JPS58186994A - 印刷配線板の製造方法 - Google Patents
印刷配線板の製造方法Info
- Publication number
- JPS58186994A JPS58186994A JP6905282A JP6905282A JPS58186994A JP S58186994 A JPS58186994 A JP S58186994A JP 6905282 A JP6905282 A JP 6905282A JP 6905282 A JP6905282 A JP 6905282A JP S58186994 A JPS58186994 A JP S58186994A
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- protective film
- grooves
- holes
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 13
- 239000000758 substrate Substances 0.000 claims description 40
- 230000004913 activation Effects 0.000 claims description 17
- 230000001681 protective effect Effects 0.000 claims description 14
- 238000007747 plating Methods 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims 2
- 238000003754 machining Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 17
- 238000007772 electroless plating Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 4
- 239000002985 plastic film Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6905282A JPS58186994A (ja) | 1982-04-23 | 1982-04-23 | 印刷配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6905282A JPS58186994A (ja) | 1982-04-23 | 1982-04-23 | 印刷配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58186994A true JPS58186994A (ja) | 1983-11-01 |
| JPH035078B2 JPH035078B2 (enrdf_load_stackoverflow) | 1991-01-24 |
Family
ID=13391406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6905282A Granted JPS58186994A (ja) | 1982-04-23 | 1982-04-23 | 印刷配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58186994A (enrdf_load_stackoverflow) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010064602A1 (ja) | 2008-12-02 | 2010-06-10 | パナソニック電工株式会社 | 回路基板の製造方法、及び前記製造方法により得られた回路基板 |
| JP2011029494A (ja) * | 2009-07-28 | 2011-02-10 | Panasonic Electric Works Co Ltd | 回路基板、及び前記回路基板の製造方法 |
| JP2011049294A (ja) * | 2009-08-26 | 2011-03-10 | Panasonic Electric Works Co Ltd | 回路基板の製造方法、及び前記製造方法により得られた回路基板 |
| WO2011052211A1 (ja) | 2009-10-30 | 2011-05-05 | パナソニック電工株式会社 | 回路基板及び回路基板に部品が実装された半導体装置 |
| EP2469990A2 (en) | 2008-04-30 | 2012-06-27 | Panasonic Corporation | Method of producing ciruit board by additive method, and circuit board and multilayer circuit board obtained by the method |
| US8240036B2 (en) | 2008-04-30 | 2012-08-14 | Panasonic Corporation | Method of producing a circuit board |
| US8272126B2 (en) | 2008-04-30 | 2012-09-25 | Panasonic Corporation | Method of producing circuit board |
| US8698003B2 (en) | 2008-12-02 | 2014-04-15 | Panasonic Corporation | Method of producing circuit board, and circuit board obtained using the manufacturing method |
| US9082438B2 (en) | 2008-12-02 | 2015-07-14 | Panasonic Corporation | Three-dimensional structure for wiring formation |
| US9332642B2 (en) | 2009-10-30 | 2016-05-03 | Panasonic Corporation | Circuit board |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4825864A (enrdf_load_stackoverflow) * | 1971-08-11 | 1973-04-04 | ||
| JPS4881061A (enrdf_load_stackoverflow) * | 1972-02-03 | 1973-10-30 | ||
| JPS50113856U (enrdf_load_stackoverflow) * | 1974-02-27 | 1975-09-17 | ||
| JPS5187772A (ja) * | 1975-01-30 | 1976-07-31 | Toshiro Yamada | Mudenkaimetsukiniokeru purintobannoseizohoho |
| JPS5267998A (en) * | 1975-12-04 | 1977-06-06 | Fujitsu Ltd | Printing wiring method |
| JPS52151866A (en) * | 1976-04-22 | 1977-12-16 | Circuit Wise Inc | Circuit substrate and method of forming same |
-
1982
- 1982-04-23 JP JP6905282A patent/JPS58186994A/ja active Granted
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4825864A (enrdf_load_stackoverflow) * | 1971-08-11 | 1973-04-04 | ||
| JPS4881061A (enrdf_load_stackoverflow) * | 1972-02-03 | 1973-10-30 | ||
| JPS50113856U (enrdf_load_stackoverflow) * | 1974-02-27 | 1975-09-17 | ||
| JPS5187772A (ja) * | 1975-01-30 | 1976-07-31 | Toshiro Yamada | Mudenkaimetsukiniokeru purintobannoseizohoho |
| JPS5267998A (en) * | 1975-12-04 | 1977-06-06 | Fujitsu Ltd | Printing wiring method |
| JPS52151866A (en) * | 1976-04-22 | 1977-12-16 | Circuit Wise Inc | Circuit substrate and method of forming same |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2469990A2 (en) | 2008-04-30 | 2012-06-27 | Panasonic Corporation | Method of producing ciruit board by additive method, and circuit board and multilayer circuit board obtained by the method |
| US8240036B2 (en) | 2008-04-30 | 2012-08-14 | Panasonic Corporation | Method of producing a circuit board |
| US8272126B2 (en) | 2008-04-30 | 2012-09-25 | Panasonic Corporation | Method of producing circuit board |
| EP2592912A1 (en) | 2008-04-30 | 2013-05-15 | Panasonic Corporation | Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the method |
| US9332650B2 (en) | 2008-04-30 | 2016-05-03 | Panasonic Corporation | Method of producing multilayer circuit board |
| US9082438B2 (en) | 2008-12-02 | 2015-07-14 | Panasonic Corporation | Three-dimensional structure for wiring formation |
| WO2010064602A1 (ja) | 2008-12-02 | 2010-06-10 | パナソニック電工株式会社 | 回路基板の製造方法、及び前記製造方法により得られた回路基板 |
| US8698003B2 (en) | 2008-12-02 | 2014-04-15 | Panasonic Corporation | Method of producing circuit board, and circuit board obtained using the manufacturing method |
| JP2011029494A (ja) * | 2009-07-28 | 2011-02-10 | Panasonic Electric Works Co Ltd | 回路基板、及び前記回路基板の製造方法 |
| JP2011049294A (ja) * | 2009-08-26 | 2011-03-10 | Panasonic Electric Works Co Ltd | 回路基板の製造方法、及び前記製造方法により得られた回路基板 |
| WO2011052211A1 (ja) | 2009-10-30 | 2011-05-05 | パナソニック電工株式会社 | 回路基板及び回路基板に部品が実装された半導体装置 |
| US8929092B2 (en) | 2009-10-30 | 2015-01-06 | Panasonic Corporation | Circuit board, and semiconductor device having component mounted on circuit board |
| US9332642B2 (en) | 2009-10-30 | 2016-05-03 | Panasonic Corporation | Circuit board |
| US9351402B2 (en) | 2009-10-30 | 2016-05-24 | Panasonic Corporation | Circuit board, and semiconductor device having component mounted on circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH035078B2 (enrdf_load_stackoverflow) | 1991-01-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4775611A (en) | Additive printed circuit boards with flat surface and indented primary wiring conductors | |
| US4770900A (en) | Process and laminate for the manufacture of through-hole plated electric printed-circuit boards | |
| JPH0310239B2 (enrdf_load_stackoverflow) | ||
| US7169313B2 (en) | Plating method for circuitized substrates | |
| JPS58186994A (ja) | 印刷配線板の製造方法 | |
| JPH04100294A (ja) | プリント配線板の製造方法 | |
| US5922517A (en) | Method of preparing a substrate surface for conformal plating | |
| JPH08186373A (ja) | プリント配線板の製造方法 | |
| JPH06334311A (ja) | 回路体の製造方法 | |
| JPH04286389A (ja) | 回路基板の製造方法 | |
| JPH077264A (ja) | 印刷配線板の製造方法 | |
| JPS62156898A (ja) | スル−ホ−ルプリント配線板の製造方法 | |
| JPH118465A (ja) | アディティブ法プリント配線板の製造方法 | |
| JPS58186993A (ja) | 印刷配線板の製造方法 | |
| JPS613494A (ja) | プリント板製造方法 | |
| JPS62599B2 (enrdf_load_stackoverflow) | ||
| JPH07321461A (ja) | 印刷配線板の製造方法 | |
| JPH0336319B2 (enrdf_load_stackoverflow) | ||
| JPS59106191A (ja) | スル−ホ−ルを有する配線基板製造方法 | |
| CA1198524A (en) | Process of manufacturing printed wiring boards and printed wiring boards manufactured by the same | |
| JPS5846698A (ja) | プリント配線板の製造方法 | |
| JPS63131595A (ja) | 印刷配線板の製造方法 | |
| JPH02119298A (ja) | 半導体素子搭載用多層印刷配線板の製造方法 | |
| JPS6115393A (ja) | プリント配線板の製造方法 | |
| JPS63128789A (ja) | 印刷配線板の製造方法 |