JPS5818821A - 可撓性の薄型キ−ボ−ドスイツチ部材の製造方法 - Google Patents
可撓性の薄型キ−ボ−ドスイツチ部材の製造方法Info
- Publication number
- JPS5818821A JPS5818821A JP56117525A JP11752581A JPS5818821A JP S5818821 A JPS5818821 A JP S5818821A JP 56117525 A JP56117525 A JP 56117525A JP 11752581 A JP11752581 A JP 11752581A JP S5818821 A JPS5818821 A JP S5818821A
- Authority
- JP
- Japan
- Prior art keywords
- spacer
- contact
- circuit
- keyboard switch
- particle size
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 18
- 239000000758 substrate Substances 0.000 claims description 48
- 125000006850 spacer group Chemical group 0.000 claims description 43
- 229920002379 silicone rubber Polymers 0.000 claims description 22
- 239000004945 silicone rubber Substances 0.000 claims description 21
- 239000002245 particle Substances 0.000 claims description 17
- 238000007639 printing Methods 0.000 claims description 17
- 239000000725 suspension Substances 0.000 claims description 17
- 239000007788 liquid Substances 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 229920001084 poly(chloroprene) Polymers 0.000 claims description 13
- 229920006267 polyester film Polymers 0.000 claims description 12
- 238000007650 screen-printing Methods 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- 239000002356 single layer Substances 0.000 claims description 9
- 239000006229 carbon black Substances 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 239000011230 binding agent Substances 0.000 claims description 6
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 5
- 229920001225 polyester resin Polymers 0.000 claims description 5
- 239000004645 polyester resin Substances 0.000 claims description 5
- 230000005484 gravity Effects 0.000 claims description 4
- 229920001971 elastomer Polymers 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 239000005060 rubber Substances 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- 229920005992 thermoplastic resin Polymers 0.000 claims description 2
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims 3
- 101100298295 Drosophila melanogaster flfl gene Proteins 0.000 claims 1
- 239000001293 FEMA 3089 Substances 0.000 claims 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims 1
- 239000003925 fat Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 15
- 238000010438 heat treatment Methods 0.000 description 10
- 229920001296 polysiloxane Polymers 0.000 description 7
- 229920005749 polyurethane resin Polymers 0.000 description 7
- 239000005011 phenolic resin Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 229920002635 polyurethane Polymers 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- -1 tele Chemical compound 0.000 description 2
- 101100008047 Caenorhabditis elegans cut-3 gene Proteins 0.000 description 1
- 229920003261 Durez Polymers 0.000 description 1
- 206010040007 Sense of oppression Diseases 0.000 description 1
- 238000010073 coating (rubber) Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 125000006838 isophorone group Chemical group 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Manufacture Of Switches (AREA)
- Push-Button Switches (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56117525A JPS5818821A (ja) | 1981-07-27 | 1981-07-27 | 可撓性の薄型キ−ボ−ドスイツチ部材の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56117525A JPS5818821A (ja) | 1981-07-27 | 1981-07-27 | 可撓性の薄型キ−ボ−ドスイツチ部材の製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63146942A Division JPH01105422A (ja) | 1988-06-16 | 1988-06-16 | 可撓性の薄型キーボードスイッチ部材の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5818821A true JPS5818821A (ja) | 1983-02-03 |
| JPH0239054B2 JPH0239054B2 (enrdf_load_stackoverflow) | 1990-09-04 |
Family
ID=14713933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56117525A Granted JPS5818821A (ja) | 1981-07-27 | 1981-07-27 | 可撓性の薄型キ−ボ−ドスイツチ部材の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5818821A (enrdf_load_stackoverflow) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52134657U (enrdf_load_stackoverflow) * | 1976-04-05 | 1977-10-13 | ||
| JPS5659340A (en) * | 1979-10-20 | 1981-05-22 | Nippon Kokuen Kogyo Kk | Preparation of keyboard for electronic desk computer |
-
1981
- 1981-07-27 JP JP56117525A patent/JPS5818821A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52134657U (enrdf_load_stackoverflow) * | 1976-04-05 | 1977-10-13 | ||
| JPS5659340A (en) * | 1979-10-20 | 1981-05-22 | Nippon Kokuen Kogyo Kk | Preparation of keyboard for electronic desk computer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0239054B2 (enrdf_load_stackoverflow) | 1990-09-04 |
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