JPS58175641U - 半導体部品の取付装置 - Google Patents

半導体部品の取付装置

Info

Publication number
JPS58175641U
JPS58175641U JP1982073148U JP7314882U JPS58175641U JP S58175641 U JPS58175641 U JP S58175641U JP 1982073148 U JP1982073148 U JP 1982073148U JP 7314882 U JP7314882 U JP 7314882U JP S58175641 U JPS58175641 U JP S58175641U
Authority
JP
Japan
Prior art keywords
elastic piece
semiconductor component
power transistor
heatsink
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982073148U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6228768Y2 (enrdf_load_stackoverflow
Inventor
充彦 徳田
浩一 三浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1982073148U priority Critical patent/JPS58175641U/ja
Publication of JPS58175641U publication Critical patent/JPS58175641U/ja
Application granted granted Critical
Publication of JPS6228768Y2 publication Critical patent/JPS6228768Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1982073148U 1982-05-18 1982-05-18 半導体部品の取付装置 Granted JPS58175641U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982073148U JPS58175641U (ja) 1982-05-18 1982-05-18 半導体部品の取付装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982073148U JPS58175641U (ja) 1982-05-18 1982-05-18 半導体部品の取付装置

Publications (2)

Publication Number Publication Date
JPS58175641U true JPS58175641U (ja) 1983-11-24
JPS6228768Y2 JPS6228768Y2 (enrdf_load_stackoverflow) 1987-07-23

Family

ID=30082673

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982073148U Granted JPS58175641U (ja) 1982-05-18 1982-05-18 半導体部品の取付装置

Country Status (1)

Country Link
JP (1) JPS58175641U (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0730223A (ja) * 1993-07-07 1995-01-31 Nippon Antenna Co Ltd 放熱器付きｉｃ取り付け構造及び取り付け金具
JP2009158632A (ja) * 2007-12-26 2009-07-16 Keihin Corp パワードライブユニット
JP2013021083A (ja) * 2011-07-08 2013-01-31 Tdk Corp 電子部品の固定用ばね具及び放熱構造体
JP2014016026A (ja) * 2012-06-13 2014-01-30 Toyota Industries Corp 板ばねおよび放熱装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0730223A (ja) * 1993-07-07 1995-01-31 Nippon Antenna Co Ltd 放熱器付きｉｃ取り付け構造及び取り付け金具
JP2009158632A (ja) * 2007-12-26 2009-07-16 Keihin Corp パワードライブユニット
JP2013021083A (ja) * 2011-07-08 2013-01-31 Tdk Corp 電子部品の固定用ばね具及び放熱構造体
JP2014016026A (ja) * 2012-06-13 2014-01-30 Toyota Industries Corp 板ばねおよび放熱装置

Also Published As

Publication number Publication date
JPS6228768Y2 (enrdf_load_stackoverflow) 1987-07-23

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