based epoxy substrates 13 are located therebetween; The external electrodes 16 formed on the glass-based epoxy substrate 13b face downward, and the external electrodes 15 formed on the glass-based epoxy substrate 13a.
So that the prepreg resin 14 is sandwiched between
The layers are stacked and pressed in a heated state to form a substantially rectangular parallelepiped laminated substrate.

Next, the side surface of the laminated substrate is polished until the via hole 12 is exposed and the via hole 12 becomes semi-cylindrical. The plurality of glass base epoxy substrates 13
Glass-based epoxy substrates 13 having via holes 12 exposed in a semi-cylindrical shape, and glass-based epoxy substrates 13 having no via holes 12 exposed in a semi-cylindrical shape are alternately laminated.

Finally, as shown in FIG. 3, the eutectic solder 18 is filled in the semi-cylindrical via hole 12,
Forming the external electrode 17 and the module 1 for three-dimensional electronic components
Get 0.

Here, a glass base having no via hole 12 exposed in a semi-cylindrical shape is formed so that the interval between the electrodes of the electronic component connected to the external electrode 17 and the interval between the electrodes of the external electrode 17 match. Thickness of material epoxy board 13, copper wiring 1
1 and the thickness of the prepreg resin 14 are selected.

The present invention is not limited to the above embodiments, and various modifications can be made within the scope of the invention described in the claims, and these are also included in the scope of the present invention. It goes without saying that it is a thing.

For example, in the embodiment, the three-dimensional electronic component modules 1 and 10 have a rectangular parallelepiped shape.
1, 42, 50, 51, 60, and 65 also form a rectangular parallelepiped, but it is not always necessary that they have a rectangular parallelepiped shape. At least three or more flat outer surfaces such as a honeycomb structure are formed. If it is a three-dimensional structure, its shape is not particularly limited.

Further, in the embodiment shown in FIG. 4, the module 1 for three-dimensional electronic components is used, but the module 10 for three-dimensional electronic components is used in place of the module 1 for three-dimensional electronic components. You may.

In the embodiment shown in FIG. 5, the three-dimensional electronic component module 10 is used, but instead of the three-dimensional electronic component module 10, the three-dimensional electronic component module 1 is used. You may.

Further, in the embodiment shown in FIGS. 1 and 2, silver wiring 2 is provided on both surfaces of each glass-ceramic substrate 4 and on the inner surfaces of uppermost glass-ceramic substrate 4a and lowermost glass-ceramic substrate 4b. The external electrodes 6 and 7 are patterned on the upper surface of the uppermost glass-ceramic substrate 4a, the lower surface of the lowermost glass-ceramic substrate 4b, and the four polished side surfaces of the three-dimensional electronic component module 1 by silver-palladium wiring 2. , 8, 8, and 8 are patterned. Even if the silver-palladium wiring 2 is patterned on both surfaces of each glass-ceramic substrate 4 and on the inner surfaces of the uppermost glass-ceramic substrate 4a and the lowermost glass-ceramic substrate 4b. In addition, the external electrodes 6, 7, 8, 8, and 8 can be patterned by the silver wiring 2.

In the embodiment shown in FIGS. 1 and 2, the silver wiring 2 and the silver-palladium wiring 2 are patterned by printing.
The silver wiring 2 and the silver-palladium wiring 2 can be patterned by sputtering, plating, etching, or the like.

Further, in the embodiment shown in FIGS. 1 and 2, the silver paste 2a is filled in the through holes 3, but instead of the silver paste 2a, a silver-palladium paste or a gold paste is used. It may be filled.

In the above embodiment, when manufacturing the three-dimensional electronic component module 20, the FBGA
Semiconductor components such as a semiconductor substrate 22, a semiconductor bare chip 23, and a small substrate 25 on which the semiconductor components 24 are mounted are connected to the external electrodes 6, 7, and 8 of the three-dimensional electronic component module 1 using eutectic cream solder and solder balls. However, the semiconductor component can be connected to the external electrodes 6, 7, and 8 of the three-dimensional electronic component module 1 using an anisotropic conductive film.

Further, in the embodiment shown in FIG. 3, the glass-based epoxy substrates 13, 13a and 13b are used, but instead of the glass-based epoxy substrate, a glass-based bismaleimide triazine substrate and a glass-based epoxy substrate are used. Organic substrates such as a substrate polyimide substrate, a glass substrate polyphenylene ether substrate, and a glass substrate fluorine substrate can also be used.

In the embodiment shown in FIG. 3, copper plating 12a is applied to the inner surface of through hole 12, but in addition to copper plating 12a, gold plating or silver plating is applied on copper plating 12a. Alternatively, nickel plating may be performed on the copper plating 12a, and subsequently, gold plating may be performed.

Further, in the embodiment shown in FIG. 3, the copper wiring 11 is formed by plating on the glass base epoxy substrates 13, 13a and 13b. The copper wiring 11 can be formed by bonding the copper wiring 11 on the surface 13b.

In the above embodiment, the FBGA
22, the semiconductor bare chip 23, the reliability of the fixation and connection of the semiconductor component between the semiconductor component such as the small substrate 25 on which the semiconductor component 24 is mounted and the external electrode 8 formed on the side surface of the three-dimensional electronic component module 1. In order to improve the epoxy sealing resin containing silica filler, in a curing furnace at 130 to 180 ° C. for 1 to 4 hours,
Preferably, the FBGA 22 is heated at about 150 ° C. for about 2 hours to cure the epoxy sealing resin and fix the FBGA 22 to the external electrodes 8 of the three-dimensional electronic component module 1. It is not always necessary to fill and cure the sealing resin between the semiconductor component and the external electrode 8 formed on the side surface of the three-dimensional electronic component module 1.

Further, in the above embodiment, the FBG
A22, a semiconductor bare chip 23, a semiconductor component such as a small substrate 25 on which a semiconductor component 24 is mounted, and an external electrode 8 formed on a side surface of the three-dimensional electronic component module 1.
Epoxy sealing resin containing silica filler is filled, but it is not necessary that epoxy sealing resin contains silica filler, and instead of silica, aluminum nitride with excellent thermal conductivity is filled. It may be included as a material. Further, when it is not necessary to improve the moisture resistance of the epoxy sealing resin and adjust the hardness, it is not always necessary that the epoxy sealing resin contains a filler.

In the third embodiment for manufacturing the three-dimensional electronic component module 1, the FBGA is formed on the side surface of the three-dimensional electronic component module 1 by using the solder balls formed on the FBGA. The FBGA is formed on the side surface of the three-dimensional electronic component module 1 by transferring the solder ball to a position corresponding to the flux on the side surface of the three-dimensional electronic component module 1 while being connected to the external electrode 8. It may be connected to the external electrode 8.

[0159]

According to the present invention, it is possible to provide a high-density module for a three-dimensional electronic component, a three-dimensional electronic component module, and a method for manufacturing the same, without impairing the cooling efficiency of the semiconductor component.

Further, according to the present invention, it is possible to provide a module for a three-dimensional electronic component, a three-dimensional electronic component module, and a method for manufacturing the same, which can greatly improve the degree of freedom of wiring.

Further, according to the present invention, the higher the mounting density of electronic components, the more difficult it is to secure a space for connecting an electrical inspection probe to the electronic components. While enabling a simple implementation
It is possible to provide a three-dimensional electronic component module capable of providing a terminal for electrical inspection and a method for manufacturing the same.

[Brief description of the drawings]

FIG. 1 is a schematic exploded perspective view of a module for a three-dimensional electronic component according to a preferred embodiment of the present invention.

FIG. 2 is a schematic perspective view of a module for a three-dimensional electronic component according to a preferred embodiment of the present invention.

FIG. 3 is a schematic exploded perspective view of a module for a three-dimensional electronic component according to another preferred embodiment of the present invention.

FIG. 4 is a schematic perspective view of a three-dimensional electronic component module according to a preferred embodiment of the present invention.

FIG. 5 is a schematic perspective view of a three-dimensional electronic component module according to another preferred embodiment of the present invention.

FIG. 6 is a schematic perspective view showing an example of an electronic component using the three-dimensional electronic component module according to the embodiment of the present invention.

FIG. 7 is a schematic perspective view showing another example of an electronic component using the three-dimensional electronic component module according to the embodiment of the present invention.

FIG. 8 is a schematic perspective view showing a usage example of the three-dimensional electronic component module according to the embodiment of the present invention.

FIG. 9 is a schematic perspective view showing a method for inspecting a three-dimensional electronic component module according to a preferred embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 3D electronic component module 2 Silver wiring 3 Through hole 4 Glass-ceramic substrate 4a Uppermost glass-ceramic substrate 4b Lowermost glass-ceramic substrate 5 Silver-palladium wiring 6,7,8 External electrode 10 Module for 3D electronic components DESCRIPTION OF SYMBOLS 11 Copper wiring 12 Through hole 13 Glass base epoxy board 13a Uppermost glass base epoxy board 13b Lowermost glass base epoxy board 14 Prepreg resin 15, 16, 17 External electrode 18 Eutectic solder 20 Three-dimensional electronic component module 21 Print wiring Substrate 22 FBGA 23 Semiconductor bare chip 24 Semiconductor component 25 Small substrate 30 Three-dimensional electronic component module 31 Printed wiring board 32 FBGA 40, 41, 42 Three-dimensional electronic component module 43, 44 Printed wiring board 45 FBGA 50, 51 3D electronic component module 52 Printed wiring board 53 FBGA 54 Semiconductor component 55 Small board 60 3D electronic component module 61 Flexible wiring board 65 3D electronic component module 66 Printed wiring board 67 FBGA 68 Semiconductor bare chip 69 Test probe

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 1/18 H05K 1/18 T 5E346 3/34 507 3/34 507C 3/46 3/46 L N / / H05K 3/40 3/40 K F term (reference) 4E351 AA03 AA04 AA07 AA13 BB01 BB21 BB31 BB33 BB35 BB47 BB49 CC01 CC05 CC12 CC22 DD04 DD05 DD06 DD10 DD20 EE01 GG04 GG07 GG11 5E317 AA04 BB02 BB23 CC22 CC25 CC31 CC52 CD21 CD27 CD32. CC34 CC37 CC38 CC39 CC40 DD23 EE09 EE29 FF07 FF09 FF18 FF19 GG09 GG17 GG22 GG28 HH07 HH31

Claims (61)

[Claims] 1. A metal wiring is patterned on both sides,
A plurality of substrates formed with a plurality of via holes and / or through holes penetrating the metal wiring are laminated to form a three-dimensional structure in which three or more flat outer surfaces are formed. A three-dimensional electronic component module, wherein an external electrode connected to a metal wiring is formed. 2. The three-dimensional electronic component module according to claim 1, wherein the three-dimensional structure has a prismatic structure. 3. The module for a three-dimensional electronic component according to claim 2, wherein the three-dimensional structure is a hexahedron. 4. The three-dimensional electronic component module according to claim 3, wherein the three-dimensional structure is a rectangular parallelepiped. 5. The three-dimensional electronic component module according to claim 1, wherein the substrate is formed of a glass-ceramic substrate. 6. The three-dimensional electronic component module according to claim 5, wherein the metal wiring is formed of a metal selected from the group consisting of silver-palladium and silver. 7. The module for a three-dimensional electronic component according to claim 6, wherein the metal wiring is formed of silver. 8. The three-dimensional electronic component module according to claim 5, wherein the metal terminal is formed of a metal selected from the group consisting of silver-palladium and silver. 9. The module for a three-dimensional electronic component according to claim 8, wherein the metal terminal is formed of silver-palladium. 10. The method according to claim 5, wherein the via hole and / or the through hole is filled with a paste selected from the group consisting of a silver paste, a silver-palladium paste and a gold paste. Or 1
Item 3. The module for a three-dimensional electronic component according to item 1. 11. The three-dimensional electronic component module according to claim 10, wherein a silver paste is filled in the via hole and / or the through hole. 12. The three-dimensional electronic component module according to claim 1, wherein the substrate is formed of an organic substrate. 13. A substrate selected from the group consisting of a glass-based epoxy substrate, a glass-based bismaleimide triazine substrate, a glass-based polyimide substrate, a glass-based polyphenylene ether substrate, and a glass-based fluorine substrate. The three-dimensional electronic component module according to claim 12, wherein the module is configured by: 14. An inner surface of the via hole and / or the through hole is plated with metal, and a part of the via hole and / or the through hole is cut vertically to be exposed on the outer surface, and the external electrode is formed. 14. The three-dimensional electronic component module according to claim 12, wherein the module is formed. 15. The three-dimensional electronic component module according to claim 14, wherein the metal plating is copper plating. 16. The method according to claim 15, wherein the copper plating is further plated with a metal selected from the group consisting of gold plating, silver plating, nickel plating and gold plating. Module for three-dimensional electronic components. 17. The method according to claim 17, wherein the metal wiring is copper, aluminum,
The module for a three-dimensional electronic component according to any one of claims 12 to 16, wherein the module is formed of a metal selected from silver, gold, platinum, and palladium. 18. The module according to claim 17, wherein the metal wiring is formed by plating copper. 19. A three-dimensional electronic component module, wherein a semiconductor component is connected to the external electrode of the three-dimensional electronic component module according to claim 1. Description: 20. The method according to claim 20, wherein the semiconductor component is formed by soldering.
20. The external electrode is connected to the external electrode.
3. The three-dimensional electronic component module according to 1. 21. The three-dimensional electronic component module according to claim 20, wherein the semiconductor component is connected to the external electrode by eutectic cream solder. 22. The tertiary device according to claim 19, wherein the semiconductor component is constituted by a semiconductor component selected from the group consisting of a semiconductor bare chip, an FBGA, and a semiconductor substrate on which electronic components are mounted. Original electronic component module. 23. A printed wiring board connected to external electrodes formed on at least one of the three or more flat outer surfaces.
The three-dimensional electronic component module according to any one of the above. 24. A method comprising: forming at least one through hole in each of a plurality of sheets; forming a metal pattern on both surfaces of the plurality of sheets; and forming at least one through hole in each of the two sheets. Forming a metal pattern on both surfaces on one surface of the two sheets, forming the plurality of sheets and the two sheets, one of the two sheets being positioned at an uppermost position, and forming the metal pattern The two sheets are laminated so that the surface faces downward and the other of the two sheets is located at the bottom, and the surface on which the metal pattern is formed faces upward. External electrodes are formed on one upper surface and the other lower surface of the laminated sheet so as to be connected to the metal pattern, and at least one side surface of the laminated sheet is polished and flattened; A method for manufacturing a module for a three-dimensional electronic component, comprising: exposing a plurality of metal terminals connected to the metal pattern; and forming an external electrode so as to be connected to the metal pattern. 25. The laminated sheet having a prismatic structure, wherein the side surfaces of the laminated sheet are polished and flattened, and a plurality of metal terminals are exposed.
5. The method for manufacturing a three-dimensional electronic component module according to item 4. 26. The three-dimensional electronic device according to claim 25, wherein a side surface of the laminated sheet is polished and flattened, and a plurality of metal terminals are exposed to form a laminated sheet having a hexahedral structure. Manufacturing method for component module. 27. The three-dimensional electron device according to claim 26, wherein a side surface of the laminated sheet is polished and flattened, and a plurality of metal terminals are exposed to form a laminated sheet having a rectangular parallelepiped structure. Manufacturing method for component module. 28. The three-dimensional electronic component module according to claim 24, wherein the sheet is formed of a green sheet containing alumina powder, glass powder, and an organic binder. Manufacturing method. 29. The module for a three-dimensional electronic component according to claim 28, wherein the green sheets are laminated, pressed, and fired to form a glass-ceramic to form the laminated sheet. Manufacturing method. 30. The metal pattern is formed by forming a metal selected from the group consisting of silver-palladium and silver on the green sheet by means selected from the group consisting of printing, sputtering, plating and etching. 30. The method for manufacturing a three-dimensional electronic component module according to claim 28, wherein: 31. The three-dimensional electron according to claim 30, wherein the metal pattern is formed by printing a metal selected from the group consisting of silver-palladium and silver on the green sheet. Manufacturing method for component module. 32. The three-dimensional pattern according to claim 30, wherein the metal pattern is formed on the green sheet by means of silver, by means selected from the group consisting of printing, sputtering, plating and etching. Manufacturing method of electronic component module. 33. The method for manufacturing a three-dimensional electronic component module according to claim 32, wherein the metal pattern is formed by printing silver on the green sheet. 34. The external electrode is made of a metal selected from the group consisting of silver-palladium and silver, the upper surface of one of the two green sheets and the lower surface of the other, and the at least one of the laminated sheets being polished. On the side,
The method for manufacturing a three-dimensional electronic component module according to any one of claims 28 to 33, wherein the module is formed by means selected from the group consisting of printing, sputtering, plating, and etching. 35. The external electrode is formed by polishing a metal selected from the group consisting of silver-palladium and silver on one upper surface and the other lower surface of the two green sheets and the at least one polished surface of the laminated sheet. 4. The printing method according to claim 3, wherein the printing is performed by printing on the side surface.
5. The method for manufacturing a three-dimensional electronic component module according to item 4. 36. The external electrode comprising silver-palladium,
34. Formed by means selected from the group consisting of printing, sputtering, plating and etching on one upper surface and the other lower surface of the two green sheets and on the at least one polished side surface of the laminated sheet. 3. The method for manufacturing a module for a three-dimensional electronic component according to claim 1. 37. The external electrode is made of silver-palladium,
The three-dimensional electronic component according to claim 33, wherein the two green sheets are formed by printing on one upper surface and the other lower surface of the two green sheets and the at least one polished side surface of the laminated sheet. Module manufacturing method. 38. A silver paste in the through hole,
38. The method for manufacturing a module for a three-dimensional electronic component according to claim 28, wherein a paste selected from the group consisting of silver-palladium and gold pastes is filled. 39. The method for manufacturing a module for a three-dimensional electronic component according to claim 38, wherein a silver paste is filled in the through holes. 40. The method for manufacturing a module for a three-dimensional electronic component according to claim 24, wherein the sheet is formed of an organic substrate. 41. A substrate selected from the group consisting of a glass-based epoxy substrate, a glass-based bismaleimide triazine substrate, a glass-based polyimide substrate, a glass-based polyphenylene ether substrate, and a glass-based fluorine substrate. The method for manufacturing a module for a three-dimensional electronic component according to claim 40, wherein: 42. The method for manufacturing a three-dimensional electronic component module according to claim 40, wherein the organic substrate is bonded with a prepreg resin to form the laminated sheet. 43. A metal plating is applied to an inner surface of the through hole, at least one side surface of the laminated sheet is polished, the through hole is vertically cut, and an inner surface of the through hole is placed on the at least one side surface. Exposed to
43. The method for manufacturing a module for a three-dimensional electronic component according to claim 40, wherein the external electrode is formed. 44. The method according to claim 43, wherein the inside of the through hole exposed on the at least one side surface is filled with a eutectic solder. 45. The method for manufacturing a three-dimensional electronic component module according to claim 43, wherein the metal plating is formed by copper plating. 46. The three-dimensional electronic component according to claim 45, wherein the copper plating is plated with a metal selected from the group consisting of gold plating, silver plating, nickel plating and gold plating. Method of manufacturing a module for a vehicle. 47. The method according to claim 47, wherein the metal wiring is made of copper, aluminum,
The method for manufacturing a three-dimensional electronic component module according to any one of claims 40 to 46, wherein the method is formed of a metal selected from silver, gold, platinum, and palladium. 48. The method for manufacturing a three-dimensional electronic component module according to claim 47, wherein the metal wiring is formed by plating copper. 49. A method of manufacturing a three-dimensional electronic component module, comprising connecting a semiconductor component to the external electrode of the three-dimensional electronic component module manufactured by the method according to claim 24. . 50. A eutectic cream solder is screen-printed on at least one side of the polished and flattened laminated sheet of the three-dimensional electronic component module, the semiconductor component is mounted, and the semiconductor component is mounted in a reflow furnace. 50. The three-dimensional structure according to claim 49, wherein the eutectic cream solder is melted, the semiconductor component is connected to an external electrode formed on the at least one side surface, and firing is performed in a firing furnace. Manufacturing method of electronic component module. 51. A flux is screen-printed at a position corresponding to the external electrode on at least one side surface of the polished and flattened laminated sheet of the three-dimensional electronic component module, and the flux is applied to the external electrode. To a position where the solder ball is transferred, mounted on the solder ball to which the semiconductor component is transferred, and in a reflow furnace,
50. The tertiary according to claim 49, wherein the solder ball is heated to melt the solder ball, the semiconductor component is connected to an external electrode formed on the at least one side surface, and fired in a firing furnace. Original electronic component module manufacturing method. 52. A screen is printed with a flux at a position corresponding to the external electrode on at least one side surface of the polished and flattened laminated sheet of the three-dimensional electronic component module, and the flux of the semiconductor component is formed. In a position corresponding to the above, the solder ball is transferred, the semiconductor component is mounted on the external electrode so as to match the position of the external electrode formed on the at least one side surface, and in a reflow furnace, 50. Heating to connect the semiconductor component and the external electrode formed on the at least one side surface, and firing in a firing furnace.
3. The method for manufacturing a three-dimensional electronic component module according to claim 1. 53. A screen printing of a flux at a position corresponding to the external electrode on at least one side surface of the polished and flattened laminated sheet of the three-dimensional electronic component module, wherein the semiconductor component is provided. Utilizing a solder ball, the semiconductor component is mounted on the external electrode so as to match the position of the external electrode formed on the at least one side surface, and heated in a reflow furnace, 50. The method for manufacturing a three-dimensional electronic component module according to claim 49, wherein the semiconductor component and an external electrode formed on the at least one side surface are connected and fired in a firing furnace. 54. The three-dimensional electronic component according to claim 50, wherein heating is performed in the reflow furnace at a reflow peak temperature of 200 to 250 ° C. for 30 to 90 seconds. Module manufacturing method. 55. After connecting the semiconductor component and an external electrode formed on the at least one side surface,
Filling an epoxy sealing resin between the semiconductor component and the external electrode formed on the at least one side surface, and heating in a curing furnace to cure the epoxy sealing resin;
6. The semiconductor device according to claim 5, wherein the semiconductor component and the external electrode formed on the at least one side surface are fixed.
The method for manufacturing a three-dimensional electronic component module according to any one of Items 0 to 54. 56. The method for manufacturing a three-dimensional electronic component module according to claim 55, wherein said epoxy sealing resin contains a filler. 57. The method for manufacturing a three-dimensional electronic component module according to claim 56, wherein the filler is a silica filler. 58. In the curing oven, 130 to 180.
58. The method of claim 55, wherein the epoxy encapsulating resin is cured at a temperature of 1 to 4 hours.
The method for manufacturing a three-dimensional electronic component module according to any one of the above. 59. 550 to 650 in said firing furnace
The tertiary substance according to any one of claims 50 to 58, wherein the tertiary substance is heated at 1.5C for 1.5 to 3 hours, and further calcined at 800 to 880C for 5 to 15 minutes. Original electronic component module manufacturing method. 60. The semiconductor device according to claim 49, wherein the semiconductor component is constituted by a semiconductor component selected from the group consisting of a semiconductor bare chip, an FBGA, and a semiconductor substrate on which an electronic component is mounted. Item 13. The method for producing a three-dimensional electronic component module according to item 9. 61. The method for manufacturing a three-dimensional electronic component module according to claim 49, wherein a printed wiring board is connected to said external electrode.