JPS58178543A - 電子回路用基体の製造方法 - Google Patents

電子回路用基体の製造方法

Info

Publication number
JPS58178543A
JPS58178543A JP6209782A JP6209782A JPS58178543A JP S58178543 A JPS58178543 A JP S58178543A JP 6209782 A JP6209782 A JP 6209782A JP 6209782 A JP6209782 A JP 6209782A JP S58178543 A JPS58178543 A JP S58178543A
Authority
JP
Japan
Prior art keywords
electronic circuit
pattern
leads
piece
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6209782A
Other languages
English (en)
Japanese (ja)
Other versions
JPS641059B2 (enrdf_load_stackoverflow
Inventor
Kuniharu Noda
野田　邦治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Narumi China Corp
Original Assignee
Narumi China Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Narumi China Corp filed Critical Narumi China Corp
Priority to JP6209782A priority Critical patent/JPS58178543A/ja
Publication of JPS58178543A publication Critical patent/JPS58178543A/ja
Publication of JPS641059B2 publication Critical patent/JPS641059B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for individual devices of subclass H10D
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP6209782A 1982-04-13 1982-04-13 電子回路用基体の製造方法 Granted JPS58178543A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6209782A JPS58178543A (ja) 1982-04-13 1982-04-13 電子回路用基体の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6209782A JPS58178543A (ja) 1982-04-13 1982-04-13 電子回路用基体の製造方法

Publications (2)

Publication Number Publication Date
JPS58178543A true JPS58178543A (ja) 1983-10-19
JPS641059B2 JPS641059B2 (enrdf_load_stackoverflow) 1989-01-10

Family

ID=13190202

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6209782A Granted JPS58178543A (ja) 1982-04-13 1982-04-13 電子回路用基体の製造方法

Country Status (1)

Country Link
JP (1) JPS58178543A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS641059B2 (enrdf_load_stackoverflow) 1989-01-10

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