JPS58186994A - 印刷配線板の製造方法 - Google Patents

印刷配線板の製造方法

Info

Publication number
JPS58186994A
JPS58186994A JP6905282A JP6905282A JPS58186994A JP S58186994 A JPS58186994 A JP S58186994A JP 6905282 A JP6905282 A JP 6905282A JP 6905282 A JP6905282 A JP 6905282A JP S58186994 A JPS58186994 A JP S58186994A
Authority
JP
Japan
Prior art keywords
insulating substrate
protective film
grooves
holes
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6905282A
Other languages
English (en)
Japanese (ja)
Other versions
JPH035078B2 (enrdf_load_stackoverflow
Inventor
森広　喜之
安達　光平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP6905282A priority Critical patent/JPS58186994A/ja
Publication of JPS58186994A publication Critical patent/JPS58186994A/ja
Publication of JPH035078B2 publication Critical patent/JPH035078B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP6905282A 1982-04-23 1982-04-23 印刷配線板の製造方法 Granted JPS58186994A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6905282A JPS58186994A (ja) 1982-04-23 1982-04-23 印刷配線板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6905282A JPS58186994A (ja) 1982-04-23 1982-04-23 印刷配線板の製造方法

Publications (2)

Publication Number Publication Date
JPS58186994A true JPS58186994A (ja) 1983-11-01
JPH035078B2 JPH035078B2 (enrdf_load_stackoverflow) 1991-01-24

Family

ID=13391406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6905282A Granted JPS58186994A (ja) 1982-04-23 1982-04-23 印刷配線板の製造方法

Country Status (1)

Country Link
JP (1) JPS58186994A (enrdf_load_stackoverflow)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010064602A1 (ja) 2008-12-02 2010-06-10 パナソニック電工株式会社 回路基板の製造方法、及び前記製造方法により得られた回路基板
JP2011029494A (ja) * 2009-07-28 2011-02-10 Panasonic Electric Works Co Ltd 回路基板、及び前記回路基板の製造方法
JP2011049294A (ja) * 2009-08-26 2011-03-10 Panasonic Electric Works Co Ltd 回路基板の製造方法、及び前記製造方法により得られた回路基板
WO2011052211A1 (ja) 2009-10-30 2011-05-05 パナソニック電工株式会社 回路基板及び回路基板に部品が実装された半導体装置
EP2469990A2 (en) 2008-04-30 2012-06-27 Panasonic Corporation Method of producing ciruit board by additive method, and circuit board and multilayer circuit board obtained by the method
US8240036B2 (en) 2008-04-30 2012-08-14 Panasonic Corporation Method of producing a circuit board
US8272126B2 (en) 2008-04-30 2012-09-25 Panasonic Corporation Method of producing circuit board
US8698003B2 (en) 2008-12-02 2014-04-15 Panasonic Corporation Method of producing circuit board, and circuit board obtained using the manufacturing method
US9082438B2 (en) 2008-12-02 2015-07-14 Panasonic Corporation Three-dimensional structure for wiring formation
US9332642B2 (en) 2009-10-30 2016-05-03 Panasonic Corporation Circuit board

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4825864A (enrdf_load_stackoverflow) * 1971-08-11 1973-04-04
JPS4881061A (enrdf_load_stackoverflow) * 1972-02-03 1973-10-30
JPS50113856U (enrdf_load_stackoverflow) * 1974-02-27 1975-09-17
JPS5187772A (ja) * 1975-01-30 1976-07-31 Toshiro Yamada Mudenkaimetsukiniokeru purintobannoseizohoho
JPS5267998A (en) * 1975-12-04 1977-06-06 Fujitsu Ltd Printing wiring method
JPS52151866A (en) * 1976-04-22 1977-12-16 Circuit Wise Inc Circuit substrate and method of forming same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4825864A (enrdf_load_stackoverflow) * 1971-08-11 1973-04-04
JPS4881061A (enrdf_load_stackoverflow) * 1972-02-03 1973-10-30
JPS50113856U (enrdf_load_stackoverflow) * 1974-02-27 1975-09-17
JPS5187772A (ja) * 1975-01-30 1976-07-31 Toshiro Yamada Mudenkaimetsukiniokeru purintobannoseizohoho
JPS5267998A (en) * 1975-12-04 1977-06-06 Fujitsu Ltd Printing wiring method
JPS52151866A (en) * 1976-04-22 1977-12-16 Circuit Wise Inc Circuit substrate and method of forming same

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2469990A2 (en) 2008-04-30 2012-06-27 Panasonic Corporation Method of producing ciruit board by additive method, and circuit board and multilayer circuit board obtained by the method
US8240036B2 (en) 2008-04-30 2012-08-14 Panasonic Corporation Method of producing a circuit board
US8272126B2 (en) 2008-04-30 2012-09-25 Panasonic Corporation Method of producing circuit board
EP2592912A1 (en) 2008-04-30 2013-05-15 Panasonic Corporation Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the method
US9332650B2 (en) 2008-04-30 2016-05-03 Panasonic Corporation Method of producing multilayer circuit board
US9082438B2 (en) 2008-12-02 2015-07-14 Panasonic Corporation Three-dimensional structure for wiring formation
WO2010064602A1 (ja) 2008-12-02 2010-06-10 パナソニック電工株式会社 回路基板の製造方法、及び前記製造方法により得られた回路基板
US8698003B2 (en) 2008-12-02 2014-04-15 Panasonic Corporation Method of producing circuit board, and circuit board obtained using the manufacturing method
JP2011029494A (ja) * 2009-07-28 2011-02-10 Panasonic Electric Works Co Ltd 回路基板、及び前記回路基板の製造方法
JP2011049294A (ja) * 2009-08-26 2011-03-10 Panasonic Electric Works Co Ltd 回路基板の製造方法、及び前記製造方法により得られた回路基板
WO2011052211A1 (ja) 2009-10-30 2011-05-05 パナソニック電工株式会社 回路基板及び回路基板に部品が実装された半導体装置
US9332642B2 (en) 2009-10-30 2016-05-03 Panasonic Corporation Circuit board
US8929092B2 (en) 2009-10-30 2015-01-06 Panasonic Corporation Circuit board, and semiconductor device having component mounted on circuit board
US9351402B2 (en) 2009-10-30 2016-05-24 Panasonic Corporation Circuit board, and semiconductor device having component mounted on circuit board

Also Published As

Publication number Publication date
JPH035078B2 (enrdf_load_stackoverflow) 1991-01-24

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